Semiconductor memory device

1. A semiconductor memory device comprising:

a substrate;

a first conductive layer which is separated from the substrate in a first direction intersection a surface of the substrate and extends in a second direction intersecting the first direction;

a second conductive layer which is separated from the substrate and the first conductive layer in the first direction and extends in the second direction;

a third conductive layer which is separated from the substrate and the first conductive layer in the first direction, extends in the second direction, is aligned with the second conductive layer in the second direction, and is electrically connected to the second conductive layer;

a first semiconductor layer which extends in the first direction and faces the first conductive layer and the second conductive layer;

a first charge accumulating portion provided between the first conductive layer and the first semiconductor layer;

a second charger accumulating portion provided between the second conductive layer and the first semiconductor layer;

a second semiconductor layer which extends in the first direction and faces the first conductive layer and the third conductive layer;

a third charge accumulating portion provided between the first conductive layer and the second semiconductive layer;

a fourth charge accumulating portion provided between the third conductive layer and the second semiconductor layer;

a first bit line electrically connected to the first semiconductor layer; and

a second bit line electrically connected to the second semiconductor layer,

when a magnitude and supply time of one or a plurality of voltages supplied to the first conductive layer, a magnitude and supply time of one or a plurality of voltages supplied to the first bit line, a stabilization waiting time until sense start, and a sense time, in the case of a certain operation being executed on a first memory cell including the first charge accumulating portion, are assumed to be first operation parameters, and

a magnitude and supply time of one or a plurality of voltages supplied to the second conductive layer and the third conductive layer, a magnitude and supply time of one or a plurality of voltages supplied to the first bit line, a stabilization waiting time until sense start, and a sense time, in the case of the certain operation being executed on a second memory cell including the second charge accumulating portion, are assumed to be second operation parameters,

at least some of the second operation parameters differing from at least some of the first operation parameters.

2. The semiconductor memory device according to claim 1 , wherein

at least one of a magnitude and supply time of one or a plurality of voltages supplied to the second conductive layer and the third conductive layer, in the case of the certain operation being executed on the second memory cell is smaller than at least one of a magnitude and supply time of one or a plurality of voltages supplied to the first conductive layer, in the case of the certain operation being executed on the first memory cell.

3. The semiconductor memory device according to claim 1 , wherein

at least one of a magnitude and supply time of one or a plurality of voltages supplied to the first bit line, in the case of the certain operation being executed on the second memory cell is larger than at least one of a magnitude and supply time of one or a plurality of voltages supplied to the first bit line, in the case of the certain operation being executed on the first memory cell.

4. The semiconductor memory device according to claim 1 , wherein

a stabilization waiting time until sense start in the case of the certain operation being executed on the second memory cell is longer than a stabilization waiting time until sense start in the case of the certain operation being executed on the first memory cell.

5. The semiconductor memory device according to claim 1 , wherein

a sense time in the case of the certain operation being executed on the second memory cell is shorter than a sense time in the case of the certain operation being executed on the first memory cell.

6. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a first timing, the first conductive layer is supplied with a first voltage, and

at a second timing later than the first timing, the first conductive layer is supplied with a second voltage which is smaller than the first voltage, and

in the case of the read operation on the second memory cell,

at a third timing, the second conductive layer and the third conductive layer are supplied with a third voltage, and

at a fourth timing later than the third timing, the second conductive layer and the third conductive layer are supplied with a fourth voltage which is smaller than the third voltage,

a time from the third timing to the fourth timing is shorter than a time from the first timing to the second timing.

7. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a first timing, the first conductive layer is supplied with a first voltage, and

at a second timing later than the first timing, the first conductive layer is supplied with a second voltage which is smaller than the first voltage, and

in the case of the read operation on the second memory cell,

at a third timing, the second conductive layer and the third conductive layer are supplied with a third voltage, and

at a fourth timing later than the third timing, the second conductive layer and the third conductive layer are supplied with a fourth voltage which is smaller than or of the same value as the third voltage,

the third voltage is smaller than the first voltage.

8. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a first timing, the first conductive layer is supplied with a first voltage,

at a second timing later than the first timing, the first conductive layer is supplied with a second voltage which is smaller than the first voltage, and

at a fifth timing between the first timing and the second timing, the first conductive layer is supplied with a fifth voltage which is smaller than the second voltage, and

in the case of the read operation on the second memory cell,

at a third timing, the second conductive layer and the third conductive layer are supplied with a third voltage,

at a fourth timing later than the third timing, the second conductive layer and the third conductive layer are supplied with a fourth voltage which is smaller than the third voltage, and

at a sixth timing between the third timing and the fourth timing, the second conductive layer and the third conductive layer are supplied with a sixth voltage which is smaller than the fourth voltage,

a time from the sixth timing to the fourth timing is shorter than a time from the fifth timing to the second timing.

9. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a first timing, the first conductive layer is supplied with a first voltage,

at a second timing later than the first timing, the first conductive layer is supplied with a second voltage which is smaller than the first voltage, and

at a fifth timing between the first timing and the second timing, the first conductive layer is supplied with a fifth voltage which is smaller than the second voltage, and

in the case of the read operation on the second memory cell,

at a third timing, the second conductive layer and the third conductive layer are supplied with a third voltage,

at a fourth timing later than the third timing, the second conductive layer and the third conductive layer are supplied with a fourth voltage which is smaller than the third voltage, and

at a sixth timing between the third timing and the fourth timing, the second conductive layer and the third conductive layer are supplied with a sixth voltage which is smaller than or of the same value as the fourth voltage,

the sixth voltage is larger than the fifth voltage.

10. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a seventh timing, the first bit line is supplied with a seventh voltage, and

at an eighth timing later than the seventh timing, the first bit line is supplied with an eighth voltage which is smaller than the seventh voltage, and

in the case of the read operation on the second memory cell,

at a ninth timing, the first bit line is supplied with a ninth voltage, and

at a tenth timing later than the ninth timing, the first bit line is supplied with a tenth voltage which is smaller than the ninth voltage,

a time from the ninth timing to the tenth timing is longer than a time from the seventh timing to the eighth timing.

11. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a seventh timing, the first bit line is supplied with a seventh voltage, and

at an eighth timing later than the seventh timing, the first bit line is supplied with an eighth voltage which is smaller than the seventh voltage, and

in the case of the read operation on the second memory cell,

at a ninth timing, the first bit line is supplied with a ninth voltage, and

at a tenth timing later than the ninth timing, the first bit line is supplied with a tenth voltage which is smaller than the ninth voltage,

the ninth voltage is larger than the seventh voltage.

12. The semiconductor memory device according to claim 1 , further comprising:

a first transistor, the first transistor comprising a gate electrode which is electrically connected to the first bit line; and

a second transistor, the second transistor being provided in a current path between the first transistor and the first bit line,

wherein when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a seventh timing, a gate electrode of the second transistor is supplied with an eleventh voltage, and

at an eighth timing later than the seventh timing, the gate electrode of the second transistor is supplied with a twelfth voltage which is smaller than the eleventh voltage, and

in the case of the read operation on the second memory cell,

at a ninth timing, the gate electrode of the second transistor is supplied with a thirteenth voltage, and

at a tenth timing later than the ninth timing, the gate electrode of the second transistor is supplied with a fourteenth voltage which is smaller than the thirteenth voltage,

a time from the ninth timing to the tenth timing is longer than a time from the seventh timing to the eighth timing.

13. The semiconductor memory device according to claim 1 , further comprising:

a first transistor, the first transistor comprising a gate electrode which is electrically connected to the first bit line; and

a second transistor, the second transistor being provided in a current path between the first transistor and the first bit line,

wherein when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at a seventh timing, a gate electrode of the second transistor is supplied with an eleventh voltage, and

at an eighth timing later than the seventh timing, the gate electrode of the second transistor is supplied with a twelfth voltage which is smaller than the eleventh voltage, and

in the case of the read operation on the second memory cell,

at a ninth timing, the gate electrode of the second transistor is supplied with a thirteenth voltage, and

at a tenth timing later than the ninth timing, the gate electrode of the second transistor is supplied with a fourteenth voltage which is smaller than the thirteenth voltage,

the thirteenth voltage is larger than the eleventh voltage.

14. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a read operation, and

in the case of the read operation on the first memory cell,

at an eighth timing, the first bit line is supplied with an eighth voltage, and

at an eleventh timing later than the eighth timing, there is started a first sense operation, and

in the case of the read operation on the second memory cell,

at a tenth timing, the first bit line is supplied with a tenth voltage, and

at a twelfth timing later than the tenth timing, there is started a second sense operation,

a time from the tenth timing to the twelfth timing is longer than a time from the eighth timing to the eleventh timing.

15. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a write operation, and

the write operation includes a plurality of times of a program operation, and

in the case of a first time of the program operation in the write operation on the first memory cell,

at a thirteenth timing, the first conductive layer is supplied with a fifteenth voltage, and

at a fourteenth timing later than the thirteenth timing, the first conductive layer is supplied with a sixteenth voltage which is smaller than the fifteenth voltage, and

in the case of a first time of the program operation in the write operation on the second memory cell,

at a fifteenth timing, the second conductive layer and the third conductive layer are supplied with a seventeenth voltage, and

at a sixteenth timing later than the fifteenth timing, the second conductive layer and the third conductive layer are supplied with an eighteenth voltage which is smaller than the seventeenth voltage,

a time from the fifteenth timing to the sixteenth timing is shorter than a time from the thirteenth timing to the fourteenth timing.

16. The semiconductor memory device according to claim 1 , wherein

when the certain operation is a write operation, and

the write operation includes a plurality of times of a program operation, and

in the case of a first time of the program operation in the write operation on the first memory cell,

at a thirteenth timing, the first conductive layer is supplied with a fifteenth voltage, and

at a fourteenth timing later than the thirteenth timing, the first conductive layer is supplied with a sixteenth voltage which is smaller than the fifteenth voltage, and

in the case of a first time of the program operation in the write operation on the second memory cell,

at a fifteenth timing, the second conductive layer and the third conductive layer are supplied with a seventeenth voltage, and

at a sixteenth timing later than the fifteenth timing, the second conductive layer and the third conductive layer are supplied with an eighteenth voltage which is smaller than the seventeenth voltage,

the seventeenth voltage is smaller than the fifteenth voltage.

17. A semiconductor memory device comprising:

a substrate;

a first conductive layer which is separated from the substrate in a first direction intersecting a surface of the substrate and extends in a second direction intersecting the first direction;

a second conductive layer which is separated from the substrate and the first conductive layer in the first direction and extends in the second direction;

a third conductive layer which is separated from the substrate and the first conductive layer in the first direction, extends in the second direction, is aligned with the second conductive layer in the second direction, and is electrically connected to the second conductive layer;

a first semiconductor layer which extends in the first direction and faces the first conductive layer and the second conductive layer;

a second semiconductor layer which extends in the first direction and faces the first conductive layer and the third conductive layer;

a first wiring which is electrically connected to the first conductive layer, the second conductive layer, and the third conductive layer;

an operation voltage output circuit which is electrically connected to the first wiring; and

a variable resistance circuit which is provided in a current path between the first wiring and the operation voltage output circuit.

18. A semiconductor memory device comprising:

a substrate;

a first conductive layer which is separated from the substrate in a first direction intersecting a surface of the substrate and extends in a second direction intersecting the first direction;

a second conductive layer which is separated from the substrate and the first conductive layer in the first direction and extends in the second direction;

a third conductive layer which is separated from the substrate and the first conductive layer in the first direction, extends in the second direction, is aligned with the second conductive layer in the second direction, and is electrically connected to the second conductive layer;

a first semiconductor layer which extends in the first direction and faces the first conductive layer and the second conductive layer;

a second semiconductor layer which extends in the first direction and faces the first conductive layer and the third conductive layer;

a fourth conductive layer which is provided between the substrate and the first conductive layer, and is connected to one end of the first semiconductor layer and to one end of the second semiconductor layer;

a first wiring which is provided between the substrate and the fourth conductive layer, and is electrically connected to the second conductive layer and the third conductive layer;

a first contact which extends in the first direction, whose one end in the first direction is closer to the substrate than the fourth conductive layer is, whose other end in the first direction is further from the substrate than the second conductive layer is, and which is provided in a current path of the second conductive layer and the first wiring; and

a second contact which extends in the first direction, whose one end in the first direction is closer to the substrate than the fourth conductive layer is, whose other end in the first direction is further from the substrate than the third conductive layer is, and which is provided in a current path of the third conductive layer and the first wiring.

19. The semiconductor memory device according to claim 18 , wherein

the first wiring comprises a plurality of first portions, and

the plurality of first portions extend in the second direction and are aligned in a third direction intersecting the first direction and the second direction, or extend in the third direction and are aligned in the second direction.