Optical and thermal interface for photonic integrated circuits
Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
1. An optical apparatus to receive an external optical connector that is aligned to the optical apparatus, the optical apparatus comprising:
a photonic integrated circuit (PIC) including an optical output port and an alignment feature on a first side of the PIC;
a mechanical structure secured on a second side of the PIC that is opposite of the first side, the mechanical structure comprising a connector hole to receive the external optical connector, the mechanical structure being aligned to the PIC by imaging the alignment feature through to the second side of the PIC, such that light propagates from the optical output port of the PIC to the external optical connector that is connected to the connector hole of the mechanical structure.
2. The optical apparatus of claim 1 , wherein the mechanical structure is secured to the PIC using holding material deposited around the mechanical structure.
3. The optical apparatus of claim 2 , further comprising:
a layer of material deposited on the second side of the PIC, the layer of material comprising a hole to receive the mechanical structure, wherein the mechanical structure is smaller than the hole to enable moving the mechanical structure for passive alignment of the mechanical structure to the PIC using the alignment feature.
4. The optical apparatus of claim 3 , wherein the layer of material is a heat spreading layer and the holding material is spacer material that secures the mechanical structure within the hole of the heat spreading layer.
5. The optical apparatus of claim 1 , wherein the PIC comprises a PIC hole etched to provide a line of sight to the alignment feature for the imaging of the alignment feature via the second side of the PIC.
6. The optical apparatus of claim 1 , wherein the imaging of the alignment feature through to the second side of the PIC uses light of a wavelength that is transparent to the PIC.
7. The optical apparatus of claim 1 , wherein the optical output port and the alignment feature are separated by a predetermined distance.
8. The optical apparatus of claim 7 , wherein the predetermined distance comprises a horizontal distance on the first side of the PIC.
9. The optical apparatus of claim 1 , wherein the optical output port comprises a lens unit.
10. The optical apparatus of claim 1 , further comprising:
an electrical integrated circuit comprising control circuitry for one or more devices of the PIC; and
a substrate.
11. The optical apparatus of claim 10 , wherein the substrate is to communicatively couple the PIC and the electrical integrated circuit.
12. A method of aligning an external optical connector unit with a photonic integrated circuit, the photonic integrated circuit (PIC) comprising an optical output port and an alignment feature on a first side of the PIC, the method comprising:
aligning a mechanical structure on a second side of the PIC that is opposite of the first side, the mechanical structure comprising a connector hole to receive the external optical connector, the mechanical structure being aligned to the PIC by imaging the alignment feature through to the second side of the PIC, such that light propagates from the optical output port of the PIC to the external optical connector that is connected to the connector hole of the mechanical structure; and
securing the mechanical structure to the second side of the PIC.
13. The method of claim 12 , wherein securing the mechanical structure comprises:
applying a holding material around the mechanical structure to secure the mechanical structure to the PIC.
14. The method of claim 13 , further comprising:
depositing a layer of material on the second side of the PIC, the layer of material comprising a hole to receive the mechanical structure, wherein the mechanical structure is smaller than the hole to enable moving the mechanical structure within the hole for alignment of the mechanical structure to the PIC.
15. The method of claim 14 , wherein the layer of material is a heat spreading layer and the holding material is spacer material that secures the mechanical structure within the hole of the heat spreading layer.
16. The method of claim 12 , further comprising:
etching a PIC hole in the PIC to provide a line of sight to the alignment feature for the imaging of the alignment feature via the second side of the PIC.
17. The method of claim 12 , wherein the imaging of the alignment feature through to the second side of the PIC uses light of a wavelength that is transparent to the PIC.
18. The method of claim 12 , wherein the optical output port and the alignment feature are separated by a predetermined distance.
19. The method of claim 18 , wherein the predetermined distance comprises a horizontal distance on the first side of the PIC.
20. The method of claim 12 , wherein the optical output port comprises a lens unit.