Semiconductor device
A semiconductor device includes a semiconductor layer made of SiC. A transistor element having an impurity region is formed in a front surface portion of the semiconductor layer. A first contact wiring is formed on a back surface portion of the semiconductor layer, and defines one electrode electrically connected to the transistor element. The first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer and having a resistivity lower than that of the first wiring layer.
1. A method of manufacturing a semiconductor device, comprising:
a first step of forming a carbon layer on a surface of a first conductivity type SiC semiconductor layer which has a source forming region and a body forming region, the source forming region containing first conductivity type ions selectively implanted into a surface portion of the body forming region, and the body forming region containing second conductivity type ions selectively implanted into a surface portion of the SiC semiconductor layer;
a second step of forming a second conductivity type body region at the surface portion of the SiC semiconductor layer, of forming a first conductivity type source region at the surface portion of the second conductivity type body region, and of forming a first conductivity type drain region at a rear surface side of the SiC semiconductor layer with respect to the second conductivity type body region, by annealing the SiC semiconductor layer on which the carbon layer is formed, and activating ions inside the body forming region and the source forming region;
a third step of removing the carbon layer and forming a gate oxide film on the surface of the SiC semiconductor layer; and
a step of forming a gate trench so as to penetrate the source forming region and the body forming region from the surface of the SiC semiconductor layer before the first step, wherein
the third step includes a step of forming the gate oxide film on an inner surface of the gate trench such that a ratio (a first thickness/a second thickness) of the first thickness of a portion located on a bottom surface of the gate trench to the second thickness of a portion located on a side surface of the gate trench is 0.3 to 1.0.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the third step is performed in gas containing at least one of NO and N 2 O.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein the first step includes a step of forming an organic material layer on the surface of the SiC semiconductor layer and altering the organic material layer into the carbon layer by heating the organic material layer.
4. The method of manufacturing a semiconductor device according to claim 3 , wherein a polyimide is used as the organic material layer.
5. The method of manufacturing a semiconductor device according to claim 1 , further comprising a step of embedding a polysilicon into the gate trench until the gate trench is filled up with the polysilicon.
6. The method of manufacturing a semiconductor device according to claim 5 , further comprising a step of performing an etchback to partially remove the polysilicon until an etchback surface of the polysilicon is flush with the surface of the SiC semiconductor layer.
7. A method of manufacturing a semiconductor device, comprising:
a first step of forming a carbon layer on a surface of a first conductivity type SiC semiconductor layer which has a source forming region and a body forming region, the source forming region containing first conductivity type ions selectively implanted into a surface portion of the body forming region, and the body forming region containing second conductivity type ions selectively implanted into a surface portion of the SiC semiconductor layer;
a second step of forming a second conductivity type body region at the surface portion of the SiC semiconductor layer, of forming a first conductivity type source region at the surface portion of the second conductivity type body region, and of forming a first conductivity type drain region at a rear surface side of the SiC semiconductor layer with respect to the second conductivity type body region, by annealing the SiC semiconductor layer on which the carbon layer is formed, and activating ions inside the body forming region and the source forming region;
a third step of removing the carbon layer and forming a gate oxide film on the surface of the SiC semiconductor layer; and
a step of forming a source contact wiring so as to form an ohmic contact with the source region, wherein
the step of forming the source contact wiring includes a step of forming a polysilicon layer at a contact portion between the source region and the source contact wiring.
8. The method of manufacturing a semiconductor device according to claim 7 , further comprising a step of forming a source trench so as to penetrate the source forming region and the body forming region from the surface of the SiC semiconductor layer before the first step.
9. The method of manufacturing a semiconductor device according to claim 8 , wherein the step of forming the source contact wiring includes a step of embedding the polysilicon layer into the source trench until the source trench is filled up with the polysilicon layer.
10. The method of manufacturing a semiconductor device according to claim 7 , further comprising a step of implanting at least one of a first conductivity type impurities or a second conductivity impurities into the polysilicon layer.
11. A method of manufacturing a semiconductor device, comprising:
a first step of forming a carbon layer on a surface of a first conductivity type SiC semiconductor layer which has a source forming region and a body forming region, the source forming region containing first conductivity type ions selectively implanted into a surface portion of the body forming region, and the body forming region containing second conductivity type ions selectively implanted into a surface portion of the SiC semiconductor layer;
a second step of forming a second conductivity type body region at the surface portion of the SiC semiconductor layer, of forming a first conductivity type source region at the surface portion of the second conductivity type body region, and of forming a first conductivity type drain region at a rear surface side of the SiC semiconductor layer with respect to the second conductivity type body region, by annealing the SiC semiconductor layer on which the carbon layer is formed, and activating ions inside the body forming region and the source forming region; and
a third step of removing the carbon layer and forming a gate oxide film on the surface of the SiC semiconductor layer, wherein the third step includes a step of forming the gate oxide film such that a nitrogen content in the gate oxide film is 0.1 to 10%.
12. A method of manufacturing a semiconductor device, comprising:
a first step of forming a carbon layer on a surface of a first conductivity type SiC semiconductor layer which has a source forming region and a body forming region, the source forming region containing first conductivity type ions selectively implanted into a surface portion of the body forming region, and the body forming region containing second conductivity type ions selectively implanted into a surface portion of the SiC semiconductor layer;
a second step of forming a second conductivity type body region at the surface portion of the SiC semiconductor layer, of forming a first conductivity type source region at the surface portion of the second conductivity type body region, and of forming a first conductivity type drain region at a rear surface side of the SiC semiconductor layer with respect to the second conductivity type body region, by annealing the SiC semiconductor layer on which the carbon layer is formed, and activating ions inside the body forming region and the source forming region; and
a third step of removing the carbon layer and forming a gate oxide film on the surface of the SiC semiconductor layer, wherein
the first step includes a step of forming an organic material layer on the surface of the SiC semiconductor layer and altering the organic material layer into the carbon layer by heating the organic material layer,
the third step includes a step of oxidizing and removing the carbon layer by introducing oxygen-containing gas and forming the gate oxide film by oxidizing the surface of the SiC semiconductor layer, and
the first step, the second step and the third step are continuously performed in a single resistance heating furnace without removing the SiC semiconductor layer from the heating furnace.
13. A method of manufacturing a semiconductor device, comprising:
a first step of forming a carbon layer on a surface of a first conductivity type SiC semiconductor layer which has a source forming region and a body forming region, the source forming region containing first conductivity type ions selectively implanted into a surface portion of the body forming region, and the body forming region containing second conductivity type ions selectively implanted into a surface portion of the SiC semiconductor layer;
a second step of forming a second conductivity type body region at the surface portion of the SiC semiconductor layer, of forming a first conductivity type source region at the surface portion of the second conductivity type body region, and of forming a first conductivity type drain region at a rear surface side of the SiC semiconductor layer with respect to the second conductivity type body region, by annealing the SiC semiconductor layer on which the carbon layer is formed, and activating ions inside the body forming region and the source forming region; and
a third step of removing the carbon layer and forming a gate oxide film on the surface of the SiC semiconductor layer, wherein
the first step includes a step of forming an organic material layer on the surface of the SiC semiconductor layer and altering the organic material layer into the carbon layer by heating the organic material layer, and
the step of altering the organic material layer into the carbon layer includes a step of holding a heating temperature of the organic material layer at a first temperature for a first predetermined time.
14. The method of manufacturing a semiconductor device according to claim 13 , wherein the second step includes a step of holding the heating temperature at a second temperature higher than the first temperature for a second predetermined time.
15. The method of manufacturing a semiconductor device according to claim 13 further comprising a step of forming a gate trench so as to penetrate the source forming region and the body forming region from the surface of the SiC semiconductor layer before the first step.
16. The method of manufacturing a semiconductor device according to claim 14 further comprising a step of forming a gate trench so as to penetrate the source forming region and the body forming region from the surface of the SiC semiconductor layer before the first step.