Granted Patent B2

US 12,372,872 · App. 17/595,062 · Granted Jul 29, 2025

Inventors: Andrew Liang (San Jose, CA); Nader Shamma (Cupertino, CA); Rich Wise (Los Gatos, CA); Akhil Singhal (Beaverton, OR); Arpan Pravin Mahorowala (West Linn, OR); Gregory Blachut (Campbell, CA); Dustin Zachary Austin (Tigard, OR)

Assignee: LAM RESEARCH CORPORATION

G03F7/2004

Abstract

Claims (27)

1. A method for patterning a substrate, comprising:

depositing a first layer on a substrate, the first layer comprising Si or SiON and having a first thickness of 3 nm or 6 nm, wherein the first layer includes a first mean free path for secondary electrons;

depositing a second layer on the first layer, the second layer comprising Sn or SnO2 and having a second thickness, wherein the second thickness is 2 nm or 4 nm when the first thickness is 3 nm or 6 nm, respectively, and wherein the second layer includes a second mean free path for secondary electrons that is lower than the first mean free path; and

depositing a photoresist layer on the second layer, the photoresist layer comprising chemically amplified organic photoresist material, wherein the first and second mean free paths converge in the photoresist layer.

2. The method of claim 1 , wherein the first and second mean free paths of the first and second layers are different.

3. The method of claim 1 , wherein the first and second layers are located at first and second distances from the photoresist layer, respectively; and wherein the first and second mean free paths of the first and second N-layers increase proportionally with the first and second distances.

4. The method of claim 1 , wherein the first and second layers are located at first and second distances from the photoresist layer, respectively; and wherein the first and second mean free paths of the first and second layers monotonically increase according to the first and second distances.

5. The method of claim 1 , wherein the first and second layers are located at first and second distances from the photoresist layer, respectively; and wherein the first and second mean free paths of the first and second layers linearly increase according to the first and second distances.

6. The method of claim 1 , wherein the first and second layers are located at first and second distances from the photoresist layer, respectively, and have first and second absorption rates, respectively; and wherein the first and second absorption rates of the first and second layers, respectively, increase as according to the first and second distances.

7. The method of claim 1 , wherein each layer of the first and second layers has the same thickness.

8. The method of claim 1 , wherein each layer of the first and second layers has a different thickness.

9. The method of claim 8 further comprising arranging the first and second layers in an increasing order of thickness, with a thinner layer of the first and second layers arranged adjacent to the photoresist layer and with a thicker layer of the first and second layers arranged adjacent to the substrate.

10. The method of claim 1 further comprising exposing the photoresist layer to extreme ultraviolet radiation.

11. The method of claim 1 further comprising:

exposing the photoresist layer to extreme ultraviolet radiation;

removing exposed portions of the photoresist layer; and

removing portions of the multi-layer stack located in areas where the photoresist layer is removed.

12. The method of claim 1 further comprising:

exposing the photoresist layer to extreme ultraviolet radiation;

removing exposed portions of the photoresist layer to form a patterned photoresist layer;

performing a deposition process using the patterned photoresist layer; and

removing the photoresist layer and the multi-layer stack after performing the deposition process.

13. The method of claim 1 further comprising:

exposing the photoresist layer to extreme ultraviolet radiation;

removing exposed portions of the photoresist layer to form a patterned photoresist layer;

performing an etching process using the patterned photoresist layer; and

removing the photoresist layer and the multi-layer stack after performing the etching process.

Assignments (1)

Continuity (2)

References Cited (16)