Method and apparatus for edge finishing of high mechanical strength thin glass substrates
Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.
1. A substrate with a polished edge, the substrate comprising:
a mechanical edge strength of at least 700 MPa; and
edge flaws of not more than 2 microns in size, wherein the polished edge comprises a plurality of brush marks arranged thereon in a substantially parallel configuration, the brush marks imparted by a brush polishing process.
2. The substrate of claim 1 , wherein the brush marks are arranged parallel to a longitudinal axis of the polished edge.
3. The substrate of claim 1 , wherein the substrate comprises a thickness of between approximately 0.01 mm and approximately 6.0 mm.
4. The substrate of claim 1 , wherein the substrate comprises a mechanical edge strength of at least 1 GPa.
5. The substrate of claim 1 , wherein the substrate comprises a chamfered, radiused, square, or bullnose edge profile.
6. The substrate of claim 1 , wherein the substrate comprises a symmetrical edge profile.
7. The substrate of claim 1 , wherein the substrate comprises an asymmetrical edge profile, wherein the asymmetrical edge profile comprises a chamfered surface and a radiused surface.
8. The substrate of claim 1 , wherein the polished edge has a plurality of shaped protrusions extending laterally therefrom, wherein each protrusion has a first tapered sidewall and a second tapered sidewall.
9. The substrate of claim 1 , wherein the substrate comprises an edge average roughness of between approximately 1 nm and approximately 10 nm.
10. The substrate of claim 1 , wherein the substrate comprises an ink layer arranged on a surface thereof.
11. The substrate of claim 10 , wherein an edge of the ink layer is brush polished.