Thermosetting resin composition, cured film, substrate with cured film, and electronic component

1. A thermosetting resin composition, comprising polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C), wherein an epoxy equivalent of epoxy compound (B) is 259 to 550 g/eq, and a refractive index of epoxy compound (B) is 1.50 to 1.75.

2. The thermosetting resin composition according to claim 1 , comprising 1 to 380 parts by weight of epoxy curing agent (C) based on 100 parts by weight in a total amount of epoxy compounds having two or more oxirane rings or oxetane rings in a molecule in the thermosetting resin composition.

3. The thermosetting resin composition according to claim 1 , comprising 10 to 400 parts by weight of epoxy compound (B) based on 100 parts by weight of polyester amide acid (A).

4. The thermosetting resin composition according to claim 1 , wherein epoxy curing agent (C) is an acid anhydride curing agent.

5. The thermosetting resin composition according to claim 1 , wherein a weight average molecular weight of polyester amide acid (A) is 2,000 to 30,000.

6. The thermosetting resin composition according to claim 1 , wherein polyester amide acid (A) has a constitutional unit represented by formulas (3) and (4):

wherein, R 1 is independently a tetravalent organic group having 1 to 30 carbons, R 2 is a divalent organic group having 1 to 40 carbons and R 3 is a divalent organic group having 1 to 20 carbons.

7. The thermosetting resin composition according to claim 1 , wherein polyester amide acid (A) is a compound obtained from reaction between a component comprising tetracarboxylic dianhydride (a1), a component comprising diamine (a2) and a component comprising polyhydric hydroxy compound (a3).

8. The thermosetting resin composition according to claim 7 , wherein tetracarboxylic dianhydride (a1) includes one or more kinds of compounds selected from the group of 3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride, 3,3 ‘,4,4’-diphenyl ether tetracarboxylic dianhydride, 2,2-(bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and ethyleneglycol bis(anhydrotrimellitate).

9. The thermosetting resin composition according to claim 7 , wherein diamine (a2) includes one or more kinds of compounds selected from the group of 3,3′-diaminodiphenyl sulfone and bis[4-(3-aminophenoxy)phenyl]sulfone.

10. The thermosetting resin composition according to claim 7 , wherein polyhydric hydroxy compound (a3) includes one or more kinds of compounds selected from the group of ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol and 1,8-octanediol.

11. The thermosetting resin composition according to claim 7 , wherein tetracarboxylic dianhydride (a1) is 3,3′,4,4′-diphenyl ether tetracarboxylic dianhydride, diamine (a2) is 3,3′-diaminodiphenyl sulfone, polyhydric hydroxy compound (a3) is 1,4-butanediol and epoxy curing agent (C) is trimellitic anhydride.

12. The thermosetting resin composition according to claim 1 , wherein polyester amide acid (A) is a compound obtained from reaction between a component comprising tetracarboxylic dianhydride (a1), a component comprising diamine (a2), a component comprising polyhydric hydroxy compound (a3) and a component comprising monohydric alcohol (a4).

13. The thermosetting resin composition according to claim 12 , wherein monohydric alcohol (a4) includes one or more kinds of compounds selected from the group of isopropyl alcohol, allyl alcohol, benzyl alcohol, hydroxyethyl methacrylate, propylene glycol monoethyl ether and 3-ethyl-3-hydroxymethyloxetane.

14. The thermosetting resin composition according to claim 1 , wherein polyester amide acid (A) is a compound obtained from reaction between X mol of tetracarboxylic dianhydride (a1), Y mol of diamine (a2) and Z mol of polyhydric hydroxy compound (a3) at such a ratio of satisfying a relationship represented by formula (1) and formula (2):

0.2≤ Z/Y≤ 8.0  (1)

0.2≤( Y+Z )/ X≤ 1.5  (2).

15. The thermosetting resin composition according to claim 1 , further comprising solvent (D).

16. A cured film, obtained from the thermosetting resin composition according to claim 1 .

17. A substrate with a cured film, comprising the cured film according to claim 16 .

18. An electronic component, comprising the cured film according to claim 16 .

19. The electronic component according to claim 18 , being a touch panel.

20. The thermosetting resin composition according to claim 1 , wherein the thermosetting resin composition is a printing composition.