Granted Patent B2

US 12,391,850 · App. 17/643,450 · Granted Aug 19, 2025

Inventors: Jennifer Adamchuk (Marlborough, MA); Dale Thomas (Rochdale, GB); Meghann White (Bedford, NH); Sethumadhavan Ravichandran (Shrewsbury, MA); Gerard T. Buss (Bedford, NH)

Assignee: VERSIV COMPOSITES LIMITED

C09J7/29B32B7/12B32B15/08B32B15/20B32B27/281C09J5/00C09J7/381C09J11/04H05K1/0373H05K1/09H05K3/4644B32B2255/10B32B2255/26B32B2264/1021B32B2307/204B32B2307/732B32B2457/08C09J2203/326C09J2301/41C09J2400/166C09J2427/00C09J2427/006C09J2479/086H05K2201/015H05K2201/0154H05K2201/0209

Abstract

Claims (36)

1. A copper clad laminate comprising a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:

a first fluoropolymer based adhesive layer, a polyimide layer in direct contact with the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer,

wherein the first filled polymer layer comprises a first resin matrix component comprising a perfluoropolymer; and

a first ceramic filler component,

wherein the first ceramic filler component comprises a first filler material comprising a silica filler material,

wherein the silica filler material further comprises a mean particle size of at not greater than about 10 microns,

wherein a particle size distribution of the silica filler material comprises a D 10 of at least about 0.2 microns and not greater than about 1.6 microns, and

wherein a particle size distribution of the silica filler material comprises a D 50 of at least about 0.5 microns and not greater than about 2.7 microns.

2. The copper-clad laminate of claim 1 , wherein the first fluoropolymer based adhesive layer has an average thickness of at least about 0.2 microns and not greater than about 7 microns.

3. The copper-clad laminate of claim 1 , wherein the first filler material of the first ceramic filler component comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the first filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.

4. The copper-clad laminate of claim 1 , wherein the first filler material further comprises an average surface area of not greater than about 10 m 2 /g.

5. The copper-clad laminate of claim 1 , wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE); a copolymer of hexafluoropropylene (HFP); a terpolymer of tetrafluoroethylene (TFE); polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

6. The copper-clad laminate of claim 1 , wherein the content of the first resin matrix component is at least about 45 vol. % and not greater than about 63 vol. % for a total volume of the first filled polymer layer.

7. The copper-clad laminate of claim 1 , wherein the content of the ceramic filler component is at least about 30 vol. % and not greater than about 57 vol. % for a total volume of the dielectric substrate.

8. The copper-clad laminate of claim 1 , wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the first ceramic filler component.

9. The copper-clad laminate of claim 1 , wherein the dielectric substrate comprises a dissipation factor (5 GHz, 20% RH) of not greater than about 3.5.

10. The copper-clad laminate of claim 1 , wherein the dielectric substrate comprises a coefficient of thermal expansion (all axes) of not greater than about 80 ppm/° C.

11. The copper-clad laminate of claim 1 , wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric substrate of at least about 6 lb/in.

12. A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:

a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:

a first fluoropolymer based adhesive layer, a polyimide layer in direct contact with the fluoropolymer based adhesive layer, and a first filled polymer layer the polyimide layer,

wherein the first filled polymer layer comprises a first resin matrix component comprising a perfluoropolymer; and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material comprising a silica filler material, and wherein the silica filler material further comprises a mean particle size of at not greater than about 10 microns,

wherein a particle size distribution of the silica filler material comprises a D 10 of at least about 0.2 microns and not greater than about 1.6 microns, and

wherein a particle size distribution of the silica filler material comprises a D 50 of at least about 0.5 microns and not greater than about 2.7 microns.

13. The printed circuit board of claim 12 , wherein the first fluoropolymer based adhesive layer has an average thickness of at least about 0.2 microns and not greater than about 7 microns.

14. The printed circuit board of claim 12 , wherein the first filler material of the first ceramic filler component comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the first filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.

15. The printed circuit board of claim 12 , wherein the first filler material further comprises an average surface area of not greater than about 10 m 2 /g.

16. The printed circuit board of claim 12 , wherein the first filler material comprises a silica based compound.

17. A method of forming a dielectric substrate, wherein the method comprises:

providing a first fluoropolymer based adhesive layer;

providing a polyimide layer in direct contact with the first fluoropolymer based adhesive layer;

combining a first resin matrix precursor component comprising a perfluoropolymer and a first ceramic filler precursor component to form a forming mixture; and

forming the forming mixture into a first filled polymer layer overlying the polyimide layer, wherein the first ceramic filler precursor component comprises a silica filler material,

wherein the silica filler material further comprises a mean particle size of not greater than about 10 microns,

wherein a particle size distribution of the silica filler material comprises a D 10 of at least about 0.2 microns and not greater than about 1.6 microns, and

wherein a particle size distribution of the silica filler material comprises a D 50 of at least about 0.5 microns and not greater than about 2.7 microns.

Assignments (3)

Continuity (2)

References Cited (216)