Composite device with substrate and mounted component

1. A composite device comprising:

a substrate; and

a mounted component mounted to a surface of the substrate; wherein

the substrate includes a first thermoplastic resin layer;

at least a surface of the mounted component includes a second thermoplastic resin layer that includes a same or a similar material as that of the first thermoplastic resin layer; and

a conductive bonded portion including a conductive bonding material is provided between the second thermoplastic resin layer and the first thermoplastic resin layer; and

a bonding layer that bonds the second thermoplastic resin layer and the first thermoplastic resin layer together is provided between the second thermoplastic resin layer and the first thermoplastic resin layer.

2. The composite device according to claim 1 , wherein at least one of the first thermoplastic resin layer and the second thermoplastic resin layer is flexible.

3. The composite device according to claim 1 , wherein the mounted component is a component in which an IC chip is on a surface of a base material of the second thermoplastic resin layer.

4. The composite device according to claim 1 , wherein the mounted component is a component in which a base material of the second thermoplastic resin layer includes a built-in IC chip.

5. The composite device according to claim 1 , wherein the mounted component is a component in which the second thermoplastic resin layer is affixed to a portion of the IC chip.

6. The composite device according to claim 1 , wherein the substrate includes a structure in which a plurality of thermoplastic resin layers including the first thermoplastic resin layer are laminated.

7. The composite device according to claim 1 , wherein the substrate is a collective substrate including a plurality of child board regions, and the mounted component is an RFIC package and is connected to a portion of a conductive pattern at an edge of the collective substrate.

8. The composite device according to claim 1 , wherein between the second thermoplastic resin layer and the first thermoplastic resin layer, all bonding regions other than the conductive bonded portion define the bonding layer.

9. The composite device according to claim 1 , wherein the conductive bonded portion is embedded into the substrate.

10. The composite device according to claim 1 , wherein the conductive bonding material is a paste that solidifies when subjected to thermal treatment.

11. The composite device according to claim 3 , wherein the mounted component includes, around the IC chip, a protective layer comprising a third thermoplastic resin layer that includes a same or a similar material as that of the second thermoplastic resin layer.

12. The composite device according to claim 3 , wherein the mounted component includes, around the IC chip, a protective layer comprising a thermosetting resin layer.

13. The composite device according to claim 3 , wherein a circuit pattern is located inside the base material.

14. The composite device according to claim 3 , wherein the IC chip is mounted on the base material by a conductive bonding material.

15. The composite device according to claim 13 , wherein the circuit pattern includes a resonant circuit with a predetermined resonance frequency.

16. The composite device according to claim 7 , wherein the RFIC package communicates in a UHF band.

17. The composite device according to claim 7 , wherein the plurality of child board regions are arranged in a lattice shape.

18. The composite device according to claim 7 , wherein the conductive pattern includes a loop portion.

19. The composite device according to claim 18 , wherein the loop portion provides impedance matching between the mounted component and the conductive pattern.

20. The composite device according to claim 10 , wherein

the conductive bonding material includes a metal powder and an alloy powder;

the alloy powder defines an intermetallic compound with the metal powder.