Self-aligned backside contact integration for transistors
Provided is a semiconductor device. The semiconductor device comprises a transistor comprising a plurality of source/drain epitaxies. The semiconductor device further comprises at least one backside power rail under the transistor. The semiconductor device further comprises a backside inter-layer dielectric (ILD) located between the plurality of source/drain epitaxies and the at least one power rail. The semiconductor device further comprises a first backside contact connecting a first source/drain epitaxy to the at least one backside power rail. The semiconductor device further comprises one or more contact placeholders formed under the other source/drain epitaxies.
1. A semiconductor device comprising:
a transistor comprising a plurality of source/drain epitaxies; and
at least one backside power rail under the transistor;
a backside inter-layer dielectric (ILD) located between the plurality of source/drain epitaxies and the at least one power rail;
a first backside contact connecting a first source/drain epitaxy to the at least one backside power rail;
one or more contact placeholders formed under the other source/drain epitaxies; and
a backside power distribution network (BSPDN) connected to the at least one backside power rail opposite the transistor.
2. The semiconductor device of claim 1 , wherein the semiconductor device comprises a transistor region and a secondary device region, the transistor region comprising the transistor.
3. The semiconductor device of claim 2 , wherein the secondary device region includes one or more other devices selected from the group consisting of an ESD diode, a BJT, and a passive device.
4. The semiconductor device of claim 2 , further comprising a Si substrate under the one or more other devices in the secondary device region.
5. The semiconductor device of claim 2 , wherein the transistor region further comprises one or more additional transistors.
6. The semiconductor device of claim 5 , wherein a pair of transistors in the transistor region are connected to create complementary metal-oxide semiconductor (CMOS) cells, the pair of transistors comprising an n-type transistor and a p-type transistor.
7. The semiconductor device of claim 6 , wherein the pair of transistors form a complementary field-effect transistor (CFET).
8. The semiconductor device of claim 1 , wherein the first backside contact has a two-staged shape, wherein the first backside contact has a larger top critical dimensions (CD) and smaller bottom CD.
9. The semiconductor device of claim 1 , wherein each source/drain epitaxy of the plurality of source/drain is either connected to a backside power rail through a backside contact or is connected to a contact placeholder.
10. The semiconductor device of claim 1 , further comprising:
a bottom dielectric isolation layer between the backside ILD and a gate stack of the transistor.
11. The semiconductor device of claim 1 , wherein the transistor is a nanosheet transistor.
12. A nanosheet transistor comprising:
a plurality of source/drain epitaxies;
a backside ILD under the plurality of source/drain epitaxies;
a first contact connecting a first source/drain epitaxy to a backside power rail, the first contact extending through the backside ILD; and
an epitaxy placeholder in contact with a second source/drain epitaxy, the epitaxy placeholder being disposed between the second source/drain epitaxy and the backside ILD.
13. The nanosheet transistor of claim 12 , further comprising:
a frontside ILD above the plurality of source/drain epitaxies, the frontside ILD being disposed between the plurality of source/drain epitaxies and a back-end-of-line (BEOL) portion of a semiconductor device.
14. The nanosheet transistor of claim 13 , further comprising:
one or more BEOL contacts, each of the one or more BEOL contacts connecting a source/drain epitaxy of the plurality of source/drain epitaxies to the BEOL.
15. The nanosheet transistor of claim 14 , wherein the one or more BEOL contacts include a first BEOL contact that connects the second source/drain epitaxy to the BEOL.
16. A semiconductor device comprising:
a backside power distribution network (BSPDN);
one or more backside power rails connected to the BSPDN;
a backside ILD above the one or more backside power rails and opposite the BSPDN; and
one or more nanosheet transistors, each nanosheet transistor comprising:
at least one backside contact that connects a first source/drain epitaxy of the respective nanosheet transistor to a backside power rail, the backside contact extending from the source/drain epitaxy through the backside ILD; and
at least one placeholder contact connected to a second source/drain epitaxy.
17. The semiconductor device of claim 16 , further comprising:
a BEOL section connected to the one or more nanosheet transistors opposite the backside ILD, wherein each nanosheet transistor further comprises one or more BEOL contacts, each of the BEOL contacts connecting a source/drain epitaxy of the respective transistor to the BEOL section.