Curable resin composition, dry film and cured product of same, and electronic component containing said cured product
Provided is a curable resin composition that has excellent heat resistance and low warpage and is, furthermore, capable of improving light transmittance in cured products, a dry film and its cured product of, and an electronic component containing the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a thermosetting resin, (C) a thermosetting accelerator and (D) inorganic particles, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 1000; a dry film and its cured product; and an electronic component containing the cured product were obtained.
1. A curable resin composition, comprising:
an amide-imide resin;
a thermosetting resin;
a thermosetting accelerator;
inorganic particles; and
a carboxyl group-containing resin having no amide-imide structures, wherein the amide-imide resin is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 900, and the thermosetting resin is a thermosetting resin selected from the group consisting of an epoxy compound having a biphenyl skeleton, an epoxy compound having a dicyclopentadienyl skeleton and a mixture thereof.
2. The curable resin composition according to claim 1 , wherein the thermosetting resin includes an epoxy compound having a biphenyl skeleton.
3. The curable resin composition according to claim 2 , wherein the curable resin composition forms a cured coated film when cured such that a light transmittance at 450 nm of the cured coated film when having a thickness of 20 μm is 95% or greater.
4. The curable resin composition according to claim 2 , wherein the curable resin composition forms a cured coated film when cured such that a residual stress of the cured coated film is less than 25 MPa.
5. A dry film, comprising:
a resin layer prepared from the curable resin composition of claim 2 .
6. A cured product produced by a process comprising curing the resin layer of the dry film of claim 5 .
7. An electronic component, comprising:
the cured product of claim 6 .
8. A cured product produced by a process comprising curing the curable resin composition of claim 2 .
9. An electronic component, comprising:
the cured product of claim 8 .
10. The curable resin composition according to claim 1 , wherein the curable resin composition forms a cured coated film when cured such that a light transmittance at 450 nm of the cured coated film when having a thickness of 20 μm is 95% or greater.
11. The curable resin composition according to claim 10 , wherein the curable resin composition forms a cured coated film when cured such that a residual stress of the cured coated film is less than 25 MPa.
12. A dry film, comprising:
a resin layer prepared from the curable resin composition of claim 10 .
13. A cured product produced by a process comprising curing the curable resin composition of claim 10 .
14. The curable resin composition according to claim 1 , wherein the curable resin composition forms a cured coated film when cured such that a residual stress of the cured coated film is less than 25 MPa.
15. A dry film, comprising:
a resin layer prepared from the curable resin composition of claim 14 .
16. A dry film, comprising:
a layer prepared from the curable resin composition of claim 1 .
17. A cured product produced by a process comprising curing the resin layer of the dry film of claim 16 .
18. An electronic component, comprising:
the cured product of claim 17 .
19. A cured product produced by a process comprising curing the curable resin composition of claim 1 .
20. An electronic component, comprising:
the cured product of claim 19 .