Compact opto-electronic modules and fabrication methods for such modules
Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
1. An optoelectronic module comprising:
an optoelectronic device mounted on a substrate;
a transparent overmold laterally surrounding sides of the optoelectronic device and covering a top surface of the optoelectronic device, wherein the transparent overmold is in direct contact with the optoelectronic device, wherein the top surface of the transparent overmold is slanted with respect to a plane of the substrate on which the optoelectronic device is mounted;
a passive optical element on a top surface of the transparent overmold, wherein the passive optical element is transparent; and
sidewalls laterally surrounding the optoelectronic device and in direct contact with sides of the transparent overmold.
2. The optoelectronic module of claim 1 , wherein the sidewalls are composed of a material that is substantially non-transparent to light emitted by or detectable by the optoelectronic device.
3. The optoelectronic module of claim 1 , wherein the passive optical element is a lens.
4. The optoelectronic module of claim 1 , wherein the top surface of the transparent overmold has a curved shape that corresponds to a shape of a surface of the passive optical element.
5. The optoelectronic module of claim 1 , wherein the at least a portion of the sidewalls serves as an outer wall of the module.
6. The optoelectronic module of claim 1 , the passive optical element is composed of a material having a higher index of refraction than that of the transparent overmold.
7. The optoelectronic module of claim 1 , wherein the transparent overmold is composed of a curable polymer.
8. The optoelectronic module of claim 1 , wherein the sidewalls are in direct contact with the slanted top surface of the transparent overmold.