Flow cell coating methods
In an example method, a water-soluble protective coating solution is applied over a bonding region and either i) a patterned region of a patterned structure or ii) a lane region of a non-patterned structure. The patterned region includes depressions having at least a polymeric hydrogel therein, and interstitial regions separating the depressions. The lane region includes a lane having at least the polymeric hydrogel therein. The water-soluble protective coating solution is dried to form a solid coating or a gel coating over the bonding region and over either i) the patterned region or ii) the lane region. Portions of the solid coating or the gel coating are selectively removed from the bonding region while leaving other portions of the solid coating or the gel coating over either i) the patterned region or ii) the lane region.
1. A method, comprising:
applying a water-soluble protective coating solution over a bonding region and over either i) a patterned region of a patterned structure, the patterned region including depressions having at least a polymeric hydrogel therein, and interstitial regions separating the depressions or ii) a lane region of a non-patterned structure, the lane region including a lane having at least the polymeric hydrogel therein;
drying the water-soluble protective coating solution to form a solid coating or a gel coating over the bonding region and over either i) the patterned region or ii) the lane region;
after drying the water-soluble protective coating solution:
applying a photoresist over the solid coating or the gel coating; and
patterning the photoresist to remove the photoresist from portions of the solid coating or the gel coating over the bonding region and to generate an insoluble photoresist over other portions of the solid coating or the gel coating over either i) the patterned region or ii) the lane region; and
selectively removing the portions of the solid coating or the gel coating from the bonding region while leaving the other portions of the solid coating or the gel coating over either i) the patterned region or ii) the lane region.
2. The method as defined in claim 1 , wherein selectively removing the portions of the solid coating or the gel coating from the bonding region involves exposing the portions to a dry etch or a water rinse while the insoluble photoresist is in place.
3. The method as defined in claim 2 , further comprising lifting off the insoluble photoresist in a remover, wherein the solid coating or the gel coating is insoluble in the remover.
4. A method, comprising:
applying a water-soluble protective coating solution over a bonding region and over either i) a patterned region of a patterned structure, the patterned region including depressions having at least a polymeric hydrogel therein, and interstitial regions separating the depressions or ii) a lane region of a non-patterned structure, the lane region including a lane having at least the polymeric hydrogel therein, wherein:
the patterned structure or the non-patterned structure is a multi-layer stack including a transparent base support, a patterned mask layer over the transparent base support, and a patterned transparent layer over the patterned mask layer and the transparent base support; and
a pattern of the patterned mask layer corresponds with the bonding region;
drying the water-soluble protective coating solution to form a solid coating or a gel coating over the patterned mask layer and the bonding region, and over either i) the patterned region or ii) the lane region;
applying a negative photoresist over the solid coating or the gel coating;
exposing the negative photoresist to light through the transparent base support, whereby portions of the negative photoresist overlying either i) the patterned region or ii) the lane region define the insoluble photoresist, and portions of the negative photoresist overlying the patterned mask layer and the bonding region become soluble; and
selectively removing portions of the solid coating or the gel coating from the patterned mask layer the bonding region while leaving other portions of the solid coating or the gel coating over either i) the patterned region or ii) the lane region.
5. The method as defined in claim 4 , wherein selectively removing the portions of the solid coating or the gel coating from the patterned mask layer and the bonding region involves exposing the portions to a developer of the negative photoresist.
6. The method as defined in claim 5 , further comprising lifting off the insoluble photoresist in a solvent to which the solid coating or the gel coating is inert.
7. A method, comprising:
applying a water-soluble protective coating solution over a bonding region and over either i) a patterned region of a patterned structure, the patterned region including depressions having at least a polymeric hydrogel therein, and interstitial regions separating the depressions or ii) a lane region of a non-patterned structure, the lane region including a lane having at least the polymeric hydrogel therein;
drying the water-soluble protective coating solution to form a solid coating or a gel coating over the bonding region and over either i) the patterned region or ii) the lane region; selectively applying a metal layer over portions of the solid coating or the gel coating over either i) the patterned region or ii) the lane region;
selectively removing other portions of the solid coating or the gel coating from the bonding region exposing the portions to a dry etch while the metal layer is in place; and
after selectively removing the portions of the solid coating or the gel coating, removing the metal layer.
8. A method, comprising:
applying a water-soluble protective coating solution over a bonding region and over either i) a patterned region of a patterned structure, the patterned region including depressions having at least a polymeric hydrogel therein, and interstitial regions separating the depressions or ii) a lane region of a non-patterned structure, the lane region including a lane having at least the polymeric hydrogel therein;
drying the water-soluble protective coating solution to form a solid coating or a gel coating over the bonding region and over either i) the patterned region or ii) the lane region; and
selectively removing portions of the solid coating or the gel coating from the bonding region while leaving other portions of the solid coating or the gel coating over either i) the patterned region or ii) the lane region by laser patterning the portions of the solid coating or the gel coating over the bonding region.