Vibration removal apparatus and method for dual-microphone earphones
The present disclosure provides a microphone apparatus. The microphone apparatus may include a microphone and a vibration sensor. The microphone may be configured to receive a first signal including a voice signal and a first vibration signal. The vibration sensor may be configured to receive a second vibration signal. And the microphone and the vibration sensor are configured such that the first vibration signal may be offset with the second vibration signal.
1. A microphone apparatus, comprising a microphone and a vibration sensor, wherein
the microphone is configured to receive a first signal including a voice signal and a first vibration signal;
the vibration sensor is configured to receive a second vibration signal, the first vibration signal and the second vibration signal originating from a vibration of vibration source;
a cavity volume of the vibration sensor is larger than a cavity volume of the microphone; and
the microphone and the vibration sensor are located at adjacent positions or at symmetrical positions with respect to the vibration source.
2. The microphone apparatus of claim 1 , wherein the microphone, the vibration sensor, and at least a portion of the vibration source are located in a housing.
3. The microphone apparatus of claim 2 , wherein a connection between the microphone and the housing or a connection between the vibration sensor and the housing includes a cantilever connection, a peripheral connection, or a substrate connection.
4. The microphone apparatus of claim 3 , wherein the vibration sensor and the microphone are connected in the housing in a same manner.
5. The microphone apparatus of claim 4 , wherein a dispensing position of the vibration sensor is the same as or close to a dispensing position of the microphone.
6. The microphone apparatus of claim 1 , wherein
an amplitude-frequency response of the vibration sensor to the second vibration signal is the same as an amplitude-frequency response of the microphone to the first vibration signal, and/or a phase-frequency response of the vibration sensor to the second vibration signal is the same as a phase-frequency response of the microphone to the first vibration signal.
7. The microphone apparatus of claim 1 , wherein the cavity volume of the vibration sensor is proportional to a cavity volume of the microphone.
8. The microphone apparatus of claim 1 , wherein a ratio of the cavity volume of the vibration sensor to the cavity volume of the microphone is in a range of 3:1 to 6.5:1.
9. The microphone apparatus of claim 1 , further comprising a signal processing unit configured to make the first vibration signal offset with the second vibration signal and output the voice signal.
10. The microphone apparatus of claim 1 , wherein the vibration sensor is a closed microphone or a dual-link microphone.
11. The microphone apparatus of claim 10 , wherein the closed microphone has a closed front cavity and a closed back cavity.
12. The microphone apparatus of claim 10 , wherein the dual-link microphone has an open front cavity and an open back cavity.
13. The microphone apparatus of claim 1 , wherein the microphone is a front cavity opening earphone or a back cavity opening earphone.
14. The microphone apparatus of claim 13 , wherein the front cavity opening earphone includes at least one opening on a top or a side wall of a front cavity.
15. The microphone apparatus of claim 1 , wherein the microphone and the vibration sensor are both micro-electromechanical system microphones.
16. An earphone system, comprising:
a speaker, a microphone, a vibration sensor, and a housing, the speaker, the microphone, and the vibration sensor being located in the housing, wherein
the microphone is configured to receive a first signal including a voice signal and a first vibration signal;
the vibration sensor is configured to receive a second vibration signal, and the first vibration signal and the second vibration signal originating from a vibration of the speaker;
a cavity volume of the vibration sensor is larger than a cavity volume of the microphone; and
the microphone and the vibration sensor are located at adjacent positions on the housing or at symmetrical positions on the housing with respect to the speaker.
17. The earphone system of claim 16 , wherein a connection between the microphone and the housing or a connection between the vibration sensor and the housing includes a cantilever connection, a peripheral connection, or a substrate connection.
18. The earphone system of claim 17 , wherein the vibration sensor and the microphone are connected in the housing in a same manner.
19. The earphone system of claim 18 , wherein a dispensing position of the vibration sensor is the same as or close to a dispensing position of the microphone.
20. The earphone system of claim 16 , wherein
an amplitude-frequency response of the vibration sensor to the second vibration signal is the same as an amplitude-frequency response of the microphone to the first vibration signal, and/or a phase-frequency response of the vibration sensor to the second vibration signal is the same as a phase-frequency response of the microphone to the first vibration signal.