Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium

1. An electroplating bath comprising:

an amount of a germanium-containing compound in an aqueous solution;

an amount of water;

an amount of a complexing agent; and

an amount of a water-soluble tin-containing compound,

wherein the amount of germanium-containing compound and the amount of the water-soluble tin-containing compound is sufficient to form a uniform and co-deposited electroplated coating comprising about 1 to about 2 weight percent germanium and about 95 to about 99.5 weight percent tin, and

wherein the electroplated coating is co-deposited onto a substrate surface to an as plated thickness of from about 1 to about 50 microns and wherein the electroplated coating comprises an as plated average surface roughness (Ra) of about 117 nm and an as plated average grain size of about 2.33 microns.

2. The electroplating bath of claim 1 , wherein the germanium-containing compound is germanium dioxide (GeO 2 ) solubilized in a basic solution.

3. The electroplating bath of claim 1 , wherein the complexing agent is d,l-tartaric acid.

4. The electroplating bath of claim 1 , further comprising an amount of surfactant/leveling agent.

5. The electroplating bath of claim 1 , wherein the water soluble tin-containing compound is tin (II) sulfate.

6. The electroplating bath of claim 2 , wherein the amount of the germanium-containing compound is 0.1479 g of germanium dioxide.

7. The electroplating bath of claim 5 , wherein the amount water-soluble tin-containing compound comprises 0.340 g of tin (II) sulfate.

8. The electroplating bath of claim 3 , wherein the amount of the complexing agent is 0.3919 g of d,l-tartaric acid.

9. The electroplating bath of claim 1 , wherein the complexing agent is one of citric acid, succinic acid, aspartic acid, EDTA, mannitol, or an organic compound with carboxylic acid groups.

10. The electroplating bath of claim 1 , wherein the aqueous solution comprises a sodium hydroxide solution.

11. The electroplating bath of claim 1 , wherein a temperature of the electroplating bath is 18° C.

12. The electroplating bath of claim 1 , wherein a pH of the electroplating bath is 2.28.

13. The electroplating bath of claim 4 , wherein the surfactant comprises 0.0618 g of the surfactant in 20 ml of deionized water.

14. An electroplated coating for mitigating tin whisker growth on a substrate surface comprising:

a co-deposited amount of from about 1 to about 2 weight percent germanium and an amount of from about 95 to about 99.5 weight percent tin, wherein the germanium and tin comprise a uniform coating on the substrate and are co-deposited onto the substrate surface to an as plated thickness of from about 1 to about 50 microns and wherein the electroplated coating comprises an as plated average surface roughness (Ra) of about 117 nm and an as plated average grain size of about 2.33 microns.

15. The electroplated coating of claim 14 , wherein the germanium and tin are co-deposited onto the substrate surface to an as plated thickness of from about 1 to about 10 microns.

16. The electroplated coating of claim 14 , wherein the electroplated coating comprises no whisker growth after 6 months of exposure to a temperature of at least a 50° C. and a relative humidity of at least 50%.

17. The electroplated coating of claim 14 , wherein the electroplated coating comprises no whisker growth after 12 months of exposure to a temperature of at least a 50° C. and a relative humidity of at least 50%.

18. The electroplated coating of claim 14 , wherein the substrate comprises copper.

19. The electroplated coating of claim 14 , wherein the electroplated coating comprises 1.1 weight percent germanium.

20. The electroplated coating of claim 15 , wherein the germanium and tin are co-deposited onto the substrate surface to an as plated thickness of from about 2 to about 4 microns.