3D semiconductor devices and structures with at least one vertical bus
A 3D device comprising: a first level comprising first transistors, said first level comprising a first interconnect; a second level comprising second transistors, said second level overlaying said first level; a third level comprising third transistors, said third level overlaying said second level; a plurality of electronic circuit units (ECUs), wherein each of said plurality of ECUs comprises a first circuit, said first circuit comprising a portion of said first transistors, wherein each of said plurality of ECUs comprises a second circuit, said second circuit comprising a portion of said second transistors, wherein each of said plurality of ECUs comprises a third circuit, said third circuit comprising a portion of said third transistors, wherein each of said ECUs comprises a vertical bus, wherein said vertical bus comprises greater than eight pillars and less than three hundred pillars and provides electrical connections between said first circuit and said second circuit.
1. A 3D device, said device comprising:
a first level comprising first transistors, said first level comprising a first interconnect;
a second level comprising second transistors, said second level overlaying said first level;
a third level comprising third transistors, said third level overlaying said second level;
a plurality of electronic circuit units (ECUs),
wherein each of said plurality of ECUs comprises a first circuit, said first circuit comprising a portion of said first transistors,
wherein each of said plurality of ECUs comprises a second circuit, said second circuit comprising a portion of said second transistors,
wherein each of said plurality of ECUs comprises a third circuit, said third circuit comprising a portion of said third transistors,
wherein a plurality of said ECUs comprises a first vertical bus,
wherein said first vertical bus comprises greater than eight pillars and less than three hundred pillars,
wherein said first vertical bus provides electrical connections between said first circuit and said second circuit,
wherein each of said ECUs comprises a second vertical bus,
wherein said second vertical bus comprises greater than eight pillars,
wherein said second vertical bus provides electrical connections between said second circuit and said third circuit, and
wherein said first vertical bus connects to a greater number of levels than said second vertical bus.
2. The device according to claim 1 ,
wherein said second level is bonded to said first level, and
wherein said bonded comprises oxide to oxide bonding regions and metal to metal bonding regions.
3. The device according to claim 1 ,
wherein said third level comprises an array of memory cells, and
wherein said second circuit comprises a memory control circuit.
4. The device according to claim 1 ,
wherein said third level comprises an array of DRAM cells.
5. The device according to claim 1 ,
wherein said second vertical bus comprises greater than eight hundred pillars.
6. The device according to claim 1 ,
wherein said first vertical bus comprises less than one hundred and twenty pillars.
7. The device according to claim 1 ,
wherein a plurality of said vertical control lines is connected to one horizontal memory control line.
8. A 3D device, the device comprising:
a first level comprising first transistors, said first level comprising a first interconnect;
a second level comprising second transistors, said second level overlaying said first level;
a third level comprising third transistors, said third level overlaying said second level;
a plurality of electronic circuit units (ECUs),
wherein each of said plurality of ECUs comprises a first circuit, said first circuit comprising a portion of said first transistors,
wherein each of said plurality of ECUs comprises a second circuit, said second circuit comprising a portion of said second transistors,
wherein each of said plurality of ECUs comprises a third circuit, said third circuit comprising a portion of said third transistors,
wherein a plurality of said ECUs comprises a first vertical bus,
wherein said first vertical bus comprises greater than eight pillars and less than three hundred pillars,
wherein said first vertical bus provides electrical connections between said first circuit and said third circuit, and
wherein said first vertical bus comprises redundant vertical pillars to support increased yield for said first vertical bus.
9. The device according to claim 8 ,
wherein said second level is bonded to said first level, and
wherein said bonded comprises oxide to oxide bonding regions and metal to metal bonding regions.
10. The device according to claim 8 ,
wherein said second level comprises an array of memory cells, and
wherein said third circuit comprises a memory control circuit.
11. The device according to claim 8 ,
wherein said second level comprises an array of DRAM cells.
12. The device according to claim 8 ,
wherein a plurality of said ECUs comprises vertical control lines,
wherein said vertical control lines comprise greater than eight hundred pillars, and
wherein said vertical control lines provide electrical connections between said second circuit and said third circuit.
13. The device according to claim 8 ,
wherein said first vertical bus comprises less than one hundred and twenty pillars.
14. The device according to claim 8 ,
wherein each of said vertical control lines is connected to one horizontal memory control line.
15. A 3D device, the device comprising:
a first level comprising first transistors, said first level comprising a first interconnect;
a second level comprising second transistors, said second level overlaying said first level;
a third level comprising third transistors, said third level overlaying said second level;
a plurality of electronic circuit units (ECUs),
wherein each of said plurality of ECUs comprises a first circuit, said first circuit comprising a portion of said first transistors,
wherein each of said plurality of ECUs comprises a second circuit, said second circuit comprising a portion of said second transistors,
wherein each of said plurality of ECUs comprises a third circuit, said third circuit comprising a portion of said third transistors,
wherein each of said ECUs comprises a vertical bus,
wherein said vertical bus comprises greater than eight pillars and less than three hundred pillars,
wherein said vertical bus provides electrical connections between said first circuit and said second circuit,
wherein said third level comprises an array of memory cells, and
wherein said second circuit comprises a memory control circuit; and
at least one vertical feed-through pillar disposed through said third level.
16. The device according to claim 15 ,
wherein said second level is bonded to said first level, and
wherein said bonded comprises oxide to oxide bonding regions and metal to metal bonding regions.
17. The device according to claim 15 ,
wherein a plurality of said ECUs comprise vertical control lines,
wherein at least one of said vertical control lines comprise more than eight hundred pillars, and
wherein said vertical control lines provide electrical connections between said second circuit and said third circuit.
18. The device according to claim 15 ,
wherein said third level comprises an array of DRAM cells.
19. The device according to claim 15 ,
wherein said first circuit comprises at least one processor.
20. The device according to claim 15 ,
wherein said vertical bus comprises less than one hundred and twenty pillars.