IP Library Assignment 059986/0733
Patent Assignment
Reel/Frame 059986/0733

Assignment of Assignor's Interest

Recorded: 2022-05-12 Pages: 3
Assignors
GNANAPPA, ARUN KUMAR
Executed: 2022-05-04
KESSLER, ANGELA
Executed: 2022-05-04
MUELLER, MARCEL RENE
Executed: 2022-05-06
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Semiconductor Device Package Thermally Coupled to Passive Element
Application: 17/742,666 →
Publication: US 2023/0369160
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2022
From: KSHIRSAGAR, KUSHAL; CHO, EUNG SAN; HUANG, WENKANG; PULLEN, STEPHEN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 059987/0145 →
Assignment of Assignor's Interest Jul 26, 2022
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 060618/0317 →