Patent Assignment
Reel/Frame 059987/0145
Assignment of Assignor's Interest
Recorded: 2022-05-12
Pages: 6
Assignors
KSHIRSAGAR, KUSHAL
Executed: 2022-05-09
CHO, EUNG SAN
Executed: 2022-05-04
HUANG, WENKANG
Executed: 2022-05-11
PULLEN, STEPHEN
Executed: 2022-05-10
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property
(1)
Semiconductor Device Package Thermally Coupled to Passive Element
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2022
From: GNANAPPA, ARUN KUMAR; KESSLER, ANGELA; MUELLER, MARCEL RENE
To: INFINEON TECHNOLOGIES AG
Reel/Frame 059986/0733 →
Assignment of Assignor's Interest
Jul 26, 2022
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 060618/0317 →