Optical transmitter module
View Patent ↗Provided is an optical transmitter module. The optical transmitter module includes a package including a lower substrate and a side substrate in which a through hole is formed, and a feed-through block coupled to the side substrate in which the through hole is formed. The feed-through block includes a feed-through substrate, at least one lead pin penetrating the feed-through substrate and coupled to the feed-through substrate, a base substrate formed to extend from the feed-through substrate in a direction in which the at least one lead pin is coupled, and a dielectric substrate formed between the at least one lead pin and the base substrate protruding from the feed-through substrate. Therefore, it is possible to improve the quality of a signal transmitted by the optical transmitter module.
1. An optical transmitter module, comprising:
a package including a lower substrate and at least one side substrate extending upward from the lower substrate to form a sidewall, a through hole being formed in one of the at least one side substrate; and
a feed-through block coupled to the side substrate in which the through hole is formed,
wherein the feed-through block comprises:
a feed-through substrate;
at least one lead pin penetrating the feed-through substrate and coupled to the feed-through substrate;
a base substrate formed to extend from the feed-through substrate in a direction in which the at least one lead pin is coupled;
a dielectric substrate formed between the at least one lead pin and the base substrate protruding from the feed-through substrate, and
wherein a horizontal length of the base substrate is longer than the length portion of the at least one lead pin protruding from the feed-through substrate.
2. The optical transmitter module of claim 1 , further comprising:
a thermoelectric cooler (TEC) positioned on an upper surface of the lower substrate;
a laser diode (LD) positioned on an upper surface of the TEC; and
a reflecting mirror positioned on the upper surface of the TEC.
3. The optical transmitter module of claim 1 , wherein the at least one lead pin is coupled to the feed-through substrate by a medium of glass solder.
4. The optical transmitter module of claim 1 , wherein, when there are a plurality of lead pins, the lead pins have identical intervals therebetween and are coupled to the feed-through substrate in one direction.
5. The optical transmitter module of claim 1 , wherein at least one transmission line connected to the at least one lead pin is formed on an upper surface of the dielectric substrate.
6. The optical transmitter module of claim 5 , wherein the transmission line is coupled to the LD by wire bonding.
7. The optical transmitter module of claim 1 , wherein the feed-through substrate is coupled to the side substrate in which the through hole is formed by a medium of an insulating material.
8. The optical transmitter module of claim 7 , wherein the insulating material is epoxy.
9. The optical transmitter module of claim 1 , wherein the lead pin, the base substrate, and the dielectric substrate are positioned in the through hole.
10. The optical transmitter module of claim 1 , wherein the lower substrate has a quadrangular shape, and the at least one side substrate extends upward from respective sides of the lower substrate to form the sidewall.