Electronic component having a heat dissipation member formed on a sealing member
An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the chip on the principal surface of the substrate, and a heat dissipation member formed on the sealing resin.
1. An electronic component, comprising:
a substrate having a principal surface;
a chip arranged at the principal surface of the substrate;
a sealing resin sealing the chip on the principal surface of the substrate;
a heat dissipation member formed on the sealing resin;
an insulating film covering the sealing resin and having an opening which selectively exposes the sealing resin such that the sealing resin has an exposed surface;
a wiring formed at the principal surface of the substrate;
an external terminal formed on the sealing resin and electrically connected to the wiring; and
a pillar electrode formed so as to penetrate the sealing resin and electrically connected to the wiring,
wherein the heat dissipation member is formed on the exposed surface of the sealing resin,
the heat dissipation member has a laminated structure including a seed layer and a metallic layer laminated in this order from the sealing resin,
the chip includes a terminal electrode,
the chip is arranged at the principal surface of the substrate such that the terminal electrode is electrically connected to the wiring, and
the external terminal is electrically connected to the wiring via the pillar electrode.
2. The electronic component according to claim 1 , wherein the heat dissipation member is opposed to the chip across the sealing resin.
3. The electronic component according to claim 1 , wherein an area of the heat dissipation member is equal to or greater than an area of the chip as viewed in plan.
4. The electronic component according to claim 3 , wherein the heat dissipation member is opposed to an entire region of the chip across the sealing resin.
5. The electronic component according to claim 1 , wherein the metallic layer has a laminated structure in which a plurality of metallic films are laminated.
6. The electronic component according to claim 1 , wherein the exposed surface of the sealing resin is positioned at a region immediately above the chip.
7. The electronic component according to claim 1 , wherein the seed layer is formed along the exposed surface of the sealing resin and an inner wall surface of the opening formed in the insulating film.
8. The electronic component according to claim 1 , wherein the chip includes a chip principal surface at which the terminal electrode is formed, and
the chip is arranged at the principal surface of the substrate in a posture in which the chip principal surface faces the principal surface of the substrate.
9. The electronic component according to claim 1 , wherein
the heat dissipation member includes a metallic material, and
the external terminal includes the same metallic material as the heat dissipation member.
10. An electronic component, comprising:
a substrate having a principal surface at which a recessed portion is formed;
a chip arranged at the principal surface of the substrate so as to be accommodated in the recessed portion;
a sealing resin filling the recessed portion and sealing the chip;
a heat dissipation member formed on the sealing resin;
a wiring formed on the principal surface of the substrate and withdrawn from an inside region of the recessed portion to an outside region of the recessed portion in the substrate; and
an insulating film covering the sealing resin and having an opening which selectively exposes the sealing resin such that the sealing resin has an exposed surface,
wherein the chip includes a terminal electrode,
the chip is arranged at the principal surface of the substrate such that the terminal electrode is electrically connected to the wiring in the inside region of the recessed portion of the substrate, and
the heat dissipation member is formed on the exposed surface of the sealing resin.
11. The electronic component according to claim 10 , wherein the heat dissipation member is opposed to the chip across the sealing resin.
12. The electronic component according to claim 10 , wherein an area of the heat dissipation member is equal to or greater than an area of the chip as viewed in plan.
13. The electronic component according to claim 12 , wherein the heat dissipation member is opposed to the entire region of the chip across the sealing resin.
14. The electronic component according to claim 10 , wherein the exposed surface of the sealing resin is positioned at a region immediately above the chip.
15. The electronic component according to claim 10 , wherein the chip includes a chip principal surface at which the terminal electrode is formed, and
the chip is arranged at the principal surface of the substrate in a posture in which the chip principal surface faces the principal surface of the substrate.
16. The electronic component according to claim 10 , wherein
the principal surface of the substrate includes a low region portion formed by a bottom portion of the recessed portion and a high region portion formed by the outside region of the recessed portion,
the chip includes a first chip principal surface at which the terminal electrode is formed and a second chip principal surface positioned on a side opposite to the first chip principal surface, and
the chip is accommodated in the recessed portion of the substrate such that both the first chip principal surface and the second chip principal surface are positioned in a region between the low region portion and the high region portion of the substrate.
17. An electronic component, comprising:
a substrate having a principal surface at which a recessed portion is formed;
a chip arranged at the principal surface of the substrate so as to be accommodated in the recessed portion;
a sealing resin filling the recessed portion and sealing the chip;
a heat dissipation member formed on the sealing resin;
a wiring formed on the principal surface of the substrate and withdrawn from an inside region of the recessed portion to an outside region of the recessed portion in the substrate; and
an external terminal formed on the sealing resin so as to be electrically connected to the wiring in the outside region of the recessed portion of the substrate,
wherein the chip includes a terminal, and
the chip is arranged at the principal surface of the substrate such that the terminal electrode is electrically connected to the wiring in the inside region of the recessed portion of the substrate.
18. The electronic component according to claim 17 , further comprising a pillar electrode formed so as to penetrate the sealing resin and electrically connected to the wiring in the outside region of the recessed portion of the substrate, wherein
the external terminal is electrically connected to the wiring via the pillar electrode.
19. The electronic component according to claim 17 , wherein
the heat dissipation member includes a metallic material, and
the external terminal includes the same metallic material as the heat dissipation member.