Substrate for high-frequency printed wiring board
A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
1. A substrate for a high-frequency printed wiring board, the substrate comprising:
a dielectric layer including a fluororesin and an inorganic filler; and
a copper foil layered on at least one surface of the dielectric layer, wherein
a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm,
a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08, and
a softening temperature of the fluororesin is more than or equal to 250° C. and less than or equal to 310° C.
2. The substrate for a high-frequency printed wiring board according to claim 1 , wherein the fluororesin is a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polytetrafluoroethylene, or a combination of the tetrafluoroethylen e-hexafluoropropylene copolymer, the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, and the polytetrafluoroethylene.
3. The substrate for a high-frequency printed wiring board according to claim 2 , wherein the fluororesin is the tetrafluoroethylene-hexafluoropropylene copolymer.
4. The substrate for a high-frequency printed wiring board according to claim 1 , wherein a mass ratio of the inorganic filler to the fluororesin in the dielectric layer is more than or equal to 1.0.
5. The substrate for a high-frequency printed wiring board according to claim 1 , wherein the inorganic filler includes silica.
6. The substrate for a high-frequency printed wiring board according to claim 1 , wherein a linear expansion coefficient of the substrate in a thickness direction is less than or equal to 50 ppm/K.
7. The substrate for a high-frequency printed wiring board according to claim 1 , wherein a change of permittivity of the substrate by a temperature in a range of 25° C. to 120° C. is less than or equal to 2%.
8. A substrate for a high-frequency printed wiring board, the substrate comprising:
a dielectric layer including a fluororesin and an inorganic filler; and
a copper foil layered on at least one surface of the dielectric layer, wherein
a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and
in a cross section of the dielectric layer in a direction perpendicular to the copper foil, a ratio of a total cross sectional area of the inorganic filler to an overall cross sectional area in a region at a distance of more than or equal to 18 μm and less than or equal to 22 μm from the copper foil is 0.7 time or less as large as a ratio of a total cross sectional area of the inorganic filler to an overall cross sectional area in a region at a distance of more than or equal to 0 μm and less than or equal to 2 μm from the copper foil.