Power module and process for manufacturing the same
Power module has press-fit pins for the electrical and mechanical connection for the terminals, insertable into sleeves on the substrate. The substrate rests on a baseplate. Potential alignment frame ensures the accuracy of all elements. The mechanical and electrical connection of the power and signal terminals is realized by multiple (high-current) or single press-fit connections. When inserting the pins, they are fitting tightly in these sleeves by overcoming a frictional force and after fitting is established, for each single pin-fit, an electrical contact over a surface is established.
1. A process for manufacturing a power module comprising:
placing a bottom part baseplate-alignment frame onto substrates, wherein the power module comprises a top-part housing assembly and the bottom part baseplate-alignment frame, wherein the top-part housing assembly includes integrated nuts and a molded power terminal and signal terminal in a plastic matrix, wherein the power terminal and the signal terminal result in one or more downward facing press-fit pins, wherein the bottom part baseplate-alignment frame includes a baseplate with soldered/sintered substrates and a soldered/sintered alignment frame of high-temperature plastic that comprises a space and pillars to position underlying substrates during a solder/sinter process to follow, wherein a distance of sleeves stick out of the alignment frame and is individually adjustable to compensate a bow of the baseplate, the process characterized in that, before pressing the top-part housing assembly of the power module with downwardly directed press-fit pins into corresponding sleeves, the alignment frame is placed by a robot precisely onto the substrates by:
a) the robot picking and placing a temporary fixture-set onto a baseplate,
b) the robot picking and placing solder/sinter onto the baseplate within the fixture set,
c) the robot picking and placing the substrates onto the solder/sinter within the fixture set,
d) the robot picking and placing the alignment frame onto the substrates within the fixture set,
e) heat-soldering/-sintering the alignment frame with the substrates, solder/sinter layer onto the baseplate by heat applied while the alignment frame aligns the substrates underneath during this high temperature processing, and
f) the robot removing the fixture set after cooling down of the soldered/sintered unit.
2. The process for manufacturing a power module according to claim 1 , wherein after step f); applying high force in vertical direction exceeding 1 kN by the robot, in order to press the top-part housing assembly with the downwardly directed press-fit pins into corresponding sleeves which are held by the alignment frame to establish a permanent tight mechanical and electrical connection to the substrates below, and contemporarily welding and/or gluing together the housing and baseplate along their outer edges.
3. The process of claim 1 , wherein the molded power- and signal terminals and associated ridges form a structure that is capable of supporting pressure forces beyond 1 kN.
4. A power module comprising:
a top-part housing assembly with integrated nuts and molded power- and signal terminals in a plastic matrix, wherein the power and signal terminals result in one or more downward facing press-fit pins; and
a bottom part baseplate-alignment frame assembly which includes a baseplate with soldered/sintered substrates and a soldered/sintered alignment frame of high-temperature plastic that comprises a space and pillars to position underlying substrates during a solder/sinter process to follow, wherein a distance of the sleeves stick out of the alignment frame and is individually adjustable to compensate a bow of the baseplate, wherein before pressing the top-part housing assembly with downwardly directed press-fit pins into corresponding sleeves, the alignment frame is placed by a robot onto the substrates by placing a temporary fixture set onto a baseplate, placing of solder/sinter onto the baseplate within the fixture set, placing the substrates onto the solder/sinter within the fixture set, placing the alignment frame onto the substrates within the fixture set, heat-soldering/-sintering the alignment frame with the substrates, solder/sinter layer onto the base plate by heat applied while the alignment frame aligns the substrates underneath during the high temperature processing, and removing the fixture set after cooling down of the soldered/sintered unit.
5. The power module of claim 4 , further comprising copper sleeves of one or more dimensions positioned and oriented for an inter-substrate electrical connection.
6. The power module of claim 4 , further comprising positioning and orienting copper sleeves of one or more dimensions and copper sheets for an inter-substrate electrical connection on substrates.
7. The power module of claim 4 , wherein adjusted distances of the sleeves sticking out of the alignment frame compensate a bow of the baseplate.
8. The power module of claim 4 , wherein the soldered/sintered alignment frame is connected mechanically and electrically to the top-part housing assembly by friction forces of press-fit pins which penetrate into corresponding sleeves.
9. The power module of claim 8 , wherein the corresponding sleeves are held by an alignment frame and are connected to provide a mechanical and electrical connection to the substrates by the press-fit pins.
10. The power module of claim 8 , wherein the molded power- and signal terminals and associated ridges form a structure that is capable of supporting pressure forces beyond 1 kN.