Memory structure including elastic material based buffer column structure near contact structure to improve stability of connection
Embodiments provide a memory structure, including: a capacitive structure, provided with an upper electrode layer; a conductive column, arranged on the upper electrode layer, and in contact with and electrically connected to the upper electrode layer; a metal layer, arranged on a side of the conductive column away from the upper electrode layer, the conductive column being in contact with a surface of the metal layer facing the upper electrode layer; and at least one buffer column, spaced apart from the conductive column, in contact with the surface of the metal layer facing the upper electrode layer, and extending in a direction from the metal layer to the upper electrode layer.
1. A memory structure, comprising:
a capacitive structure, provided with an upper electrode layer;
a conductive column, arranged on the upper electrode layer, and in contact with and electrically connected to the upper electrode layer;
a metal layer, arranged on a side of the conductive column away from the upper electrode layer, the conductive column being in contact with a surface of the metal layer facing the upper electrode layer; and
at least one buffer column, spaced apart from the conductive column, in contact with the surface of the metal layer facing the upper electrode layer, and extending in a direction from the metal layer to the upper electrode layer;
wherein a material of the buffer column comprises an elastic material.
2. The memory structure of claim 1 , wherein the at least one buffer column comprises one buffer column.
3. The memory structure of claim 2 , wherein the metal layer has a symmetry axis, and the buffer column and the conductive column are symmetrically arranged about the symmetry axis.
4. The memory structure of claim 1 , wherein in the direction from the metal layer to the upper electrode layer, a length of the buffer column is equal to a length of the conductive column.
5. The memory structure of claim 1 , wherein the material of the buffer column comprises polyimide.
6. The memory structure of claim 1 , wherein the at least one buffer column comprises a plurality of buffer columns, and the plurality of buffer columns are arranged at an interval on the metal layer.
7. The memory structure of claim 6 , wherein the plurality of buffer columns are arranged on a same side of the conductive column, and in a direction from the plurality of buffer columns to the conductive column, lengths of the plurality of buffer columns are increased successively in the direction from the metal layer to the upper electrode layer.
8. The memory structure of claim 7 , wherein the lengths of the plurality of buffer columns are less than a length of the conductive column.
9. The memory structure of claim 8 , wherein a length of each of the plurality of buffer columns is at least ½ of the length of the conductive column.
10. The memory structure of claim 6 , wherein the plurality of buffer columns are arranged on a same side of the conductive column, and in a direction from the metal layer to the upper electrode layer, the plurality of buffer columns have equal lengths.
11. The memory structure of claim 1 , further comprising: a sensor amplifier, wherein the conductive column is arranged on a side of the metal layer close to the sensor amplifier, and the buffer column is arranged on a side of the metal layer away from the sensor amplifier.
12. The memory structure of claim 1 , further comprising: a dielectric layer, wherein the dielectric layer is arranged on a surface of the upper electrode layer, and the conductive column and the buffer column are arranged in the dielectric layer.
13. The memory structure of claim 1 , wherein each of the metal layer extends in a first direction, and the buffer column and the conductive column are arranged in the first direction.
14. The memory structure of claim 13 , further comprising: an electrical connection layer, wherein the electrical connection layer is arranged in a different layer from the metal layer, each of the electrical connection layer extends in a second direction, and the second direction is different from the first direction.
15. The memory structure of claim 14 , further comprising: a first insulating layer and a second insulating layer; wherein the first insulating layer covers a surface of a side of the metal layer away from the upper electrode layer, and the second insulating layer is spaced apart from the first insulating layer in a direction from the upper electrode layer to the metal layer.
16. The memory structure of claim 1 , further comprising: a sensor amplifier, wherein the buffer column is arranged on a side of the metal layer close to the sensor amplifier, and the conductive column is arranged on a side of the metal layer away from the sensor amplifier.
17. The memory structure of claim 16 , wherein a material of the first insulating layer is consistent with a material of the second insulating layer; and the material of the first insulating layer and the material of the second insulating layer comprise an inoxidizable material.
18. The memory structure of claim 1 , wherein a material of the upper electrode layer comprises polycrystalline silicon, doped polycrystalline silicon or metal.
19. The memory structure of claim 1 , wherein in the direction from the metal layer to the upper electrode layer, a length of the buffer column is less than a length of the conductive column.