Power routing for 2.5D or 3D integrated circuits including a buried power rail and interposer with power delivery network
Embodiments relate to an electronic circuit implemented using a first integrated circuit die, a second integrated circuit die, and an interposer connecting the first integrated circuit die to the second integrated circuit die. The first integrated circuit die implements a first electronic circuit. The first integrated circuit die includes a first set of contacts on a bottom surface, a buried power rail (BPR), and a plurality of through-silicon vias (TSV) for connecting the BPR to the first set of contacts. The interposer includes a second set of contacts and a power delivery network (PDN). Each contact of the second set of contact corresponds to a contact of the first set of contacts of the first integrated circuit die. The PDN is configured to route a power supply voltage to the second set of contacts.
1. An electronic circuit comprising:
an integrated circuit die comprising a first substrate, the first substrate supporting:
a first set of contacts,
a buried power rail (BPR) disposed within the first substrate, the BPR configured to provide a supply voltage to a plurality of transistors of the integrated circuit die,
a plurality of through-silicon vias (TSV), each TSV of the plurality of TSVs having a first end coupled to the BPR, and a second end coupled to a contact of the first set of contacts, the plurality of TSVs configured to provide the supply voltage to multiple locations within the BPR; and
an interposer comprising a second substrate, the second substrate supporting:
a second set of contacts, each contact of the second set of contacts corresponding to a contact of the first set of contacts, and
a power delivery network (PDN), the PDN coupled to the second set of contacts, the PDN for routing the power supply voltage to the second set of contacts to provide the power supply to each of the TSVs of the integrated circuit die.
2. The electronic circuit of claim 1 , wherein the integrated circuit die is bonded to the interposer.
3. The electronic circuit of claim 2 , wherein a bottom surface of the integrated circuit die is bonded to a top surface of the interposer.
4. The electronic circuit of claim 1 , wherein the integrated circuit die is fabricated using a first fabrication process node and wherein the interposer is fabricated using a second fabrication process node, larger than the first fabrication process node.
5. The electronic circuit of claim 1 , wherein the BPR is fabricated by etching the first substrate to form an opening in the first substrate, and depositing a conductive material to fill the opening.
6. The electronic circuit of claim 1 , wherein the BPR is disposed within an isolation region of the integrated circuit die, the isolation region for separating two or more transistors implementing an integrated circuit.
7. The electronic circuit of claim 6 , wherein the isolation region is a shallow trench isolation (STI) region.
8. The electronic circuit of claim 6 , wherein the BPR is coupled to at least one of the two or more transistors implementing the integrated circuit.
9. The electronic circuit of claim 1 , wherein the interposer further comprises:
a third set of contacts configured to be connected to an external system, wherein the PDN is further coupled to the third set of contacts.
10. The electronic circuit of claim 9 , wherein the second set of contacts are disposed on a first surface of the interposer, and wherein the third set of contacts are disposed on a second surface of the interposer opposite to the first surface.
11. The electronic circuit of claim 1 , wherein the PDN comprises a plurality of interconnects for connecting the second set of contacts to each other.
12. The electronic circuit of claim 1 , wherein the plurality of TSVs are periodically disposed along a length of the BPR.
13. The electronic circuit of claim 1 , wherein the plurality of TSVs are fabricated by:
thinning down the first substrate,
etching regions of a bottom surface of the integrated circuit die to form a plurality of openings, wherein the regions of the bottom surface of the integrated circuit die are etched until the BPR is exposed, and
filling the plurality of openings with a conductive material.