Methods and apparatus to increase glass core thickness

1. An apparatus comprising:

a first glass substrate;

a second glass substrate;

an interface layer between the first glass substrate and the second glass substrate, the interface layer coupling the first glass substrate to the second glass substrate; and

an interconnect extending through at least a portion of the first glass substrate and at least a portion of the second glass substrate, wherein the interconnect includes a first portion extending through the first glass substrate and a second portion extending through the second glass substrate, and wherein the first portion of the interconnect and the second portion of the interconnect are offset along a lateral direction.

2. The apparatus as defined in claim 1 , wherein the interface layer includes a dielectric layer.

3. The apparatus as defined in claim 1 , wherein the interface layer includes a bonding film.

4. The apparatus as defined in claim 1 , wherein the interconnect includes a through-glass via (TGV).

5. The apparatus as defined in claim 4 , further including a plug surrounding the TGV.

6. The apparatus as defined in claim 5 , further including light absorption material surrounding at least a portion of the plug.

7. The apparatus as defined in claim 4 , further including light absorption material surrounding at least a portion of the TGV.

8. The apparatus as defined in claim 1 , further including light absorption material surrounding at least a portion of at least one of the first glass substrate or the second glass substrate.

9. A glass core for use with a semiconductor device, the glass core comprising:

a first glass substrate layer;

a second glass substrate layer;

an interface layer between the first glass substrate layer and the second glass substrate layer, the interface layer including at least one of a dielectric layer or a bonding film, the interface layer coupling the first glass substrate layer and the second glass substrate layer together; and

an interconnect extending through at least a portion of the first glass substrate layer and at least a portion of the second glass substrate layer, wherein the interconnect includes a first portion extending through the first glass substrate layer and a second portion extending through the second glass substrate layer, and wherein the first portion of the interconnect and the second portion of the interconnect are offset along a lateral direction.

10. The glass core as defined in claim 9 , wherein the interconnect includes a through-glass via (TGV) extending through at least a portion of the glass core.

11. The glass core as defined in claim 10 , wherein TGV is at least partially surrounded by light absorption material.

12. The glass core as defined in claim 11 , wherein the light absorption material extends through the first glass substrate layer or the second glass substrate layer.

13. The glass core as defined in claim 11 , further including a copper layer, the light absorption material between the copper layer and at least one of the first glass substrate layer or the second glass substrate layer.

14. The glass core as defined in claim 9 , wherein the first glass substrate layer or the second glass substrate layer includes a protrusion to be received by a groove of another of the first glass substrate layer or the second glass substrate layer.

15. A method comprising:

coupling a first glass substrate to a second glass substrate with an interface layer positioned therebetween, the interface layer including at least one of a bonding film or a dielectric layer; and

defining an interconnect that extends through at least a portion of the first glass substrate and at least a portion of the second glass substrate, wherein the interconnect includes a first portion extending through the first glass substrate and a second portion extending through the second glass substrate, and wherein the first portion of the interconnect and the second portion of the interconnect are offset along a lateral direction.

16. The method as defined in claim 15 , further including:

providing a plug to at least one of the first glass substrate or the second glass substrate;

drilling the plug to define a central aperture thereof; and

metalizing the central aperture to define the interconnect.

17. The method as defined in claim 15 , wherein at least one of the first glass substrate or the second glass substrate is patterned with a pattern prior to being coupled to another of the first glass substrate or the second glass substrate.

18. The method as defined in claim 17 , further including activating at least one of the first glass substrate or the second glass substrate to define an activated region thereof by directing UV light toward the pattern.

19. The method as defined in claim 18 , further including etching the activated region to define an aperture that corresponds to the interconnect.

20. The method as defined in claim 15 , wherein the coupling of the first glass substrate to the second glass substrate includes compressing the interface layer between the first glass substrate and the second glass substrate.

21. The method as defined in claim 15 , wherein the coupling of the first glass substrate to the second glass substrate includes aligning a protrusion of the first glass substrate or the second glass substrate to a groove of another of the first glass substrate or the second glass substrate.

22. The apparatus as defined in claim 1 , wherein the first portion of the interconnect and the second portion of the interconnect partially intersect along the lateral direction.

23. The apparatus as defined in claim 22 , wherein a region of the interface layer between the first portion of the interconnect and the second portion of the interconnect includes an angled edge.