Heat sink system
A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.
1. A heat sink for extracting heat from circuitry during operation of the circuitry, the heat sink comprising:
a solid, thermally conductive material having
a first surface configured to
support components of the circuitry disposed on the first surface in selectively arranged positions, and
be thermally coupled with the circuitry such that heat generated by the components of the circuitry is transferred through the first surface into the solid, thermally conductive material and such that the heat is distributed within the solid, thermally conductive material based on at least one of the selectively arranged positions of the components on the first surface;
a second surface opposing the first surface, the second surface arranged to contact a cooling medium; and
a cover arranged and configured to encapsulate the cooling medium between the cover and the second surface and form, in conjunction with the second surface, channels that cause the cooling medium to flow in a flow direction;
wherein a cross-section of the second surface that is orthogonal to the flow direction is shaped in accordance with a predetermined linear combination of sinusoidal spatial harmonics including a total number of terms N that satisfies the conditions 2≤N≠∞; and
wherein the linear combination of sinusoidal spatial harmonics was predetermined based on the distribution of the heat transferred between the first surface of the solid, thermally conductive material and the second surface thereof.
2. The heat sink of claim 1 wherein the cooling medium is a cooling fluid.
3. The heat sink of claim 1 wherein the cross-section of the second surface is substantially uniform along the flow direction of the cooling medium.
4. A power module comprising:
a substrate;
the circuitry disposed on the substrate; and
the heat sink of claim 1 , wherein the heat sink is disposed on the substrate and is thermally coupled with the circuitry.
5. The power module of claim 4 comprising:
a manifold fluidly connected to the channels of the heat sink and a source of cooling fluid; and
the manifold configured to supply the cooling fluid, at a first temperature, from the source of the cooling fluid to the heat sink, and return the cooling fluid, at a second temperature larger than the first temperature, from the heat sink back to the source of the cooling fluid.
6. The power module of claim 5 wherein the cooling fluid includes one or more of water and glycol.
7. The power module of claim 4 , wherein the power module is configured as a power-converter device, wherein the circuitry comprises Si or SiC-based power-electronic switches.