Electronic device with multiple resin layers reducing suppression in reliability
The present disclosure provides an electronic device. The electronic device includes a first resin layer, having a first resin layer main surface and a first resin layer inner surface; a first conductor, having a first conductor main surface and a first conductor inner surface; a first wiring layer, formed adjacent to the first resin layer main surface and connected to the first conductor main surface; a first electronic component, electrically connected with the first wiring layer; a second resin layer, having a second resin layer main surface facing same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface; an external electrode; and a second conductor, penetrating the second resin layer, wherein the second conductor is disposed on a periphery of the first electronic component.
1. An electronic device, comprising:
a first resin layer having a first resin layer main surface and a first resin layer inner surface, the first resin layer main surface and the first resin layer inner surface face opposite sides in a first direction;
a first conductor having a first conductor main surface and a first conductor inner surface, the first conductor main surface and the first conductor inner surface face opposite sides in the first direction, and the first conductor penetrates the first resin layer in the first direction;
a first wiring layer formed adjacent to the first resin layer main surface and connected to the first conductor main surface;
a first electronic component having a first component main surface facing same side as the first resin layer main surface in the first direction and a first component inner surface facing same side as the first resin layer inner surface, and electrically connected with the first wiring layer;
a second resin layer having a second resin layer main surface facing same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface, and covering the first wiring layer and the first electronic component;
an external electrode disposed closer to a side where the first resin layer inner surface faces than the first resin layer, and electrically connected to the first conductor; and
a second conductor penetrating the second resin layer in the first direction, wherein
the second conductor is disposed on a periphery of the first electronic component when viewed in the first direction.
2. The electronic device of claim 1 , wherein a grinding mark is formed on the first resin layer main surface.
3. The electronic device of claim 2 , wherein the first conductor main surface dents relative to the first resin layer main surface.
4. The electronic device of claim 1 , further comprising:
a second wiring layer having a second wiring layer main surface and a second wiring layer inner surface,
the second wiring layer main surface and the second wiring layer inner surface facing opposite sides in the first direction, and
the second wiring layer inner surface being exposed from the first resin layer inner surface.
5. The electronic device of claim 4 , further comprising:
a second electronic component is different from the first electronic component, wherein
the second electronic component is electrically connected to the second wiring layer, and at least a part of the second electronic component is covered by the first resin layer.
6. The electronic device of claim 5 , wherein the second electronic component has a second component main surface facing same direction as the first component main surface, and the second component main surface and the first resin layer main surface are coplanar.
7. The electronic device of claim 1 , wherein the external electrode comprises a first conductor covering portion for covering the first conductor inner surface.
8. The electronic device of claim 4 , wherein the external electrode comprises a second wiring layer covering portion for covering a part of the second wiring layer inner surface.
9. The electronic device of claim 8 , further comprising:
a protective film covering a portion of the second wiring layer inner surface, the portion being exposed from the external electrode.
10. The electronic device of claim 8 , wherein the first conductor inner surface is in contact with the second wiring layer main surface.
11. The electronic device of claim 1 , further comprising:
a conductive connecting layer connecting the first electronic component with the first wiring layer, wherein
a part of the first wiring layer overlaps the first electronic component when viewed in the first direction, and wherein the conductive connecting layer lies between the first component inner surface and the first wiring layer.
12. The electronic device of claim 1 , wherein the second conductor is spaced apart from the first wiring layer when viewed in the first direction.
13. The electronic device of claim 12 , wherein the second conductor surrounds the first electronic component when viewed in the first direction.
14. The electronic device of claim 1 , wherein
the second conductor has a second conductor main surface facing a same direction as the second resin layer main surface in the first direction, and
the second conductor main surface is exposed from the second resin layer main surface.