Patent Assignment
Reel/Frame 060618/0317
Assignment of Assignor's Interest
Recorded: 2022-07-26
Pages: 5
Assignor
INFINEON TECHNOLOGIES AMERICAS CORP.
Executed: 2022-07-15
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Properties
(5)
Semiconductor Package with Low Parasitic Connection to Passive Device
Embedded Substrate Voltage Converter Module
Embedded Package with Electrically Isolating Dielectric Liner
Semiconductor Device Package Thermally Coupled to Passive Element
Multi-Device Power Module Arrangement
Application:
17/742,767 →
Publication:
US 2023/0369256
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 17, 2021
From: MEDIC, URBAN; NAEVE, TOMASZ
To: INFINEON TECHNOLOGIES AG
Reel/Frame 057205/0567 →
Assignment of Assignor's Interest
Aug 17, 2021
From: CHO, EUNG SAN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 057205/0656 →
Assignment of Assignor's Interest
Oct 22, 2021
From: CLAVETTE, DANNY
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 057876/0095 →
Assignment of Assignor's Interest
Nov 10, 2021
From: CHO, EUNG SAN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 058070/0975 →
Assignment of Assignor's Interest
May 12, 2022
From: KESSLER, ANGELA
To: INFINEON TECHNOLOGIES AG
Reel/Frame 060007/0116 →
Assignment of Assignor's Interest
May 12, 2022
From: KSHIRSAGAR, KUSHAL; CHO, EUNG SAN; HUANG, WENKANG; PULLEN, STEPHEN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 059987/0145 →
Assignment of Assignor's Interest
May 12, 2022
From: KSHIRSAGAR, KUSHAL; CHO, EUNG SAN; CLAVETTE, DANNY; HUANG, WENKANG
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 059988/0263 →
Assignment of Assignor's Interest
May 12, 2022
From: GNANAPPA, ARUN KUMAR; KESSLER, ANGELA; MUELLER, MARCEL RENE
To: INFINEON TECHNOLOGIES AG
Reel/Frame 059986/0733 →