Flexible interposer
An interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly includes a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within the flexible base layer, and at least one first patterned contact layer, provided on any one of the first surface and the second surface of the flexible base layer and which is configured to operably interface with the at least one active electronic circuit component and the at least one 1C component.
1. An interposer subassembly configured for an electronic system having at least one integrated circuit (IC) component, the interposer subassembly comprising:
a flexible base layer, having a first surface and an opposing second surface;
at least one active electronic circuit component comprising a thin film of semiconductor material, operatively integrated and embedded directly within said flexible base layer;
at least one first patterned contact layer, provided on any one of said first surface and said second surface of said flexible base layer, and configured to operably interface with said at least one active electronic circuit component and the at least one IC component,
wherein the at least one IC component is external to the interposer subassembly,
wherein the interposer subassembly further comprises at least one thermal management layer embedded in said flexible base layer,
wherein the at least one thermal management layer is configured to transfer heat energy away from said at least one active electronic circuit component, and
wherein a layer of the interposer subassembly at the first surface has a different coefficient of thermal expansion than a layer of the interposer at the second surface.
2. The interposer subassembly according to claim 1 , further comprising at least one second patterned contact layer, provided on said flexible base layer at a surface opposite to said first patterned contact layer, and configured to operably connect to any one or any combination of said at least one active electronic circuit component, said first patterned contact layer, and the at least one IC.
3. The interposer subassembly according to claim 2 , wherein said at least one first patterned contact layer comprises a plurality of first contact elements having a first line pitch, and, said at least one second patterned contact layer comprises a plurality of second contact elements having a second line pitch.
4. The interposer subassembly according to claim 3 , wherein said first line pitch is different to said second line pitch.
5. The interposer subassembly according to claim 2 , further comprising at least one passive electronic circuit component, operatively integrated within said flexible base layer and operably connected to said at least one active electronic circuit component and/or said at least one first patterned contact layer and/or said at least one second patterned contact layer.
6. The interposer subassembly according to claim 5 , further comprising at least one conductive via, extending through at least a portion of said flexible base layer between said first surface and said opposing second surface, configured to operably connect any one or any combination of said at least one active electronic circuit component, said at least one passive electronic circuit component, said at least one first patterned contact layer and said at least one second patterned contact layer.
7. The interposer subassembly according to claim 1 , wherein said flexible base layer comprises at least one dielectric layer material integrated within at least a portion of said flexible base layer and/or on at least a portion of said first surface of said flexible base layer and/or on at least a portion of said opposing second surface of said flexible base layer.
8. The interposer subassembly according to claim 1 , wherein at least a portion of said at least one thermal management layer is electrically insulating.
9. The interposer subassembly according to claim 1 , wherein said at least one thermal management layer has a predetermined coefficient of thermal expansion (CTE).
10. The interposer subassembly according to claim 1 , wherein said semiconductor material has a predetermined dopant concentration.
11. The interposer subassembly according to claim 10 , wherein said predetermined dopant concentration is a predetermined concentration profile gradation of dopants.
12. The interposer subassembly according to claim 1 , wherein said at least one active electronic circuit component is a transistor.
13. The interposer subassembly according to claim 5 , wherein said at least one passive electronic circuit component comprises a metal integrated into said flexible base layer.
14. The interposer subassembly according to claim 1 , wherein said at least one first patterned contact layer is made of an electrically conductive material.
15. The interposer subassembly according to claim 14 , wherein said electrically conductive material comprises at least one metal.
16. The electronic system comprising:
the interposer subassembly according to claim 1 ; and
at least one first electronic component mounted to and electrically connected to said interposer subassembly.
17. The electronic system according to claim 16 , wherein said at least one first electronic component is at least partially encased within an encapsulant material.
18. The electronic system according to claim 16 , wherein said encapsulant material comprises a polymer.
19. The electronic system according to claim 16 , wherein said at least one first electronic component is electrically connected to said interposer subassembly by at least one wire bond.
20. The electronic systems according to claim 16 , wherein said at least one first electronic component is electrically connected to said interposer subassembly in a flip-chip configuration.
21. The interposer subassembly according to claim 5 , wherein said at least one passive electronic circuit component is any one of a resistor, capacitor, inductor and diode.
22. The interposer subassembly according to claim 1 , wherein said flexible base layer is formed from any one or any combination of substrate, glass, polymer, cellulose and metal.