Granted Patent B2

US 12,230,442 · App. 17/511,784 · Granted Feb 18, 2025

Inventor: Laurent Desclos (San Diego, CA)

Assignee: KYOCERA AVX Components Corporation

H01G11/82H01G11/18

Abstract

Claims (41)

1. A surface mountable ultracapacitor device, the device comprising:

a package including sidewalls extending in a direction generally perpendicular to a base to define an upper end wherein an interior cavity is defined between an inner surface of the base and the sidewalls;

first and second conductive members disposed on the inner surface of the base;

first and second external terminations on the outer surface of the base and electrically connected to the first and second conductive members, respectively;

an ultracapacitor positioned within the interior cavity and including a housing and an electrode assembly and electrolyte within the housing, the ultracapacitor including first and second leads electrically connected to the first and second conductive members, respectively;

a resin provided within the interior cavity and encapsulating at least a portion of the ultracapacitor; and

one or more vents extending through the resin, wherein 30% or less of the length of the one or more vents extends from a surface of the resin.

2. The device of claim 1 , wherein the sidewalls and the base contain a ceramic material.

3. The device of claim 1 , wherein the sidewalls and the base contain a metal.

4. The device of claim 1 , wherein the first and second conductive members extend in a plane that is generally parallel to the base.

5. The device of claim 1 , wherein the first and second terminations extend in a plane that is generally parallel to the base.

6. The device of claim 1 , wherein the conductive members and terminations contain a metal.

7. The device of claim 1 , wherein the conductive members extend through the base to form the terminations.

8. The device of claim 1 , wherein a conductive trace is attached to the first conductive member and extends through the base and is attached to the first external termination, and further wherein a conductive trace is attached to the second conductive member and extends through the base and is attached to the second external termination.

9. The device of claim 1 , wherein the leads extend from the same end of the housing of the ultracapacitor.

10. The device of claim 1 , wherein the leads extend from opposing ends of the housing of the ultracapacitor.

11. The device of claim 1 , wherein the resin is a thermoset.

12. The device of claim 11 , wherein the resin is an epoxy resin.

13. The device of claim 1 , wherein the resin is a thermoplastic.

14. The device of claim 1 , wherein the resin occupies at least 50 vol. % of the interior cavity of the package, the interior cavity defined as after positioning the ultracapacitor.

15. The device of claim 1 , wherein the resin covers 90% or more of the exposed area of the ultracapacitor after positioning the ultracapacitor.

16. The device of claim 1 , wherein the one or more vents contain a thermoset.

17. The device of claim 1 , wherein the one or more vents contain a thermoplastic.

18. The device of claim 1 , wherein the one or more vents extend 70% or more of the distance between a surface of the resin and the housing of the ultracapacitor.

19. The device of claim 1 , wherein 20% or less of the length of the vent extends from a surface of the resin.

20. A printed circuit board including the surface mountable ultracapacitor device of claim 1 .

21. A communications device including the surface mountable ultracapacitor device of claim 1 .

22. A surface mountable ultracapacitor device, the device comprising:

a package including sidewalls extending in a direction generally perpendicular to a base to define an upper end wherein an interior cavity is defined between an inner surface of the base and the sidewalls;

first and second conductive members disposed on the inner surface of the base;

first and second external terminations on the outer surface of the base and electrically connected to the first and second conductive members, respectively;

an ultracapacitor positioned within the interior cavity and including a housing and an electrode assembly and electrolyte within the housing, the ultracapacitor including first and second leads electrically connected to the first and second conductive members, respectively;

a resin provided within the interior cavity and encapsulating at least a portion of the ultracapacitor; and

one or more vents extending through the resin and at least to a surface of the resin, wherein the one or more vents contain a thermoset.

23. A surface mountable ultracapacitor device, the device comprising:

a package including sidewalls extending in a direction generally perpendicular to a base to define an upper end wherein an interior cavity is defined between an inner surface of the base and the sidewalls;

first and second conductive members disposed on the inner surface of the base;

first and second external terminations on the outer surface of the base and electrically connected to the first and second conductive members, respectively;

an ultracapacitor positioned within the interior cavity and including a housing and an electrode assembly and electrolyte within the housing, the ultracapacitor including first and second leads electrically connected to the first and second conductive members, respectively;

a resin provided within the interior cavity and encapsulating at least a portion of the ultracapacitor; and

one or more vents extending through the resin and at least to a surface of the resin, wherein the one or more vents contain a thermoplastic.

Assignments (1)

Continuity (2)

References Cited (26)