Embedded substrate voltage converter module
Voltage converter inlay modules are provided for embedding within a package substrate, and are configured to supply power to a processor, or similar digital circuit, which is mounted to the package substrate. The package substrate is typically mounted to a circuit board, or similar. The circuit board provides high-voltage, low-current power to the voltage converter module which, in turn, provides low-voltage high-current power to the processor. The voltage converter inlay provides largely vertical current conduction from the circuit board to the processor, thereby reducing conduction losses incurred by lateral current conduction. The location of the voltage converter inlay between the circuit board and the microprocessor minimizes radiation of electromagnetic interference. The number of terminals allocated for providing power to the package substrate may be minimized due to the voltage converter inlay inputting fairly low levels of current. The high-current power required by the processor is constrained within the package substrate.
1. A switching voltage converter module configured to conduct current in a vertical direction, comprising:
a substrate having a first main surface and a second main surface that is opposite the first main surface;
an input terminal at the first main surface and configured for connection to a power source;
an output terminal at the second main surface and configured for connection to a load;
one or more power switches embedded in the substrate between the first and second main surfaces; and
an inductor embedded in the substrate and coupled to the one or more power switches,
wherein the one or more power switches and switch nodes coupled to the one or more power switches are covered by a metallization of the output terminal or by a combination of the metallization of the output terminal and a metallization of one or more reference terminals.
2. The switching voltage converter module of claim 1 , wherein the inductor comprises a coupled inductor that includes:
a first winding on a common core and having a first inductor input, which is coupled to a first switch node, and a first inductor output; and
a second winding on the common core and having a second inductor input, which is coupled to a second switch node, and a second inductor output.
3. The switching voltage converter module of claim 2 , further comprising:
a first phase including the first winding, a first power switch coupled between the input terminal and the first switch node, and a second power switch coupled between the first switch node and a reference; and
a second phase including the second winding, a third power switch coupled between the input terminal and the second switch node, and a fourth power switch coupled between the second switch node and the reference,
wherein the one or more power switches include the first, the second, the third and the fourth power switches.
4. The switching voltage converter of claim 3 , wherein each of the first and second phases is a buck converter configured to convert an input voltage at the input terminal to an output voltage at the output terminal, and wherein the first and second inductor outputs are coupled to the output terminal.
5. The switching voltage converter module of claim 1 , wherein the output terminal comprises an interior portion of the second main surface, and an exterior portion of the second main surface comprises the one or more reference terminals.
6. The switching voltage converter module of claim 5 , wherein the one or more reference terminals of the second main surface comprises a contiguous metallization that surrounds the metallization of the output terminal.
7. The switching voltage converter module of claim 1 , wherein the inductor is placed within a cavity of the switching voltage converter module.
8. The switching voltage converter module of claim 1 , wherein the one or more power switches are vertical power metal-oxide semiconductor field-effect transistors (MOSFETs).
9. The switching voltage converter module of claim 1 , wherein at least two of the one or more power switches are monolithically integrated in a same semiconductor die.
10. The switching voltage converter module of claim 1 , wherein at least a first one of the one or more power switches and a first switch driver configured for driving the first power switch are monolithically integrated in a same semiconductor die.
11. The switching voltage converter module of claim 1 , further comprising:
an input capacitor coupled between the input terminal and a reference, and embedded in the substrate between the first and second main surfaces.
12. The switching voltage converter module of claim 11 , further comprising:
an output capacitor coupled between the output terminal and the reference, and embedded in the substrate between the first and second main surfaces.
13. The switching voltage converter module of claim 12 , wherein the output capacitor is a vertical capacitor having a first terminal proximate the first main surface, and a second terminal proximate the second main surface.
14. The switching voltage converter module of claim 12 , wherein the input capacitor and the output capacitor are both silicon capacitors.
15. The switching voltage converter module of claim 12 , wherein the input capacitor is a silicon capacitor that is monolithically integrated in a same die as at least one of the one or more power switches.
16. The switching voltage converter module of claim 15 , wherein the output capacitor is a silicon capacitor that is monolithically integrated with the same die.
17. A processor system comprising:
a processor substrate;
a processor attached to the processor substrate; and
a switching voltage converter module comprising:
a converter substrate having a first main surface and a second main surface that is opposite the first main surface;
a converter input terminal at the first main surface and configured for connection to a power source;
a converter output terminal at the second main surface and connected to an input power terminal of the processor substrate;
one or more power switches embedded in the converter substrate between the first and second main surfaces; and
an inductor embedded in the converter substrate and coupled to the one or more power switches,
wherein the one or more power switches and switch nodes coupled to the one or more power switches are covered by a metallization of the converter output terminal or by a combination of the metallization of the converter output terminal and a metallization of one or more reference terminals.
18. The processor system of claim 17 , wherein the switching voltage converter module further comprises an input capacitor coupled between the input terminal and a reference, and embedded in the substrate between the first and second main surfaces.
19. A circuit board system comprising:
a circuit board having a first surface;
a power source; and
a processor system comprising:
a processor substrate electrically connected to the first surface;
a processor attached to the processor substrate; and
a switching voltage converter module comprising:
a converter substrate having a first main surface and a second main surface that is opposite the first main surface;
a converter input terminal at the first main surface and configured for connection to the power source via a power terminal of the circuit board;
a converter output terminal at the second main surface and connected to an input power terminal of the processor substrate;
one or more power switches embedded in the converter substrate between the first and second main surfaces; and
an inductor embedded in the converter substrate and coupled to the one or more power switches,
wherein the one or more power switches and switch nodes coupled to the one or more power switches are covered by a metallization of the converter output terminal or by a combination of the metallization of the converter output terminal and a metallization of one or more reference terminals.
20. The circuit board system of claim 19 , further comprising:
a socket attached to the first surface and configured to provide electrical connection to the processor substrate of the processor system.