IP Library Granted Patent US 12,246,484
Granted Patent B2
US 12,246,484 · App. 17/680,955 · Granted Mar 11, 2025

Break-wire conductor manufacturing methods

Inventors: Maxime Lapalme (St-Lin-Laurentides, CA); Nicola Pedneault Plourde (Saint-Jérôme, CA); Jocelyn Lirette (Mirabel, CA)
Assignee: Textron Innovations Inc.
B29C64/118B33Y10/00B33Y80/00H01B13/0036B29L2031/34
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,246,484
App. No.
17/680,955
Granted
Mar 11, 2025
Kind
B2
Abstract

A method of producing an article of manufacture includes printing a break-wire conductive-material pattern via an additive-manufacturing process and applying the break-wire conductive-material pattern to a surface of a component. A shape of the break-wire conductive-material pattern fits the surface of the component.

Claims (26)

1. A method of producing an article of manufacture, the method comprising in a sequential order of steps:

three dimensional (3D) printing a break-wire conductive-material pattern on a dissolvable support material;

dissolving the dissolvable support material on which the break-wire conductive-material pattern has been 3D printed to form the break-wire conductive-material pattern;

applying a non-conductive barrier layer to a component; and

applying the break-wire conductive-material pattern directly onto the non-conductive barrier layer on a surface of the component, thereby forming the article of manufacture;

wherein a shape of the break-wire conductive-material pattern fits the surface of the component.

2. The method of claim 1 , wherein the component is composed of a non-conductive material.

3. The method of claim 2 , wherein the component comprises non-conductive plastic.

4. The method of claim 1 , wherein the component is composed of a conductive material and the surface comprises the non-conductive barrier layer.

5. The method of claim 1 , further comprising:

3D printing a second break-wire conductive-material pattern and dissolving a support material on which the second break-wire conductive-material pattern has been printed;

applying the second break-wire conductive-material pattern to other surface portions of the component; and

wherein the break-wire conductive-material pattern and the second break-wire conductive-material pattern do not overlap one another.

6. The method of claim 1 , further comprising, before the applying the break-wire conductive-material pattern to the surface of the component, printing the component via an additive-manufacturing process.

7. A method of producing an article of manufacture, the method comprising in a sequential order of steps:

three dimensional (3D) printing a break-wire conductive-material pattern on a dissolvable support material;

dissolving the dissolvable support material on which the break-wire conductive-material pattern has been 3D printed to form the break-wire conductive-material pattern;

applying the break-wire conductive-material pattern to a surface of a component, thereby forming the article of manufacture;

3D printing a second break-wire conductive-material pattern on a dissolvable support material;

dissolving the dissolvable support material on which the second break-wire conductive-material pattern has been printed; and

applying the second break-wire conductive-material pattern to other surface portions of the component;

wherein the break-wire conductive-material pattern and the second break-wire conductive-material pattern do not overlap one another.

8. The method of claim 7 , wherein a shape of the break-wire conductive-material pattern fits the surface of the component.

9. The method of claim 7 , wherein a shape of the second break-wire conductive-material pattern fits the other surface portions of the component.

10. The method of claim 7 , wherein the component is composed of a non-conductive material.

11. The method of claim 10 , wherein the component comprises non-conductive plastic.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: BELL TEXTRON INC.
To: BELL TEXTRON RHODE ISLAND INC.
Reel/Frame 059933/0784 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: BELL TEXTRON RHODE ISLAND INC.
To: TEXTRON INNOVATIONS INC.
Reel/Frame 059933/0926 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2022
From: LAPALME, MAXIME; PEDNEAULT PLOURDE, NICOLA; LIRETTE, JOCELYN
To: BELL TEXTRON INC.
Reel/Frame 059130/0860 →
Continuity (1)
Related Publication 20230271378A1 · Aug 31, 2023
References Cited (21)
US 4955523A · Carlommagno · 1990 [cited by examiner]
US 20020135727A1 · Nakaminami et al. · 2002 [cited by applicant]
US 20030183676A1 · Greenwell · 2003 [cited by applicant]
US 20040189289A1 · Atherton · 2004 [cited by applicant]
US 20050212103A1 · Takata · 2005 [cited by applicant]
US 20090015249A1 · Buttle et al. · 2009 [cited by applicant]
US 20090174426A1 · Matoba et al. · 2009 [cited by applicant]
US 20090321774A1 · Ishi et al. · 2009 [cited by applicant]
US 20110086224A1 · Volpi · 2011 [cited by applicant]
US 20110187380A1 · Gerig · 2011 [cited by applicant]
US 20140110872A1 · Levy · 2014 [cited by examiner]
US 20190322047A1 · Riha · 2019 [cited by examiner]
US 20200391616A1 · Wilson · 2020 [cited by applicant]
US 20210190542A1 · Wilson et al. · 2021 [cited by applicant]
US 20210261019A1 · Wilson · 2021 [cited by applicant]
US 20210272438A1 · Askenmalm · 2021 [cited by applicant]
US 20230262886A1 · Greenspan · 2023 [cited by examiner]
US 20230271378A1 · Lapalme · 2023 [cited by examiner]
US 20240080991A1 · Cheng · 2024 [cited by examiner]
WO WO2019243217A1 · 2019 [cited by examiner]
Ultimaker, “Ultimaker PVA Explained—Water-soluble support material,” YouTube Video, Oct. 18, 2016, https://www.youtube.com/watch?v=0ENgGkPP94w&t=49s&ab_channel=UltiMaker, 2 pages. [cited by applicant]