Laser module and method of manufacturing the same
A laser module includes an optical fiber, a laser device, an optical system, a housing, a lead terminal, a conductive wire, and an insulation member. The laser device emits a laser beam. The optical system couples the laser beam, emitted from the laser device, to the optical fiber. The housing includes a base plate on which the laser device is fixed and a side wall that includes an opening. The lead terminal extends from an outside of the housing through the opening of the side wall into the housing. The conductive wire electrically connects a connecting portion of the lead terminal, located within the housing, to the laser device. The insulation member includes a seal portion and an extension portion.
1. A laser module comprising:
an optical fiber;
a laser device that emits a laser beam;
an optical system that couples the laser beam to the optical fiber;
a housing comprising a base plate on which the laser device is fixed and a side wall having an opening;
a lead terminal extending from an outside of the housing through the opening of the side wall into the housing;
a conductive wire electrically connecting a connecting portion of the lead terminal to the laser device, wherein the connection portion is disposed inside the housing; and
an insulation member comprising:
a seal portion that seals between the side wall and the lead terminal at the opening of the side wall; and
an extension portion that extends continuously from the seal portion into the housing to directly contact and support the lead terminal relative to the housing,
wherein the insulation member comprises a support portion at an end of the extension portion that is in direct contact with the connecting portion of the lead terminal and directly supports the connecting portion relative to the housing.
2. The laser module as recited in claim 1 , wherein at least a portion of the support portion of the extension portion overlaps with the connecting portion of the lead terminal as viewed in a plan view.
3. The laser module as recited in claim 1 , wherein the extension portion of the insulation member comprises a reception groove that receives at least a portion of the lead terminal extending from the side wall into the housing.
4. The laser module as recited in claim 3 , wherein the reception groove of the extension portion receives an entire length of the lead terminal extending from the side wall into the housing.
5. The laser module as recited in claim 1 , wherein the support portion of extension portion contacts the base plate of the housing or a submount fixed on the base plate.
6. The laser module as recited in claim 1 , wherein the extension portion of the insulation member comprises an engagement portion that engages with the base plate of the housing or a submount fixed on the base plate.
7. The laser module as recited in claim 6 , wherein the engagement portion of the extension portion engages with the base plate of the housing and suppresses vibration of the lead terminal.
8. A method of manufacturing a laser module, the method comprising:
preparing an optical fiber;
preparing a laser device operable to emit a laser beam;
preparing an optical system that couples the laser beam emitted from the laser device to the optical fiber;
preparing a housing including a base plate and a side wall with an opening formed therein;
fixing a laser device to the base plate of the housing;
forming an insulation member including
a seal portion configured to seal between the side wall and a lead terminal at the opening of the side wall and
an extension portion that extends continuously from the seal portion to directly contact and support a connecting portion of a lead terminal configured to connect to the laser device;
sealing between the side wall and the lead terminal at the opening of the side wall with the seal portion of the insulation member while simultaneously supporting the connection portion of the lead terminal with extension portion of the insulation member;
connecting an end of a conductive wire to the laser device fixed to the housing; and
connecting, by ultrasonic bonding, another end of the conductive wire to the connecting portion of the lead terminal that is supported by, via direct contact, the extension portion of the insulation member within the housing.