Dielectric substrate and method of forming the same
The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
1. A dielectric substrate comprising:
a polyimide layer and a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and
a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, and wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns,
wherein a particle size distribution of the silica filler material of the first ceramic filler component comprises:
a D 10 of at least about 0.2 microns and not greater than about 1.6,
a D 50 of at least about 0.5 microns and not greater than about 2.7 microns, and
a D 90 of at least about 0.8 microns and not greater than about 4.7 microns.
2. The dielectric substrate of claim 1 , wherein the silica filler material of the first ceramic filler component comprises a particle size distribution span (PSDS) of not greater than about 8, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the silica filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.
3. The dielectric substrate of claim 1 , wherein the first filler material further comprises an average surface area of not greater than about 10 m 2 /g.
4. The dielectric substrate of claim 1 , wherein the first filler material comprises a silica-based compound.
5. The dielectric substrate of claim 1 , wherein the first resin matrix component comprises a perfluoropolymer.
6. The dielectric substrate of claim 1 , wherein the content of the first resin matrix component is at least about 45 vol. % and not greater than about 63 vol. % for a total volume of the first filled polymer layer.
7. The dielectric substrate of claim 1 , wherein the content of the first ceramic filler component is at least about 30 vol. % and not greater than about 57 vol. % for a total volume of the first filled polymer layer.
8. The dielectric substrate of claim 1 , wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the first ceramic filler component.
9. The dielectric substrate of claim 1 , wherein the first ceramic filler component further comprises a second filler material.
10. The dielectric substrate of claim 9 , wherein the second filler material of the first ceramic filler component comprises a high dielectric constant ceramic material.
11. The dielectric substrate of claim 1 , wherein the dielectric substrate further comprises a second filled polymer layer underlying the polyimide layer, wherein the second filled polymer layer comprises a second resin matrix component; and a second ceramic filler component, wherein the second ceramic filler component comprises a silica filler material, and wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns.
12. The dielectric substrate of claim 11 , wherein a particle size distribution of the silica filler material of the second ceramic filler component comprises:
a D 10 of at least about 0.2 microns and not greater than about 1.6,
a D 50 of at least about 0.5 microns and not greater than about 2.7 microns, and
a D 90 of at least about 0.8 microns and not greater than about 4.7 microns.
13. The dielectric substrate of claim 11 , wherein the first filler material further comprises an average surface area of not greater than about 10 m 2 /g.
14. The dielectric substrate of claim 11 , wherein the second filler material comprises a silica-based compound.
15. The dielectric substrate of claim 1 , wherein the dielectric substrate comprises a dissipation factor (5 GHz, 20% RH) of not greater than about 0.005.
16. A copper-clad laminate comprising a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
a polyimide layer and a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, and wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns.
17. The copper-clad laminate of claim 16 , wherein a particle size distribution of the silica filler material of the first ceramic filler component comprises:
a D 10 of at least about 0.2 microns and not greater than about 1.6,
a D 50 of at least about 0.5 microns and not greater than about 2.7 microns, and
a D 90 of at least about 0.8 microns and not greater than about 4.7 microns.
18. The copper-clad laminate of claim 16 , wherein the silica filler material of the first ceramic filler component comprises a particle size distribution span (PSDS) of not greater than about 8, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the silica filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.
19. A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
a polyimide layer and a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component; and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, and wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns.