Semiconductor structure and manufacturing method thereof
The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a substrate; a bit line located on the substrate; and a support layer located on the substrate, wherein the support layer includes a first support segment and a second support segment, the first support segment and the second support segment are both connected to the bit line, and the bit line is located between the first support segment and the second support segment.
1. A semiconductor structure, comprising:
a substrate;
bit lines located on the substrate; and
a support layer located on the substrate, wherein an extension direction of the support layer which is parallel to the substrate is perpendicular to an extension direction of the bit lines which is parallel to the substrate, the support layer comprises a first support segment and a second support segment, the first support segment and the second support segment are both connected to an individual one of the bit lines, and the individual one of the bit lines is located between the first support segment and the second support segment, and the first support segment is located between and in direct connection with two adjacent bit lines, the second support segment is located between and in direct connection with two adjacent bit lines.
2. The semiconductor structure according to claim 1 , wherein the semiconductor structure further comprises:
a sidewall insulation layer, wherein the sidewall insulation layer covers sidewalls of the bit lines and sidewalls of the support layer.
3. The semiconductor structure according to claim 2 , wherein the sidewall insulation layer is formed after formation of the bit lines and the support layer.
4. The semiconductor structure according to claim 3 , wherein the sidewall insulation layer on the bit lines and on the support layer is of an integrated structure.
5. The semiconductor structure according to claim 2 , wherein a material of the support layer and a material of the sidewall insulation layer comprise silicon carbide or silicon nitride.
6. The semiconductor structure according to claim 1 , wherein
multiple bit lines are arranged at intervals along a direction perpendicular to an extension direction of the bit lines; and
the support layer further comprises a third support segment; the first support segment, the second support segment and the third support segment are all support segments, and each of the bit lines is located between two adjacent support segments.
7. The semiconductor structure according to claim 6 , wherein there are multiple support layers, and the multiple support layers are arranged at intervals along the extension direction of the bit lines.
8. The semiconductor structure according to claim 7 , wherein multiple containing spaces are formed between the multiple bit lines and the multiple support layers, and
the semiconductor structure further comprises:
multiple contact pads, wherein one of the multiple contact pads is located in one of the multiple containing spaces.
9. The semiconductor structure according to claim 8 , wherein each of the multiple containing spaces is a rectangular space.
10. The semiconductor structure according to claim 8 , wherein the semiconductor structure further comprises a sidewall insulation layer, and the sidewall insulation layer covers sidewalls of each of the multiple containing spaces.
11. The semiconductor structure according to claim 1 , wherein each of the bit lines is of a laminated structure; each of the bit lines comprises a bit line contact structure, a barrier layer, a conductive layer, and a covering layer; the bit line contact structure, the barrier layer, the conductive layer, and the covering layer are sequentially arranged from bottom to top.
12. A method of manufacturing a semiconductor structure, comprising:
providing a substrate;
forming an auxiliary layer on the substrate:
forming a trench on the auxiliary layer;
forming a sacrificial layer in the trench; and
forming openings on the auxiliary layer:
forming a support layer on the substrate, wherein the sacrificial layer is located between two adjacent openings and the support layer comprises a first support segment and a second support segment; and
forming a bit line on the substrate, wherein the bit line is formed between the first support segment and the second support segment, and both the first support segment and the second support segment are directly connected to the bit line.
13. The method of manufacturing the semiconductor structure according to claim 12 , wherein the sacrificial layer is removed, and at least a part of the bit line is formed in the trench.
14. The method of manufacturing the semiconductor structure according to claim 13 , wherein the auxiliary layer comprises a bit line contact layer and a dielectric layer, the bit line contact layer is formed on the substrate, the dielectric layer is formed on the bit line contact layer, the trench exposes the bit line contact layer, and the openings expose the substrate; and forming the bit line comprises:
forming a barrier layer in the trench;
forming a conductive layer in the trench, the conductive layer covering the barrier layer;
forming a covering layer in the trench, the covering layer covering the conductive layer; and
removing the dielectric layer, and removing the bit line contact layer on two sides of the support layer, a remaining bit line contact layer being used as a bit line contact structure;
wherein the bit line contact structure, the barrier layer, the conductive layer, and the covering layer are used as the bit line.
15. The method of manufacturing the semiconductor structure according to claim 12 , wherein at least one of the trench and the openings are formed by self-aligned double patterning.
16. The method of manufacturing the semiconductor structure according to claim 12 , further comprising:
forming a sidewall insulation layer on the substrate, the sidewall insulation layer covering sidewalls of the bit line and sidewalls of the support layer.
17. The method of manufacturing the semiconductor structure according to claim 16 , wherein the sidewall insulation layer is formed after formation of the bit line and the support layer.
18. The method of manufacturing the semiconductor structure according to claim 16 , further comprising:
forming contact pads within the sidewall insulation layer.