Ion implantation system with mixture of arc chamber materials
A system and method for ion implantation is described, which includes a gas or gas mixture including at least one ionizable gas used to generate ionic species and an arc chamber that includes two or more different arc chamber materials. Using the system ionic species are generated in the arc chamber with liner combination, and one or more desired ionic species display a higher beam current among the ionic species generated, which is facilitated by use of the different materials. In turn improved implantation of the desired ionic species into a substrate can be achieved. Further, the system can minimize formation of metal deposits during system operation, thereby extending source life and promoting improved system performance.
1. An ion implantation system for implanting one or more ionic species into a substrate, the system comprising:
a gas source comprising an ionizable gas or gas mixture containing at least one ionizable gas, wherein the ionizable gas or gas mixture includes one or more of the SiF 4 , Si 2 F 6 , Si 2 H 4 , SiHF 3 , SiH 2 F 2 , SiH 3 F, Si 2 H 3 F 3 , Si 2 H 5 F, Si 2 HF 5 , BF 3 , B 2 F 4 , B 2 H 6 , BHF, BHF 2 , enriched BF 3 , GeF 4 , Ge 2 F 6 , GeH 4 , enriched GeF 4 , GeHF 3 , GeH 2 F 2 , GeH 3 F, PF 3 , PF 5 , PH 3 , PHF 2 , PH 2 F, PH 3 F 2 , P 2 HF, AsHF 2 , AsH 2 F, AsH 3 F 2 , AsF 3 , AsF 5 , AsH 3 , SbF 5 , WF 6 , NF 3 , N 2 F 4 , NH 3 , NHF 2 , NH 2 F, NHF, and N 2 H 3 F, CO, COF 2 , CH 4 , CF 4 , C 2 F 6 and gases having the following general formula C n H x F 2n+2−x , C n H x F 2n−x , C n H x F 2n−2− ; and
an arc chamber comprising at least a first arc chamber material and a second arc chamber material, wherein the first and second arc chamber materials are different,
wherein the arc chamber comprises arc chamber walls having interior-plasma facing surfaces and at least one or more arc chamber liners, a sputtering target disposed in the arc chamber, or a combination thereof, wherein the first and second arc chamber materials are present in the arc chamber walls, in the one or more arc chamber liners disposed in the arc chamber, a target disposed in the arc chamber, or a combination thereof.
2. The system of claim 1 , wherein the arc chamber walls comprise the first arc chamber material, the first arc chamber material comprising graphite (C), boron (B), germanium (Ge), boron nitride (BN), (boron oxide) B 2 O 3 , (germanium oxide) GeO 2 , silicon carbide (SiC), tungsten carbide (WC, W 2 C), tungsten boride (WB, W 2 B, WB 2 , WB 4 ), boron carbide (B 4 C, B 12 C 3 ), tungsten germanium W 2 Ge 3 , calcium carbide (CaC 2 ), Al 4 C 3 , (magnesium carbide) Mg 2 C, (aluminum fluoride) AlF 3 , (gallium fluoride) GaF 3 , (indium fluoride) InF 3 , (gallium nitride) GaN, aluminum nitride (AlN), (indium nitride) InN, tungsten lanthanum oxide (WLa 2 O 3 ), gallium oxide (Ga 2 O 3 ), (indium oxide) In 2 O 3 , antimony oxide (Sb 2 O 3 ), or aluminum oxide (Al 2 O 3 ).
3. The system of claim 2 , wherein the second arc chamber material is coated onto or surface graded into, a portion of or all of the arc chamber walls.
4. The system of claim 3 , including a first liner including the first arc chamber material and a second liner including a second arc chamber material, wherein the second arc chamber material is any one of one of graphite (C), boron (B), germanium (Ge), boron nitride (BN), (boron oxide) B2O3, (germanium oxide) GeO2, silicon carbide (Sick), tungsten carbide (WC, W2C), tungsten boride (WB, W2B, WB2, WB4), boron carbide (B4C, B12C3), tungsten germanium W2Ge3, calcium carbide (CaC2), Al4C3, (magnesium carbide) Mg2C, (aluminum fluoride) AlF3, (gallium fluoride) GaF3, (indium fluoride) InF3, (gallium nitride) GaN, aluminum nitride (AlN), (indium nitride) InN, tungsten lanthanum oxide (WLa2O3), gallium oxide (Ga2O3), (indium oxide) In2O3, antimony oxide (Sb2O3), or aluminum oxide (Al2O3).
5. The system of claim 1 , wherein the gas source includes GeF4 gas.
6. The system of claim 1 , wherein the arc chamber walls comprise the first arc chamber material, the first arc chamber material comprising fully or partially modified or made from a graphite-containing material, a carbide-containing material, or a ceramic, that is in particulate form.
7. The system of claim 5 , wherein the gas source further comprises a diluent gas, wherein the diluent gas can be any one of hydrogen, krypton, neon, helium, argon, xenon, or a xenon/hydrogen gas mixture.
8. The system of claim 5 , wherein the gas source further comprises one of hydrogen gas or a xenon/hydrogen gas mixture.
9. The system of claim 7 , wherein the gas source and the diluent gas are in a single package delivery vessel.
10. The system of claim 7 , wherein the gas source and the diluent gas are co-flowed.
11. The system of claim 1 , wherein the gas source includes one or more ionizable fluoride containing gases.
12. The system in claim 1 , wherein the first arc chamber material covers an amount of the total interior-plasma facing surface area of the walls in the range of about 1% to about 99%.
13. The system of claim 1 , wherein the target reacts with or is sputtered by at least one of the ionizable gases or its ionic or neutral fragments.
14. The system of claim 1 , wherein the gas source and/or at least the first or second arc chamber material comprises an isotopically enriched material.
15. The system of claim 1 , wherein the gas source includes CF4 gas.
16. The system of claim 1 , wherein the gas source includes SiF4 gas.