Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
In an embodiment an optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface, a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and including a stack of at least two conversion layers and a reflective element laterally surrounding the optoelectronic semiconductor chip, wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface, wherein the conversion element includes a part laterally extending beyond the radiation exit surface and being concavely curved, wherein the conversion element is partly arranged on the reflective element, and wherein the conversion element is arranged on a concavely curved surface of the reflective element.
1. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface;
a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and comprising a stack of at least two conversion layers; and
a reflective element laterally surrounding the optoelectronic semiconductor chip,
wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface,
wherein the conversion element comprises a part, which laterally extends beyond the radiation exit surface, is concavely curved, and comprises more than one of the at least two conversion layers,
wherein the conversion element is partly arranged on the reflective element,
wherein the conversion element is arranged on a concavely curved surface of the reflective element, and
wherein the optoelectronic semiconductor component is configured to emit mixed-colored radiation.
2. The optoelectronic semiconductor component according to claim 1 , wherein the conversion layers are formed from the same conversion material.
3. The optoelectronic semiconductor component according to claim 1 , wherein the conversion layers have a rectangular shape in plan view of the optoelectronic semiconductor component.
4. The optoelectronic semiconductor component according to claim 1 , wherein the conversion layers are symmetrically arranged with respect to a main axis of the radiation exit surface.
5. The optoelectronic semiconductor component according to claim 1 , further comprising a carrier on which the optoelectronic semiconductor chip is arranged, wherein the carrier comprises a first and a second contact structure, and wherein the reflective element fills a respective interspace between the optoelectronic semiconductor chip and the first and second contact structures.
6. The optoelectronic semiconductor component according to claim 1 , wherein each of the conversion layers has a thickness of 10 μm to 15 μm.
7. The optoelectronic semiconductor component according to claim 1 , further comprising a dome-like encapsulant covering the conversion element.
8. A method for producing an optoelectronic semiconductor component, the method comprising:
providing an optoelectronic semiconductor chip having a radiation exit surface and at least one side surface running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface;
forming a reflective element to laterally surround the optoelectronic semiconductor chip; and
applying a conversion material layer after layer to the radiation exit surface for forming a conversion element comprising at least two conversion layers,
wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface,
wherein the conversion element comprises a part, which laterally extends beyond the radiation exit surface, is concavely curved, and comprises more than one of the at least two conversion layers,
wherein the conversion element is partly arranged on the reflective element, and
wherein the conversion element is arranged on a concavely curved surface of the reflective element.
9. The method according to claim 8 , wherein applying the conversion material layer comprises spray coating the conversion material layer.
10. The method according to claim 8 , wherein the conversion layers are produced by masks having different sizes of mask openings.
11. The method according to claim 8 , wherein the reflective element is formed from a reflective material.
12. An optoelectronic semiconductor component comprising:
an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface;
a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and comprising a stack of at least two conversion layers; and
a reflective element laterally surrounding the optoelectronic semiconductor chip,
wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface,
wherein the conversion element comprises a part, which laterally extends beyond the radiation exit surface, is concavely curved, and comprises more than one of the at least two conversion layers,
wherein the conversion element is partly arranged on the reflective element,
wherein the conversion element is arranged on a concavely curved surface of the reflective element,
wherein each of the conversion layers of the conversion element is continuous and at least one of the conversion layers of the conversion element comprises a lateral extent smaller than a lateral extent of the radiation exit surface of the optoelectronic semiconductor chip, and
wherein the optoelectronic semiconductor component is configured to emit mixed-colored radiation.