Microcalorimeter radiation detector absorbers and methods of making the same
A microcalorimeter radiation detector that includes a tin absorber having orientations of (420) and (311) with grain sizes greater than 100 nm. Tin absorber blanks were electroplated on a sacrificial substrate changing chemistry makeup, current density, and time to realize pure tin deposition of the desired characteristics.
1 . A photon absorber material, comprising:
a tin material having a controlled preferred crystalline orientation and grain size formed through electroplating.
2 . The photon absorber material of claim 1 , wherein the preferred crystalline orientation is selected from the group consisting essentially of (420) and (311).
3 . The photon absorber material of claim 1 , wherein the grain size is greater than 100 nm.
4 . A microcalorimeter radiation detector, comprising:
an absorber material consisting essentially of a tin material having a controlled preferred crystalline orientation and grain size formed through electroplating; and
a sensor to which the absorber material is bonded.
5 . The detector of claim 4 , wherein the preferred crystalline orientation is selected from the group consisting essentially of (420) and (311).
6 . The detector of claim 4 , wherein the grain size is greater than 100 nm.
7 . The detector of claim 4 , further comprising:
posts and epoxy bonding the absorber material to the sensor.
8 . A method of making an absorber, comprising:
electroplating tin onto a sacrificial substrate;
wherein the electroplating is performed using a selected duty cycle to form a tin material having a preferred orientation selected from the group consisting of (420) and (311) and a preferred grain size.
9 . The method of claim 8 , wherein the selected duty cycle is between 80% and 90%.
10 . The method of claim 8 , wherein current for the electroplating is between 20 mA/cm 2 and 80 mA/cm 2 .
11 . The method of claim 8 , wherein current for the electroplating is between 40 mA/cm 2 and 80 mA/cm 2 .
12 . The method of claim 8 , wherein the sacrificial substrate is ultraviolet tape.
13 . The method of claim 8 , wherein the tin is plated at a thickness of between 50 and 750 microns.
14 . The method of claim 8 , further comprising:
seeding the sacrificial substrate with a metal selected from the group consisting essentially of titanium and gold.
15 . The method of claim 8 , wherein the preferred grain size is greater than 100 nm.
16 . A method of making a microcalorimeter radiation detector comprising:
electroplating tin at a selected current and duty cycle to produce an absorber having a preferred orientation selected from the group consisting essentially of (420) and (311) and a preferred grain size; and
bonding the absorber to a sensor.
17 . The method of claim 16 , wherein the selected duty cycle is between 80% and 90%.
18 . The method of claim 16 , wherein the selected current for the electroplating is between 20 mA/cm 2 and 80 mA/cm 2 .
19 . The method of claim 16 , wherein the tin is electroplated onto sacrificial substrate is ultraviolet tape.
20 . The method of claim 16 , wherein the tin is plated at a thickness of between 50 and 750 microns.
21 . The method of claim 16 , further comprising:
seeding the sacrificial substrate with a metal selected from the group consisting essentially of titanium and gold.
22 . The method of claim 16 , wherein the preferred grain size is greater than 100 nm.
23 . The method of claim 16 , wherein the absorber is bonded to the sensor by posts and epoxy.