Processing apparatus and processing method
A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers; and a controller. The controller controls an operation of forming the internal modification layers such that the internal modification layers are formed in a spiral shape from a diametrically outer side of the processing target object toward a diametrically inner side thereof, and such that an eccentric amount between the holder and the processing target object held by the holder in the forming of the internal modification layers toward the diametrically inner side of the processing target object becomes smaller than the eccentric amount in forming the internal modification layers toward the diametrically outer side of the processing target object.
1. A processing apparatus configured to process a processing target object, comprising:
a holder configured to hold the processing target object;
a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers along a plane direction of the processing target object; and
a controller configured to control an operation of forming the internal modification layers in the processing target object,
wherein the controller controls the operation of forming the internal modification layers such that the internal modification layers are formed in a spiral shape from a diametrically outer side of the processing target object toward a diametrically inner side thereof, and such that an eccentric amount between the holder and the processing target object held by the holder in the forming of the internal modification layers toward the diametrically inner side of the processing target object becomes smaller than the eccentric amount in forming the internal modification layers toward the diametrically outer side of the processing target object.
2. The processing apparatus of claim 1 ,
wherein the processing target object comprises:
an eccentricity correction region in which the eccentric amount is corrected in the forming of the internal modification layers; and
a non-correction region which is formed at a diametrically inside of the eccentricity correction region and in which correction of the eccentric amount is not performed in the forming of the internal modification layers.
3. The processing apparatus of claim 2 ,
wherein the non-correction region is formed in a central portion of the processing target object, and
the controller controls an operation of correcting the eccentric amount in the non-correction region such that a center of the holder and a center of the processing target object held by the holder are coincident.
4. The processing apparatus of claim 3 ,
wherein the non-correction region is formed in a shape of a circle, and
a radius of the circle forming the non-correction region is equal to or larger than at least ½ of a radius of the processing target object.
5. The processing apparatus of claim 2 ,
wherein the eccentricity correction region is divided into multiple annular regions, and
the controller forms the internal modification layers sequentially from the diametrically outer side of the processing target object toward the diametrically inner side thereof, and controls an operation of correcting the eccentric amount such that the eccentric amount is gradually reduced in each of the multiple annular regions.
6. A processing method of processing a processing target object, comprising:
forming, by a modifying device, internal modification layers in a spiral shape by radiating laser light to an inside of the processing target object held by a holder; and
forming the internal modification layers from a diametrically outer side of the processing target object toward a diametrically inner side thereof such that an eccentric amount between the holder and the processing target object held by the holder in the forming of the internal modification layers toward the diametrically inner side of the processing target object becomes smaller than the eccentric amount in forming the internal modification layers toward the diametrically outer side of the processing target object.
7. The processing method of claim 6 ,
wherein the processing target object comprises:
an eccentricity correction region in which the eccentric amount is corrected in the forming of the internal modification layers; and
a non-correction region which is formed at a diametrically inside of the eccentricity correction region and in which correction of the eccentric amount is not performed in the forming of the internal modification layers.
8. The processing method of claim 7 ,
wherein a center of the holder and a center of the processing target object held by the holder are coincident in the non-correction region formed in a central portion of the processing target object.
9. The processing method of claim 8 ,
wherein the non-correction region is formed in a shape of a circle having a radius equal to or larger than at least ½ of a radius of the processing target object.
10. The processing method of claim 7 ,
wherein the eccentricity correction region is divided into multiple annular regions,
the internal modification layers are formed sequentially from the diametrically outer side of the processing target object toward the diametrically inner side thereof, and
the eccentric amount is gradually reduced in each of the multiple annular regions.
11. The processing method of claim 6 ,
wherein in the forming of the internal modification layers, the spiral-shaped internal modification layers are formed in a plane direction by radiating the laser light to the inside of the processing target object from the modifying device periodically while relatively rotating the processing target object held by the holder and by moving the modifying device in a diametrical direction relative to the holder.