Thin-film devices and fabrication
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
1. A method of fabricating an electrochromic device, the method comprising:
a. receiving a glass substrate with a first transparent conductor layer covering a work surface of the glass substrate;
b. removing a portion of the first transparent conductor layer from the glass substrate about a periphery of the glass substrate;
c. depositing an electrochromic device stack over the first transparent conductor layer and covering substantially the entire work surface of the glass substrate;
d. depositing a second transparent conductor layer over the electrochromic device stack and covering substantially the entire work surface of the glass substrate;
e. removing a portion of the second transparent conductor layer from the entire periphery of the glass substrate; and
f. depositing a vapor barrier over the second transparent conductor layer and covering substantially the entire work surface of the glass substrate.
2. The method of claim 1 , wherein the glass substrate is rectangular.
3. The method of claim 2 , wherein b. comprises removing the first transparent conductor layer from three edges of the glass substrate.
4. The method of claim 3 , wherein e. comprises removing the second transparent conductor layer from all four edges of the glass substrate, but not removing any of the electrochromic device stack.
5. The method of claim 4 , further comprising removing the vapor barrier from all four edges of the glass substrate, but not removing any of the second transparent conductor layer.
6. The method of claim 4 , further comprising forming a bus bar pad by laser ablation to expose the first transparent conductor layer along one edge of the electrochromic device stack.
7. The method of claim 4 , wherein forming the bus bar pad is formed prior to f.
8. The method of claim 4 , wherein forming the bus bar pad is formed after f.
9. The method of claim 7 , wherein, prior to f., a first bus bar is fabricated on the bus bar pad, a second bus bar is fabricated on the second transparent conductor layer along a side that is opposite the bus bar pad, and, wherein no electrochromic device stack lies under the second bus bar.
10. The method of claim 3 , wherein the first transparent conductor layer is tapered about its peripheral edge prior to c.
11. The method of claim 1 , wherein the first transparent conductor layer is polished prior to b. and/or after b. and prior to c.
12. The method of claim 3 , wherein each of b. and e. comprise removal of a first width of the first transparent conductor layer and removal of a second width of the second transparent conductor layer, respectively where the first width is greater than the second width.
13. The method of claim 6 , wherein the bus bar pad is between about 5 mm and about 15 mm wide.
14. The method of claim 9 , further comprising fabricating an insulated glass unit comprising:
(i) the glass substrate;
(ii) a spacer; and
(iii) a second glass substrate;
wherein the glass substrate and the second glass substrate are mated with the spacer therebetween using a primary sealant to adhere the glass substrate and second glass substrate to the spacer, thereby forming a primary seal area on the faces of the spacer that mate with the respective surfaces of the glass substrate and second glass substrate.
15. The method of claim 14 , wherein the peripheral edge of the second transparent conductor layer, formed in e., is sealed within the primary seal area.
16. The method of claim 14 , wherein the first and second bus bars are sealed within the primary seal area along their lengths.
17. The method of claim 14 , further comprising attaching wire leads to the first and second bus bars.
18. The method of claim 14 , further comprising applying an adhesive sealant around the spacer and between the glass substrate and second glass substrate to form a secondary seal of the insulating glass unit.
19. The method of claim 1 , wherein the vapor barrier comprises one or more of a silicon oxide, a silicon aluminum oxide, a silicon oxynitride, an aluminum zinc oxide, a tin oxide, and a silicon dioxide.
20. The method of claim 7 , wherein, after f., portions of the vapor barrier are removed to expose the second transparent conductor layer opposite the bus bar pad, and to expose the bus bar pad, wherein a first bus bar is fabricated on the bus bar pad, a second bus bar is fabricated on the second transparent conductor layer along a side that is opposite the bus bar pad, and, wherein no electrochromic device stack lies under the second bus bar.
21. The method of claim 1 , wherein the vapor barrier is electrically insulating.
22. The method of claim 1 , wherein the vapor barrier is electrically conductive.