Ultra low loss and high-density routing between cores
Embodiments disclosed herein include a package core. In an embodiment, the package core includes a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises glass. In an embodiment, a third layer is over the second layer, where the third layer comprises glass. In an embodiment, a first trace is between the first layer and the second layer. In an embodiment, a second trace is between the second layer and the third layer.
1 . A package core, comprising:
a first layer, wherein the first layer comprises glass;
a second layer over the first layer, wherein the second layer comprises glass;
a third layer over the second layer, wherein the third layer comprises glass, wherein a first adhesive couples the first layer to the second layer, and a second adhesive couples the second layer to the third layer;
a first trace between an uppermost surface of the first layer and a bottommost surface of the second layer; and
a second trace between an uppermost surface of the second layer and a bottommost surface of the third layer.
2 . The package core of claim 1 , wherein the first trace has a thickness that is substantially equal to a thickness of the first adhesive, and wherein the second trace has a thickness that is substantially equal to a thickness of the second adhesive.
3 . The package core of claim 1 , further comprising:
first vias that couple the first trace to a top surface and a bottom surface of the core; and
second vias that couple the second trace to a top surface and a bottom surface of the core.
4 . The package core of claim 1 , further comprising:
a first via that couples a first end of the second trace to a top surface of the core; and
a second via that couples a second end of the second trace to the top surface of the core.
5 . The package core of claim 4 , further comprising:
a third via that couples a first end of the first trace to the top surface of the core; and
a fourth via that couples a second end of the first trace to the top surface of the core.
6 . The package core of claim 4 , further comprising:
a third via that couples a first end of the first trace to the top surface of the core; and
a fourth via that couples a second end of the first trace to a bottom surface of the core.
7 . The package core of claim 1 , further comprising:
cavities into the first layer and the second layer, wherein the first trace fills the cavities.
8 . The package core of claim 1 , further comprising:
a first conductive plane over a top surface of the core; and
a second conductive plane over a bottom surface of the core.
9 . The package core of claim 8 , further comprising:
a first cavity into the top surface of the core, wherein the first cavity is filled by the first conductive plane; and
a second cavity into the bottom surface of the core, wherein the second cavity is filled by the second conductive plane.
10 . The package core of claim 1 , wherein the first trace and the second trace are part of dual stripline routing architectures.
11 . An electronic system, comprising:
a board;
a package substrate coupled to the board, wherein the package substrate comprises:
a first layer, wherein the first layer comprises glass;
a second layer over the first layer, wherein the second layer comprises glass;
a third layer over the second layer, wherein the third layer comprises glass;
a first trace between an uppermost surface of the first layer and a bottommost surface of the second layer; and
a second trace between an uppermost surface of the second layer and a bottommost surface of the third layer; and
a die coupled to the package substrate.
12 . The electronic system of claim 11 , wherein a first adhesive couples the first layer to the second layer, and a second adhesive couples the second layer to the third layer.
13 . The electronic system of claim 12 , wherein the first trace has a thickness that is substantially equal to a thickness of the first adhesive, and wherein the second trace has a thickness that is substantially equal to a thickness of the second adhesive.
14 . A package core, comprising:
a first layer, wherein the first layer comprises glass;
a second layer over the first layer, wherein the second layer comprises glass;
a third layer over the second layer, wherein the third layer comprises glass;
a first trace between an uppermost surface of the first layer and a bottommost surface of the second layer;
a second trace between an uppermost surface of the second layer and a bottommost surface of the third layer;
first vias that couple the first trace to a top surface and a bottom surface of the core; and
second vias that couple the second trace to a top surface and a bottom surface of the core.
15 . The package core of claim 14 , wherein the first trace and the second trace are part of dual stripline routing architectures.
16 . A package core, comprising:
a first layer, wherein the first layer comprises glass;
a second layer over the first layer, wherein the second layer comprises glass;
a third layer over the second layer, wherein the third layer comprises glass;
a first trace between an uppermost surface of the first layer and a bottommost surface of the second layer;
a second trace between an uppermost surface of the second layer and a bottommost surface of the third layer;
a first via that couples a first end of the second trace to a top surface of the core; and
a second via that couples a second end of the second trace to the top surface of the core.
17 . The package core of claim 16 , further comprising:
a third via that couples a first end of the first trace to the top surface of the core; and
a fourth via that couples a second end of the first trace to the top surface of the core.
18 . The package core of claim 16 , further comprising:
a third via that couples a first end of the first trace to the top surface of the core; and
a fourth via that couples a second end of the first trace to a bottom surface of the core.
19 . The package core of claim 16 , wherein the first trace and the second trace are part of dual stripline routing architectures.
20 . A package core, comprising:
a first layer, wherein the first layer comprises glass;
a second layer over the first layer, wherein the second layer comprises glass;
a third layer over the second layer, wherein the third layer comprises glass;
a first trace between an uppermost surface of the first layer and a bottommost surface of the second layer;
a second trace between an uppermost surface of the second layer and a bottommost surface of the third layer; and
cavities into the first layer and the second layer, wherein the first trace fills the cavities.
21 . The package core of claim 20 , wherein the first trace and the second trace are part of dual stripline routing architectures.
22 . A package core, comprising:
a first layer, wherein the first layer comprises glass;
a second layer over the first layer, wherein the second layer comprises glass;
a third layer over the second layer, wherein the third layer comprises glass;
a first trace between an uppermost surface of the first layer and a bottommost surface of the second layer;
a second trace between an uppermost surface of the second layer and a bottommost surface of the third layer;
a first conductive plane over a top surface of the core; and
a second conductive plane over a bottom surface of the core.
23 . The package core of claim 22 , further comprising:
a first cavity into the top surface of the core, wherein the first cavity is filled by the first conductive plane; and
a second cavity into the bottom surface of the core, wherein the second cavity is filled by the second conductive plane.
24 . The package core of claim 22 , wherein the first trace and the second trace are part of dual stripline routing architectures.