IP Library Granted Patent US 9,208,949
Granted Patent B2
US 9,208,949 · App. 14/209,420 · Granted Dec 8, 2015

Multilayer ceramic capacitor

Inventors: Young Ghyu Ahn (Suwon-Si, KR); Sang Soo Park (Suwon-Si, KR); Hwi Geun Im (Suwon-Si, KR); Hyun Tae Kim (Suwon-Si, KR); Soon Ju Lee (Suwon-Si, KR); Heung Kil Park (Suwon-Si, KR); Byoung Hwa Lee (Suwon-Si, KR); Min Cheol Park (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/224H01G4/12H01G4/228H01G4/232H01G4/30
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Quick Facts
Patent No.
US 9,208,949
App. No.
14/209,420
Granted
Dec 8, 2015
Kind
B2
Abstract

A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.

Claims (27)

1. A multilayer ceramic capacitor comprising:

a ceramic body including a plurality of dielectric layers and having first and second surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction;

first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and

first and second external electrodes electrically connected to the first and second internal electrodes, respectively,

wherein the first and second external electrodes includes:

first and second internal conductive layers extended from the first and second end surfaces of the ceramic body to portions of the first surface, respectively;

first and second insulating layers extended from the first and second internal conductive layers on the first and second end surfaces to portions of the first and second internal conductive layers on the first surface, respectively, and having a length shorter than that of the first and second internal conductive layers in such a manner that portions of the first and second internal conductive layers are exposed to the first surface; and

first and second external conductive layers formed on the first and second internal conductive layers on the first surface, respectively.

2. The multilayer ceramic capacitor of claim 1 , wherein the first and second external conductive layers are simultaneously formed on the first internal conductive layer and the first insulating layer on the first surface, and the second internal conductive layer and the second insulating layer on the first surface, respectively.

3. The multilayer ceramic capacitor of claim 1 , wherein the first and second insulating layers have a thickness of 50 μm or more.

4. The multilayer ceramic capacitor of claim 1 , wherein the first and second insulating layers contain an insulating epoxy.

5. The multilayer ceramic capacitor of claim 1 , wherein the first and second external conductive layers contain a conductive epoxy.

6. A multilayer ceramic capacitor comprising:

a ceramic body including a plurality of dielectric layers and having first and second surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction;

first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and

first and second external electrodes electrically connected to the first and second internal electrodes, respectively,

wherein the first and second external electrodes respectively includes:

first and second internal conductive layers extended from the first and second end surfaces of the ceramic body to portions of the first surface, respectively;

first and second insulating layers formed on the first and second internal conductive layers on the first surface, respectively, while having a width narrower than that of the first and second internal conductive layers so as to expose portions of the first and second internal conductive layers; and

first and second external conductive layers formed on the first and second internal conductive layers on the first surface, respectively.

7. The multilayer ceramic capacitor of claim 6 , wherein the first and second external conductive layers are simultaneously formed on the first internal conductive layer and the first insulating layer on the first surface, and the second internal conductive layer and the second insulating layer on the first surface, respectively.

8. The multilayer ceramic capacitor of claim 6 , further comprising a third insulating layer formed on the first surface of the ceramic body to connect the first and second insulating layers to each other.

9. The multilayer ceramic capacitor of claim 6 , wherein the first and second insulating layers are extended from the first and second internal conductive layers on the first surface to portions of the first and second end surfaces, respectively.

10. The multilayer ceramic capacitor of claim 6 , wherein the first and second external conductive layers are extended from the first and second internal conductive layers on the first surface to portions of the first and second side surfaces, respectively.

11. The multilayer ceramic capacitor of claim 6 , wherein the first and second insulating layers have a thickness of 50 μm or more.

12. The multilayer ceramic capacitor of claim 6 , wherein the first and second insulating layers contain an insulating epoxy.

13. The multilayer ceramic capacitor of claim 6 , wherein the first and second external conductive layers contain a conductive epoxy.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2014
From: AHN, YOUNG GHYU; PARK, SANG SOO; IM, HWI GEUN; KIM, HYUN TAE; LEE, SOON JU; PARK, HEUNG KIL; LEE, BYOUNG HWA; PARK, MIN CHEOL
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 032432/0795 →
Priority Claims (1)
KR 10-2013-0133450 · Nov 5, 2013 · national
Continuity (1)
Related Publication 20150124370A1 · May 7, 2015