Multilayer capacitor and board component having the same
The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.
1. A multilayer capacitor comprising:
a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces, and opposing each other;
first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively;
an insulator disposed on the first surface of the capacitor body;
a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and
a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction,
wherein t/(⅙×π×d 3 ) is 12596.621815 or less, t/(⅙×π×d 3 ) obtained by dividing a thickness t of the ins a grain volume ⅙×π×d 3 of a grain of the dielectric layer in which d is an average grain size of grains of the dielectric layer.
2. The multilayer capacitor of claim 1 , wherein the insulator is disposed to cover the first and second band portions on the first surface of the capacitor body.
3. The multilayer capacitor of claim 1 , wherein a ratio of to a height of the multilayer capacitor is 0.169 or less.
4. The multilayer capacitor of claim 1 , wherein the capacitor body includes:
an active region in which the first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and
an upper cover and a lower cover respectively disposed on upper and lower surfaces of the active region, and
in the direction perpendicular to the third and fourth surfaces, the insulator at most overlaps the lower cover among the active region, the upper cover, and the lower cover.
5. The multilayer capacitor of claim 1 , wherein the first external electrode includes a first connection portion disposed on the third surface of the capacitor body and a first band portion extending from the first connection portion onto a portion of the first surface of the capacitor body,
the second external electrode includes a second connection portion disposed on the fourth surface of the capacitor body and a second band portion extending from the second connection portion onto a portion of the first surface of the capacitor body, and
in the direction perpendicular to the third and fourth surfaces, the insulator is not disposed on the first and second connection portions.
6. The multilayer capacitor of claim 1 , wherein is 22 to 93 μm.
7. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 4.7 μF, and
a ratio of t to a height of the multilayer capacitor is 0.033 or less.
8. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 4.7 μF, and
t/(⅙×π×d 3 ) is 2137.608550 or less.
9. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 4.7 μF,
a ratio of a thickness of the insulator to a height of the multilayer capacitor is 0.033 or less, and
t/(⅙×π×d 3 ) is 2137.608550 or less.
10. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 10 μF, and
a ratio of t to a height of the multilayer capacitor is 0.074 or less.
11. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 10 μF, and
t/(⅙×π×d 3 ) is 4711.282919 or less.
12. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 10 μF,
a ratio of t to a height of the multilayer capacitor is 0.074 or less, and
t/(⅙×π×d 3 ) is 4711.282919 or less.
13. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 15 μF, and
a ratio of t to a height of the multilayer capacitor is 0.123 or less.
14. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 15 μF, and
t/(⅙×π×d 3 ) is 7279.469165 or less.
15. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 15 μF,
a ratio of t to a height of the multilayer capacitor is 0.123 or less, and
t/(⅙×π×d 3 ) is 7279.469165 or less.
16. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 2.2 μF, and
a ratio of t to a height of the multilayer capacitor is 0.161 or less.
17. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 2.2 μF, and
t/(⅙×π×d 3 ) is 5444.19158 or less.
18. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a capacity of 2.2 μF,
a ratio of t to a height of the multilayer capacitor is 0.161 or less, and
t/(⅙×π×d 3 ) is 5444.19158 or less.
19. The multilayer capacitor of claim 1 , wherein the first and second external electrodes include copper.
20. The multilayer capacitor of claim 1 , wherein the first and second conductive resin layers include a conductive metal and a resin.
21. The multilayer capacitor of claim 1 , wherein the first and second external electrodes include copper, and
the first and second conductive resin layers include a conductive metal and a resin.
22. The multilayer capacitor of claim 1 , wherein the insulator includes epoxy.
23. The multilayer capacitor of claim 1 , further comprising first and second plating layers covering the first and second conductive resin layers, respectively.
24. The multilayer capacitor of claim 23 , wherein the first and second plating layers include first and second nickel plating layers covering, respectively, the first and second conductive resin layers, and first and second tin plating layers covering, respectively, the first and second nickel plating layers.
25. The multilayer capacitor of claim 1 , wherein the multilayer capacitor has a length of 1.3 mm or less in the direction perpendicular to the third and fourth surfaces of the capacitor body, and has a length of 0.65 mm or less in a direction perpendicular to the fifth and sixth surfaces of the capacitor body.
26. The multilayer capacitor of claim 1 , wherein among the first and second surfaces of the capacitor body, the insulator is disposed only on the first surface.
27. A board component having a multilayer capacitor, comprising:
a board having first and second electrode pads disposed on one surface thereof; and
a multilayer capacitor,
wherein the multilayer capacitor includes:
a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces, and opposing each other;
first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively;
an insulator disposed on the first surface of the capacitor body;
a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction;
a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction; and
first and second plating layers covering the first and second conductive resin layers, respectively,
the multilayer capacitor is mounted such that the first and second plating layers are connected to the first and second electrode pads, respectively, and
wherein t/(⅙×π×d 3 ) is 12596.621815 or less, t/(⅙×π×d 3 ) obtained by dividing a thickness t of the ins a grain volume ⅙×π×d 3 of a grain of the dielectric layer in which d is an average grain size of grains of the dielectric layer.
28. The board component of claim 27 , wherein the first and second plating layers of the multilayer capacitor are mounted on the first and second electrode pads, respectively, so that the insulator faces the board.
29. The multilayer capacitor of claim 1 ,
the first external electrode includes a first connection portion disposed on the third surface of the capacitor body and a first band portion extending from the first connection portion onto a portion of the first surface of the capacitor body,
the second external electrode includes a second connection portion disposed on the fourth surface of the capacitor body and a second band portion extending from the second connection portion onto a portion of the first surface of the capacitor body, and
in the direction perpendicular to the third and fourth surfaces, a length of the insulator is no more than a distance between an outer surface of the first connection portion and an outer surface of the second connection portion.
30. The board component of claim 27 , wherein the capacitor body includes:
an active region in which the first and second internal electrodes are alternately disposed with the dielectric layers interposed therebetween, and
an upper cover and a lower cover respectively disposed on upper and lower surfaces of the active region, and
in the direction perpendicular to the third and fourth surfaces, the insulator at most overlaps the lower cover among the active region, the upper cover, and the lower cover.
31. The board component of claim 27 , wherein the first external electrode includes a first connection portion disposed on the third surface of the capacitor body and a first band portion extending from the first connection portion onto a portion of the first surface of the capacitor body,
the second external electrode includes a second connection portion disposed on the fourth surface of the capacitor body and a second band portion extending from the second connection portion onto a portion of the first surface of the capacitor body, and
in the direction perpendicular to the third and fourth surfaces, the insulator is not disposed on the first and second connection portions.