Multilayer power, converter with devices having reduced lateral current
This disclosure relates to embodiments that include an apparatus that may comprise a first layer including a first plurality of active devices, a second layer including a second plurality of active devices, and/or a third layer including a plurality of passive devices and disposed between the first and the second layers. An active device of the first plurality of active devices and an active device of the second plurality of active devices may influence a state of charge of a passive device of the plurality of passive devices.
1. An apparatus comprising:
a first layer including a first plurality of active devices;
a second layer including a second plurality of active devices; and
a third layer including a plurality of passive devices and disposed between the first and the second layers,
wherein an active device of the first plurality of active devices and an active device of the second plurality of active devices influence a state of charge of a passive device of the plurality of passive devices.
2. The apparatus of claim 1 , further comprising an interconnect layer to electrically connect the first plurality of active devices, the second plurality of active devices, and the plurality of passive devices, wherein the interconnect layer is disposed between the first layer and the third layer.
3. The apparatus of claim 2 , wherein the interconnect layer is disposed between the second layer and the third layer.
4. The apparatus of claim 2 , further comprising one or more through-hole vias to enable an electrical connection between the first layer, the second layer, and the third layer through the interconnect layer.
5. The apparatus of claim 1 , wherein each of the first and the second plurality of active devices includes switches.
6. The apparatus of claim 1 , wherein the first plurality of active devices includes a plurality of stack switches and the second plurality of active devices include a plurality of phase switches.
7. The apparatus of claim 6 , wherein the plurality of stack switches is electrically connected to a positive terminal of the passive device.
8. The apparatus of claim 6 , wherein the plurality of phase switches is electrically connected to a negative terminal of the passive device.
9. The apparatus of claim 1 , wherein the passive device of the plurality of passive devices comprises a capacitor.
10. The apparatus of claim 9 , wherein the capacitor comprises a fly capacitor.
11. The apparatus of claim 1 , further comprising driver circuitry and control circuitry to supply power to the first and the second plurality of active devices.
12. An integrated circuit comprising:
a first layer including at least two passive devices;
a second layer including at least four active devices to influence a state of charge of a passive device of the at least two passive devices; and
an interconnect layer disposed between the first and the second layer to electrically connect the two passive devices and the four active devices to form a DC-to-DC power converter.
13. The integrated circuit of claim 12 , wherein the at least four active devices comprise a first switch, a second switch, a third switch, and a fourth switch.
14. The integrated circuit of claim 13 , wherein the second layer further comprises a fifth switch and a sixth switch.
15. The integrated circuit of claim 14 , wherein the first layer includes at least two fly capacitors.
16. The integrated circuit of claim 15 , wherein the first switch, the second switch, the third switch, the fourth switch, and one of the at least two fly capacitors are electrically connected to form a charge pump.
17. The integrated circuit of claim 15 , wherein the first switch, the second switch, the third switch, the fourth switch, and one of the at least two fly capacitors are electrically connected to form a multi-level power converter.
18. The integrated circuit of claim 12 , further comprising one or more through-hole vias to enable an electrical connection between the first layer and the second layer through the interconnect layer.
19. The integrated circuit of claim 12 , further comprising driver circuitry and control circuitry to supply power to the plurality of active devices.
20. A method of forming an apparatus, the method comprising:
forming a first layer including a first plurality of active devices;
forming a second layer including a second plurality of active devices; and
forming a third layer including a plurality of passive devices and disposed between the first and the second layers,
wherein an active device of the first plurality of active devices and an active device of the second plurality of active devices influence a state of charge of a passive device of the plurality of passive devices.
21. The method of claim 20 , further comprising forming an interconnect layer to electrically connect the first plurality of active devices, the second plurality of active devices, and the plurality of passive devices, wherein the interconnect layer is formed between the first layer and the third layer.
22. The method of claim 20 , wherein the first plurality of active devices includes a plurality of stack switches and the second plurality of active devices includes a plurality of phase switches.
23. The method of claim 22 , wherein the plurality of stack switches is electrically connected to a positive terminal of the passive device, and wherein the plurality of phase switches is electrically connected to a negative terminal of the passive device.
24. A method of forming an integrated circuit, the method comprising:
forming a first layer including at least two passive devices;
forming a second layer including at least four active devices to influence a state of charge of a passive device of the at least two passive devices; and
forming an interconnect layer disposed between the first and the second layer to electrically connect the two passive devices and the four active devices.
25. The method of claim 24 , wherein the at least four active devices comprise a first switch, a second switch, a third switch, and a fourth switch.
26. The method of claim 25 , wherein the second layer further comprises a fifth switch and a sixth switch.
27. The method of claim 24 , wherein the first layer includes at least two fly capacitors.
28. The method of claim 27 , wherein the first switch, the second switch, the third switch, the fourth switch, and one of the at least two fly capacitors are electrically connected to form a charge pump.
29. The method of claim 27 , wherein the first switch, the second switch, the third switch, the fourth switch, and one of the at least two fly capacitors are electrically connected to form a multi-level power converter.