Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layers
Fabricating a semiconductor substrate by (a) vertical etching a feature having sidewalls and a depth into one or more layers formed on the semiconductor substrate and (b) depositing an amorphous carbon liner onto the sidewalls of the feature. Steps (a) and optionally (b) are iterated until the vertical etch feature has reached a desired depth. With each iteration of (a), the feature is vertical etched deeper into the one or more layers, while the amorphous carbon liner resists lateral etching of the sidewalls of the feature. With each optional iteration of (b), the deposited amorphous carbon liner on the sidewalls of the feature is replenished.
1. A method of fabricating a semiconductor substrate, the method comprising:
(a) vertical etching a feature having sidewalls and a depth into one or more layers formed on the semiconductor substrate;
(b) depositing an amorphous carbon liner onto the sidewalls of the feature; and
(c) iterating (a) and (b), wherein with each iteration of (a), the depth of the feature is vertical etched deeper into the one or more layers, while the deposited amorphous carbon liner resists lateral etching of the sidewalls of the feature, and wherein with each iteration of (b), the deposited amorphous carbon liner on the sidewalls of the feature is at least partially replenished.
2. The method of claim 1 , further comprising performing an etch-back etch to etch back one of the following:
(i) incidental deposit of the amorphous carbon occurring on a planar surface of the one or more layers adjacent the feature;
(ii) thicker regions, relative to thinner regions, of the amorphous carbon liner that forms on the sidewalls of the feature; or
(iii both (i) and (ii).
3. The method of claim 1 , further comprising
(d) densifying the amorphous carbon liner after depositing the amorphous carbon liner onto the sidewalls of the feature.
4. The method of claim 3 , wherein iterating (a) and (b) further comprises iterating (d).
5. A method for fabricating a semiconductor substrate, the method comprising:
(i) depositing an amorphous carbon material forming a liner onto sidewalls of a feature vertically etched into one or more layers on a semiconductor substrate;
(ii) at least partially simultaneous etching, during the deposition of the amorphous carbon material, excess deposits of the amorphous carbon material depositing in a hole defining the feature and upper regions of the sidewalls of the feature; and
(iii) after depositing the amorphous carbon material onto the sidewalls of the feature, performing additional vertical etching of the feature, wherein the amorphous carbon material resists lateral etching of the sidewalls of the feature during the additional vertical etching.
6. The method of claim 5 , further comprising controlling the at least partial simultaneous deposition and etching so that the amorphous carbon material forming the liner is more uniform in thickness from a bottom of the vertically etched feature to the upper regions of the sidewalls of the feature, wherein the more uniformity in thickness is relative to a lack of uniformity of the thickness of the liner had the etch not been performed.
7. The method of claim 5 , further comprising controlling the at least partial simultaneous deposition and etch so that “pinch off” of excess amorphous carbon material in an opening defining the feature is either delayed or prevented from occurring by the at least partially simultaneous etch during the deposition, wherein pinch off is defined as a complete or partial blockage of the opening.
8. A method of fabricating a semiconductor substrate, the method comprising:
(a) vertically etching a feature having an opening, sidewalls and a depth into one or more layers formed on the semiconductor substrate;
(b) depositing a liner material onto the sidewalls of the feature;
(c) performing an etch of a carbon mask used to define the opening of the feature, the etch:
(i) removing excess deposits of the liner material that has collected in the opening of the feature defined by the carbon mask; and
(ii) shaping the carbon mask in a vicinity of the opening of the feature; and
(d) iterating (a), (b) and (c) until the feature has reached a desired depth into the one or more layers formed on the semiconductor substrate.
9. The method of claim 8 , further comprising performing (b) and (c) in a same chamber of a substrate processing tool.
10. The method of claim 8 , wherein (a), (b), (c), and (d) are each performed by a same substrate processing tool.
11. The method of claim 8 , wherein shaping of the carbon mask further
comprises tapering the opening from wide to narrow in the direction toward the feature.
12. A method for fabricating a semiconductor substrate, comprising:
fabricating a vertical feature into one or more layers formed on a substrate, the vertical feature having an opening, sidewalls and a depth; and
depositing amorphous carbon onto the sidewalls of the vertical feature and within the opening so that the amorphous carbon is deposited non-conformally to be thinner near the depth of the vertical feature and thicker near the opening of the vertical feature, the amorphous carbon deposited in the opening forming an amorphous carbon plug in the opening of the vertical feature, wherein the amorphous carbon partially fills the vertical feature in a section below the amorphous carbon plug.
13. The method of claim 12 , further comprising depositing additional amorphous carbon over the amorphous carbon plug formed in the opening of the vertical feature and on surface area of the one or more layers surrounding the vertical feature.
14. The method of claim 13 , further comprising etching back the additional amorphous carbon deposited over the plug to create a recess above the plug.
15. A method performed within a substrate processing chamber, the method comprising:
fabricating a vertical feature formed on a substrate in the processing chamber, the vertical feature having an opening, sidewalls and a depth;
depositing amorphous carbon material on the substrate in the processing chamber, the amorphous carbon material deposited on the sidewalls of the vertical feature and forming a plug within the opening of the vertical feature, wherein the amorphous carbon material partially fills the vertical feature in a section below the plug, and wherein the amorphous carbon material is deposited non-conformally so that the amorphous carbon material is thinner near the depth of the vertical feature and thicker near the opening of the vertical feature; and
etching back a portion of the plug to create a recess above the plug.
16. The method of claim 15 , wherein fabricating the vertical feature further comprises (a) vertically etching the feature, (b) depositing an amorphous carbon layer on the sidewalls of the feature and (c) iterating (a) and optionally (b) one or more times until the vertical feature has reached the predetermined depth, wherein the deposition of the amorphous carbon layer during each iteration of (b) mitigates horizontal etching of the feature during a subsequent iteration of (a).