IP Library › Granted Patent US 12,191,626
Granted Patent B1
US 12,191,626 · App. 17/444,273 · Granted Jan 7, 2025

Vertically emitting laser devices and chip-scale-package laser devices and laser-based, white light emitting devices

Inventor: Melvin McLaurin (Santa Barbara, CA)
Assignee: Kyocera SLD Laser, Inc.
H01S5/0217H01L21/7813H01L29/2003H01L29/7786H01L29/8613H01L29/872H01L33/0093H01L33/24H01L33/32H01L33/62H01S5/0087H01S5/02255H01S5/028H01S5/18305H01S5/18344H01S5/18369H01S5/423H01L2933/0066
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Quick Facts
Patent No.
US 12,191,626
App. No.
17/444,273
Granted
Jan 7, 2025
Kind
B1
Abstract

Horizontal Cavity Surface Emitting Lasers (HCSELs) with angled facets may be fabricated by a chemical or physical etching process, and the epitaxially grown semiconductor device layers may be transferred through a selective etch and release process from their original epitaxial substrate to a carrier wafer.

Claims (32)

1. A method for manufacturing a semiconductor light emitting device, the method comprising:

providing a gallium and nitrogen containing substrate having a surface region;

forming a release material overlying the surface region;

forming a gallium and nitrogen containing epitaxial material overlying the release material, the epitaxial material comprising at least an intrinsic-type or unintentionally doped gallium and nitrogen containing region or at least an n-type gallium and nitrogen containing region or at least a p-type gallium and nitrogen containing region or at least a combination of one or more n-type gallium and nitrogen containing regions, p-type gallium and nitrogen containing regions, or unintentionally doped gallium and nitrogen containing regions;

patterning the epitaxial material and the release material to form mesas separated by a first pitch and arranged in an array, each mesa corresponding to at least one semiconductor device;

forming a bonding media overlying at least a portion of the mesas;

bonding the bonding media to a carrier wafer to form bonded structures;

releasing the bonded structures by at least partially removing the release material to transfer a plurality of mesas to the carrier wafer, wherein each pair of transferred mesas is separated by a second pitch that is greater than the first pitch; and

processing at least one of the plurality of mesas to form the semiconductor light emitting device having a cavity with facets on each end, at least one of the facets being an angled facet that is at an angle relative to the other facet, the angled facet configured to provide an intra-cavity beam deflector that alters a path of a light beam within the cavity to facilitate emission of the light beam from the cavity.

2. The method of claim 1 wherein the angled facet is formed before the bonding step.

3. The method of claim 1 wherein the angled facet is formed after the bonding step.

4. The method of claim 1 wherein the facets on each end of the cavity are both angled facets, and one of the angled facets has a reentrant profile and the other angled facet has a convex profile.

5. The method of claim 1 wherein the semiconductor light emitting device is a surface emitting device configured to emit a laser beam in a direction perpendicular to a length of the cavity.

6. The method of claim 1 wherein the semiconductor light emitting device is configured to emit a laser beam in an upward direction away from the carrier wafer.

7. The method of claim 1 wherein the semiconductor light emitting device is configured to emit a laser beam downward toward the carrier wafer.

8. The method of claim 1 wherein the angled facet is formed before the bonding step, and the method further comprises forming an anti-reflective coating on an exit aperture of the cavity before the bonding step.

9. The method of claim 1 wherein the angled facet is formed after the bonding step, and the method further comprises forming an anti-reflective coating on an exit aperture of the cavity after the bonding step.

10. The method of claim 1 wherein processing the at least one of the plurality of mesas to form the semiconductor light emitting device includes forming an exit aperture adjacent to each of the facets.

11. A method for manufacturing a chip-scale package, the method comprising:

providing a gallium and nitrogen containing substrate having a surface region;

forming a release material overlying the surface region;

forming a gallium and nitrogen containing epitaxial material overlying the release material, the epitaxial material comprising at least an intrinsic-type or unintentionally doped gallium and nitrogen containing region or at least an n-type gallium and nitrogen containing region or at least a p-type gallium and nitrogen containing region or at least a combination of one or more n-type gallium and nitrogen containing regions, p-type gallium and nitrogen containing regions, or unintentionally doped gallium and nitrogen containing regions;

patterning the epitaxial material and the release material to form mesas separated by a first pitch and arranged in an array, each mesa corresponding to at least one semiconductor device;

forming a bonding media overlying at least a portion of the mesas;

bonding the bonding media to a carrier wafer to form bonded structures;

releasing the bonded structures by at least partially removing the release material to transfer a plurality of mesas to the carrier wafer, wherein each pair of transferred mesas is separated by a second pitch that is greater than the first pitch;

processing at least one of the plurality of mesas to form a semiconductor light emitting device having a cavity with facets on each end, at least one of the facets being an angled facet configured to provide an intra-cavity beam deflector that alters a path of a laser light within the cavity to facilitate emission of the laser light from the cavity;

providing a wavelength converting member configured to absorb the laser light emitted from the cavity and down convert the absorbed laser light, wherein the down converted laser light mixes with scattered laser light to provide white light from the wavelength converting member; and

encapsulating facet regions of the semiconductor light emitting device with a coating material to provide the chip-scale package.

12. The method of claim 11 wherein the carrier wafer provides the wavelength converting member, and the angled facet is configured to direct the laser light toward the carrier wafer.

13. The method of claim 11 wherein the wavelength converting member overlies the semiconductor light emitting device, and the angled facet is configured to direct the laser light upward toward the wavelength converting member.

14. The method of claim 11 further comprising forming a reflective coating on a surface of the wavelength converting member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2021
From: MCLAURIN, MELVIN
To: KYOCERA SLD LASER, INC.
Reel/Frame 058503/0686 →
Continuity (1)
Provisional Application 63059465 · Jul 31, 2020
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