IP Library › Granted Patent US 12,315,702
Granted Patent B2
US 12,315,702 · App. 17/510,704 · Granted May 27, 2025

Plasma processing apparatus

Inventor: Takaki Kobune (Miyagi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01J37/32522H01J37/32513H01J37/32651
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Quick Facts
Patent No.
US 12,315,702
App. No.
17/510,704
Granted
May 27, 2025
Kind
B2
Abstract

A plasma processing apparatus includes a cylindrical chamber defining a processing space in which a substrate is processed, and a member constituting an outer circumference of the cylindrical chamber. The member includes at least one flow path inlet configured to allow a heat transfer medium to flow in therethrough, at least one flow path outlet configured to allow the heat transfer medium to flow out therethrough, at least one flow path connecting the flow path inlet and the flow path outlet to one another to allow the heat transfer medium to flow therethrough, and at least one folded-back portion formed in the flow path. The flow path inlet and the flow path outlet are located close to each other, and the flow path is formed at a specific angle in a circumferential direction of the member.

Claims (23)

1. A plasma processing apparatus comprising:

a cylindrical chamber defining a processing space in which a substrate is processed; and

a shutter member configured to be driven up and down to open and close a substrate transportation opening formed in an inner wall of the cylindrical chamber,

wherein the shutter member includes:

a valve body;

a first ring member located directly below the valve body:

a heater embedded in the first ring member;

a second ring member located directly below the first ring member;

at least one flow path inlet formed inside the second ring and configured to allow a heat transfer medium to flow in therethrough;

at least one flow path outlet formed inside the second ring and configured to allow the heat transfer medium to flow out therethrough;

at least one flow path connecting the flow path inlet and the flow path outlet to one another inside the second ring to allow the heat transfer medium to flow therethrough; and

a folded-back portion formed in each of the at least one flow path,

wherein a flow direction of the heat transfer medium in a flow path portion before the folded-back portion in a circumferential direction of the flow path is opposite of a flow direction of the heat transfer medium in a flow path portion after the folded-back portion in the circumferential direction of the flow path, and

wherein the flow path inlet and the flow path outlet are located close to each other.

2. The plasma processing apparatus of claim 1 , wherein the flow path is formed in a substantially annular or arc shape corresponding to an inner wall of the cylindrical chamber.

3. The plasma processing apparatus of claim 2 , wherein two or more flow paths are arranged in a radial direction of the shutter member.

4. The plasma processing apparatus of claim 3 , wherein, when the shutter member is cut in a radial direction, cross-sectional areas of the two or more flow paths are substantially equal to each other.

5. The plasma processing apparatus of claim 3 , wherein a distance from the flow path inlet to the folded-back portion is substantially equal to a distance from the folded-back portion to the flow path outlet.

6. The plasma processing apparatus of claim 5 , wherein, when the shutter member is cut in a radial direction, cross-sectional areas of the two or more flow paths are substantially equal to each other.

7. The plasma processing apparatus of claim 6 , wherein a heat insulating material is provided inside at least one of the flow path inlet and the flow path outlet.

8. The plasma processing apparatus of claim 1 , wherein two or more flow paths are arranged in a radial direction of the shutter member.

9. The plasma processing apparatus of claim 1 , wherein a distance from the flow path inlet to the folded-back portion is substantially equal to a distance from the folded-back portion to the flow path outlet.

10. The plasma processing apparatus of claim 1 , wherein a heat insulating material is provided inside at least one of the flow path inlet and the flow path outlet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: KOBUNE, TAKAKI
To: TOKYO ELECTRON LIMITED
Reel/Frame 058925/0785 →
Priority Claims (1)
JP 2020-179743 · Oct 27, 2020 · national
Continuity (1)
Related Publication 20220130645A1 · Apr 28, 2022
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