Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production method thereof
A thermally conductive silicone gel composition contains: (A) an organopolysiloxane having two or more alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded directly to silicon atoms; (C) a platinum group metal-containing curing catalyst in a catalytic amount; and (D) aluminum hydroxide particles as thermally conductive particles in an amount of 200 to 600 parts by mass with respect to 100 parts by mass of a total amount of the components (A) to (C). The aluminum hydroxide particles contain, based on 100% by mass, aluminum hydroxide particles (D-1) having a median diameter (D50) of 30 μm or more in an amount of more than 40% by mass and less than 75% by mass; and aluminum hydroxide particles (D-2) having a median diameter (D50) of less than 30 μm in an amount of 25% by mass or more and 60% by mass or less. The thermally conductive silicone gel composition has a relative dielectric constant of 5.0 or less at a frequency of 1 MHz according to a mutual induction bridge method and has a Shore OO hardness of 5 to 60. The silicone gel composition of the present invention, which is composed of substances not classified as hazardous under GHS criteria, has high safety, flexibility, a low dielectric constant, and thermal conductivity.
1. A thermally conductive silicone gel composition, comprising:
(A) an organopolysiloxane having two or more alkenyl groups per molecule;
(B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded directly to silicon atoms;
(C) a platinum group metal-containing curing catalyst in a catalytic amount; and
(D) aluminum hydroxide particles as thermally conductive particles in an amount of 200 to 600 parts by mass with respect to 100 parts by mass of a total amount of the components (A) to (C), the aluminum hydroxide particles comprising, based on 100% by mass of the aluminum hydroxide particles, aluminum hydroxide particles (D-1) having a median diameter (D50) of 30 μm or more in an amount of more than 40% by mass and less than 75% by mass; and aluminum hydroxide particles (D-2) having a median diameter (D50) of less than 30 μm in an amount of 25% by mass or more and 60% by mass or less,
wherein the thermally conductive silicone gel composition has a relative dielectric constant of 5.0 or less at a frequency of 1 MHz according to a mutual induction bridge method of JIS K 6911:2006 and has a Shore OO hardness of 5 to 60.
2. The thermally conductive silicone gel composition according to claim 1 , wherein the organopolysiloxane as the component (A) has a viscosity of 100 to 10000 Pa·s.
3. The thermally conductive silicone gel composition according to claim 1 , wherein in the organohydrogenpolysiloxane as the component (B), the number of moles of the hydrogen atoms bonded directly to silicon atoms is 0.1 to 5.0 times the number of moles of the alkenyl groups of the component (A).
4. The thermally conductive silicone gel composition according to claim 1 , further comprising a surface treatment agent for thermally conductive particles, as a component (E).
5. The thermally conductive silicone gel composition according to claim 4 , wherein the surface treatment agent comprises at least one coupling agent selected from the group consisting of a titanate coupling agent, an aluminate coupling agent, a stearate coupling agent, an epoxy silane coupling agent, and an alkyl silane coupling agent.
6. The thermally conductive silicone gel composition according to claim 5 , wherein the alkyl silane coupling agent comprises at least one selected from the group consisting of an alkoxysilane compound expressed by R a Si(OR′) 4−a (where R represents a substituted or unsubstituted organic group having 6 to 12 carbon atoms, R′ represents an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1), a partial hydrolysate of the alkoxysilane compound, and an alkoxy group-containing silicone having a substituted or unsubstituted organic group having 6 to 12 carbon atoms.
7. The thermally conductive silicone gel composition according to claim 4 , wherein the thermally conductive silicone gel composition comprises the surface treatment agent in an amount of 0.01 to 10 parts by mass with respect to 100 parts by mass of the thermally conductive particles.
8. The thermally conductive silicone gel composition according to claim 1 , further comprising at least one thermally conductive particles selected from the group consisting of hexagonal boron nitride, aluminum nitride, amorphous silica, and calcium carbonate, as a component (F).
9. The thermally conductive silicone gel composition according to claim 1 , wherein the thermally conductive silicone gel composition has a thermal conductivity of 2.0 W/m·K or less.
10. The thermally conductive silicone gel composition according to claim 1 , wherein the thermally conductive silicone gel composition has a specific gravity of 2.2 or less.
11. A thermally conductive silicone sheet that is a sheet of a thermally conductive silicone gel composition,
the thermally conductive silicone gel composition comprising:
(A) an organopolysiloxane having two or more alkenyl groups per molecule;
(B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded directly to silicon atoms;
(C) a platinum group metal-containing curing catalyst in a catalytic amount; and
(D) aluminum hydroxide particles as thermally conductive particles in an amount of 200 to 600 parts by mass with respect to 100 parts by mass of a total amount of the components (A) to (C), the aluminum hydroxide particles comprising, based on 100% by mass of the aluminum hydroxide particles, aluminum hydroxide particles (D-1) having a median diameter (D50) of 30 μm or more in an amount of more than 40% by mass and less than 75% by mass; and aluminum hydroxide particles (D-2) having a median diameter (D50) of less than 30 μm in an amount of 25% by mass or more and 60% by mass or less,
wherein the thermally conductive silicone gel composition has a relative dielectric constant of 5.0 or less at a frequency of 1 MHz according to a mutual induction bridge method of JIS K 6911:2006 and has a Shore OO hardness of 5 to 60.
12. A method for producing a thermally conductive silicone sheet, comprising: mixing the following components; sheeting the mixture; and curing the sheet, the components of the mixture comprising:
(A) an organopolysiloxane having two or more alkenyl groups per molecule;
(B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded directly to silicon atoms;
(C) a platinum group metal-containing curing catalyst in a catalytic amount; and
(D) aluminum hydroxide particles as thermally conductive particles in an amount of 200 to 600 parts by mass with respect to 100 parts by mass of a total amount of the components (A) to (C), the aluminum hydroxide particles comprising, based on 100% by mass of the aluminum hydroxide particles, aluminum hydroxide particles (D-1) having a median diameter (D50) of 30 μm or more in an amount of more than 40% by mass and less than 75% by mass; and aluminum hydroxide particles (D-2) having a median diameter (D50) of less than 30 μm in an amount of 25% by mass or more and 60% by mass or less,
wherein the thermally conductive silicone sheet has a relative dielectric constant of 5.0 or less at a frequency of 1 MHz according to a mutual induction bridge method of JIS K 6911:2006 and has a Shore OO hardness of 5 to 60.
13. The thermally conductive silicone gel composition according to claim 1 , wherein the thermally conductive silicone gel composition is free from alumina particles, crystalline silica particles, and magnesium oxide particles.
14. The thermally conductive silicone sheet according to claim 11 , wherein the thermally conductive silicone sheet is free from alumina particles, crystalline silica particles, and magnesium oxide particles.