Dielectric substrate and method of forming the same
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D 10 of at least about 1.0 microns and not greater than about 1.7, a D 50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D 90 of at least about 2.7 microns and not greater than about 6 microns.
1. A dielectric substrate comprising:
a polymer based core film, and
a fluoropolymer based adhesive layer,
wherein the polymer based core film comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material, and
wherein a particle size distribution of the first filler material comprises:
a D 10 of at least about 0.5 microns and not greater than about 1.6 microns,
a D 50 of at least about 0.8 microns and not greater than about 2.7 microns, and
a D 90 of at least about 1.5 microns and not greater than about 4.7 microns.
2. The dielectric substrate of claim 1 , wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns.
3. The dielectric substrate of claim 1 , wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the first filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.
4. The dielectric substrate of claim 1 , wherein the first filler material further comprises an average surface area of not greater than about 8 m 2 /g.
5. The dielectric substrate of claim 1 , wherein the first filler material comprises a silica based compound.
6. The dielectric substrate of claim 1 , wherein the resin matrix comprises a perfluoropolymer.
7. The dielectric substrate of claim 6 , wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE); a copolymer of hexafluoropropylene (HFP); a terpolymer of tetrafluoroethylene (TFE); or any combination thereof.
8. The dielectric substrate of claim 6 , wherein the perfluoropolymer comprises polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.
9. The dielectric substrate of claim 1 , wherein the content of the resin matrix component is at least about 45 vol. % and not greater than about 63 vol. % for a total volume of the polymer based core film.
10. The dielectric substrate of claim 1 , wherein the content of the ceramic filler component is at least about 45 vol. % and not greater than about 57 vol. % for a total volume of the polymer based core film.
11. The dielectric substrate of claim 1 , wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the ceramic filler component.
12. The dielectric substrate of claim 1 , wherein the dielectric substrate comprises a dissipation factor (5 GHz, 20% RH) of not greater than about 0.005.
13. The dielectric substrate of claim 1 , wherein the dielectric substrate comprises a dissipation factor (5 GHz, 20% RH) of not greater than about 0.0014.
14. A copper-clad laminate comprising:
a copper foil layer, and a dielectric substrate overlying the copper foil layer,
wherein the dielectric substrate comprises:
a polymer based core film, and
a fluoropolymer based adhesive layer,
wherein the polymer based core film comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material, and
wherein a particle size distribution of the first filler material comprises:
a D 10 of at least about 0.5 microns and not greater than about 1.6 microns,
a D 50 of at least about 0.8 microns and not greater than about 2.7 microns, and
a D 90 of at least about 1.5 microns and not greater than about 4.7 microns.
15. The copper-clad laminate of claim 14 , wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns.
16. The copper-clad laminate of claim 14 , wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the first filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.
17. The copper-clad laminate of claim 14 , wherein the first filler material further comprises an average surface area of not greater than about 8 m 2 /g.
18. A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
a copper foil layer, and a dielectric substrate overlying the copper foil layer,
wherein the dielectric substrate comprises:
a polymer based core film, and
a fluoropolymer based adhesive layer,
wherein the polymer based core film comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material, and
wherein a particle size distribution of the first filler material comprises:
a D 10 of at least about 0.5 microns and not greater than about 1.6 microns,
a D 50 of at least about 0.8 microns and not greater than about 2.7 microns, and
a D 90 of at least about 1.5 microns and not greater than about 4.7 microns.
19. The printed circuit board of claim 18 , wherein the first filler material comprises a silica based compound.
20. The printed circuit board of claim 18 , wherein the first filler material comprises silica.