Yoon et al. “Three-Dimensional Printed Poly(vinyl alcohol) Substrate with Controlled On-Demand Degradation for Transient Electronics”. ACSNano, Jun. 26, 2018 12(6):6006-6012 (Year: 2018).
[cited by examiner]
Wu, P et al. “Self-sintering liquid metal ink with LAPONITE® for flexible electronics”. J Mater. Chem. C. 2021, 9,3070-3080. (Year: 2021).
[cited by examiner]
Abdullah et al., “PVA, PVA Blends, and Their Nanocomposites for Biodegradable Packaging Application,” Polymer-Plastics Technology and Engineering, Apr. 5, 2017, 56(12):1307-1344.
[cited by applicant]
Afsar et al., “OmniFiber: Integrated Fluidic Fiber Actuators for Weaving Movement based Interactions into the ‘Fabric of Everyday Life’,” Proceedings of the 34th Annual ACM Symposium on User Interface Software and Techn…
[cited by applicant]
Amazon.com [online], “24K Genuine Edible Gold Leaf by Kingboom, 10 Sheets Gold Foil, Loose Leaf for Cake and Coffee, 3.15 inches per Sheet, 10 Sheets per Pack,” upon information and belief, available no later than May 1…
[cited by applicant]
Amazon.com [online], “Howemon White Beeswax Pellets 2LB 100% Pure and Natural Triple Filtered for Skin, Face, Body and Hair Care DIY Creams, Lotions, Lip Balm and Soap Making Supplies,” upon information and belief, avai…
[cited by applicant]
Amazon.com [online], “Hydrographics Film—Blank Water Transfer Printing Film—12 Pcs A4 Size Blank Water Transfer Printing Film—Blank Water Transfer Film,” upon information and belief, available no later than May 11, 2023…
[cited by applicant]
An et al., “Thermorph: Democratizing 4D Printing of Self-Folding Materials and Interfaces,” Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems, Apr. 2018, 12 pages.
[cited by applicant]
Bettinger et al., “Organic Thin-Film Transistors Fabricated on Resorbable Biomaterial Substrates,” Advanced Materials, Feb. 2, 2010, 22(5):651-655.
[cited by applicant]
Blevis, “Sustainable interaction design: invention & disposal, renewal & reuse,” Proceedings of the SIGCHI Conference on Human Factors in Computing Systems, Apr. 2007, 503-512.
[cited by applicant]
Brynjarsdottir et al., “Sustainably unpersuaded: how persuasion narrows our vision of sustainability,” Proceedings of the SIGCHI Conference on Human Factors in Computing Systems, May 2012, 947-956.
[cited by applicant]
Cheng et al., “Duco: Autonomous Large-Scale Direct-Circuit-Writing (DCW) on Vertical Everyday Surfaces Using a Scalable Hanging Plotter,” Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologi…
[cited by applicant]
Cheng et al., “Functional Destruction: utilizing sustainable materials' physical transiency for electronics applications,” Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems, Apr. 2023, 16 page…
[cited by applicant]
Cheng et al., “PITAS: Sensing and Actuating Embedded Robotic Sheet for Physical Information Communication,” Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems, Apr. 2022, 16 pages.
[cited by applicant]
Cheng et al., “Silver Tape: Inkjet-Printed Circuits Peeled-and-Transferred on Versatile Substrates,” Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies, Mar. 18, 2020, 4(1):6, 17 pages.
[cited by applicant]
DiSalvo et al., “Mapping the landscape of sustainable HCI,” Proceedings of the SIGCHI Conference on Human Factors in Computing Systems, Apr. 2010, 1975-1984.
[cited by applicant]
Fan et al., “Fractal design concepts for stretchable electronics,” Nature Communications, Feb. 7, 2014, 5:3266, 8 pages.
[cited by applicant]
FascoEpoxies.com [online], “Graphite Powder Filler,” available on or before Jul. 19, 2018 via Internet Archive: Wayback Machine URL<https://web.archive.org/web/20180719044935/https://fascoepoxies.com/Graphi te-Powder-Fi…
[cited by applicant]
Follmer et al., “inFORM: Dynamic Physical Affordances and Constraints through Shape and Object Actuation,” Proceedings of the 26th Annual ACM Symposium on User Interface Software and Technology, Oct. 2013, 417-426.
[cited by applicant]
Forman et al., “Modifiber: Two-way morphing soft thread actuators for tangible interaction,” Proceedings of the 2019 CHI Conference on Human Factors in Computing Systems, May 2019, 11 pages.
[cited by applicant]
Fu et al., “Transient electronics: materials and devices,” Chemistry of Materials, Apr. 28, 2016, 28(11):3527-3539.
[cited by applicant]
Groeger et al., “ObjectSkin: augmenting everyday objects with hydroprinted touch sensors and displays,” Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies, Jan. 8, 2018, 1(4):134, 23 pag…
[cited by applicant]
Gumus et al., “Expandable Polymer Enabled Wirelessly Destructible High-Performance Solid State Electronics,” Advanced Materials Technologies, May 2017, 2(5):1600264, 30 pages.
[cited by applicant]
Hanstveit, “Biodegradability of petroleum waxes and beeswax in an adapted CO2 evolution test,” Chemosphere, Aug. 1992, 25(4):605-620.
[cited by applicant]
Herrojo et al., “Chipless-RFID: A review and recent developments,” Sensors, Aug. 2019, 19(15):3385, 20 pages.
[cited by applicant]
Hwang et al., “A physically transient form of silicon electronics,” Science, Sep. 28, 2012, 337(6102):1640-1644.
[cited by applicant]
Hwang et al., “Biodegradable elastomers and silicon nanomembranes/nanoribbons for stretchable, transient electronics, and biosensors,” Nano Letters, Feb. 23, 2015, 15(5):2801-2808.
[cited by applicant]
Hwang et al., “High-performance biodegradable/transient electronics on biodegradable polymers,” Advanced Materials, Jun. 18, 2014, 26(23):3905-3911.
[cited by applicant]
Hwang et al., “Materials and fabrication processes for transient and bioresorbable high-performance electronics,” Advanced Functional Materials, Sep. 2013, 23(33):4087-4093.
[cited by applicant]
Jamshidi et al., “Transient Electronics as Sustainable Systems: From Fundamentals to Applications,” Advanced Sustainable Systems, Feb. 2022, 6(2):2100057, 13 pages.
[cited by applicant]
Jin et al., “Solution-processed single-walled carbon nanotube field effect transistors and bootstrapped inverters for disintegratable, transient electronics,” Applied Physics Letters, Jul. 8, 2014, 105(1):013506, 4 page…
[cited by applicant]
Kaimoto et al., “ExpandFab: Fabricating Objects Expanding and Changing Shape with Heat,” Proceedings of the Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, Feb. 2020, 153-164.
[cited by applicant]
Kang et al., “Dissolution Chemistry and Biocompatibility of Silicon- and Germanium-Based Semiconductors for Transient Electronics,” ACS Applied Materials & Interfaces, Apr. 13, 2015, 7(17):9297-9305.
[cited by applicant]
Kao et al., “DuoSkin: rapidly prototyping on-skin user interfaces using skin-friendly materials,” Proceedings of the 2016 ACM International Symposium on Wearable Computers, Sep. 2016, 16-23.
[cited by applicant]
Kawahara et al., “Instant inkjet circuits: lab-based inkjet printing to support rapid prototyping of UbiComp devices,” Proceedings of the 2013 ACM International Joint Conference on Pervasive and Ubiquitous Computing, Se…
[cited by applicant]
Khan et al., “Soft Inkjet Circuits: Rapid Multi-Material Fabrication of Soft Circuits using a Commodity Inkjet Printer,” Proceedings of the 32nd Annual ACM Symposium on User Interface Software and Technology, Oct. 2019,…
[cited by applicant]
Kim et al., “Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics,” Nature Materials, Apr. 18, 2010, 9(6):511-517.
[cited by applicant]
Laput et al., “Synthetic Sensors: Towards General-Purpose Sensing,” Proceedings of the 2017 CHI Conference on Human Factors in Computing Systems, May 2017, 3986-3999.
[cited by applicant]
LaserPecker.net [online], “L1 Pro Super: The Most Compact & Safe & Easy to use Laser Engraver with auto-stand and big cases,” available on or before Aug. 8, 2022 via Internet Archive: Wayback Machine URL<https://web.arc…
[cited by applicant]
Luo et al., “Digital Fabrication of Pneumatic Actuators with Integrated Sensing by Machine Knitting,” Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems, Apr. 2022, 13 pages.
[cited by applicant]
Maheshwari et al., “Designing Tools and Interfaces for Ecological Restoration: An Investigation into the Opportunities and Constraints for Technological Interventions,” Proceedings of the 2022 CHI Conference on Human Fa…
[cited by applicant]
Mankoff et al., “Environmental sustainability and interaction,” CHI '07 Extended Abstracts on Human Factors in Computing Systems, Apr. 2007, 2121-2124.
[cited by applicant]
MPM.co.jp [online], “Silver Nano,” available on or before Jun. 20, 2022 via Internet Archive: Wayback Machine URL<https://web.archive.org/web/20220620100309/https://www.mpm.co.jp/electronic/eng/silver-nano/index.html>, …
[cited by applicant]
Murer et al., “Un-Crafting: Exploring Tangible Practices for Deconstruction in Interactive System Design,” Proceedings of the Ninth International Conference on Tangible, Embedded, and Embodied Interaction, Jan. 2015, 46…
[cited by applicant]
Muthukumarana et al., “ClothTiles: A Prototyping Platform to Fabricate Customized Actuators on Clothing using 3D Printing and Shape-Memory Alloys,” Proceedings of the 2021 CHI Conference on Human Factors in Computing Sy…
[cited by applicant]
Narumi et al., “Self-healing UI: Mechanically and Electrically Self-healing Materials for Sensing and Actuation Interfaces,” Proceedings of the 32nd Annual ACM Symposium on User Interface Software and Technology, Oct. 2…
[cited by applicant]
Nisser et al., “Sequential Support: 3D Printing Dissolvable Support Material for Time-Dependent Mechanisms,” Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction, May 20…
[cited by applicant]
Pietsch et al., “Biodegradable inkjet-printed electrochromic display for sustainable short-lifecycle electronics,” Journal of Materials Chemistry C, Nov. 4, 2020, 8(47):16716-16724.
[cited by applicant]
QuickDams.com [online], “Quick Dam Flood Control Solutions,” available on or before May 16, 2013 via Internet Archive: Wayback Machine URL<https://web.archive.org/web/20130516115747/http://www.quickdams.com/>, retrieved…
[cited by applicant]
Rance et al., “Toward RCS Magnitude Level Coding for Chipless RFID,” IEEE Transactions on Microwave Theory and Techniques, Jul. 2016, 64(7):2315-2325.
[cited by applicant]
Rautela et al., “E-waste management and its effects on the environment and human health,” Science of the Total Environment, Jun. 15, 2021, 773:145623, 16 pages.
[cited by applicant]
Remya et al., “Role of Nanoparticles in Biodegradation and Their Importance in Environmental and Biomedical Applications,” Journal of Nanomaterials, Jan. 28, 2022, 2022:6090846, 15 pages.
[cited by applicant]
Sabie et al., “Unmaking@CHI: Concretizing the Material and Epistemological Practices of Unmaking in HCI,” Extended Abstracts of the 2022 CHI Conference on Human Factors in Computing Systems, Apr. 2022, 6 pages.
[cited by applicant]
Segawa et al., “Rapid Prototyping of Paper Electronics Using a Metal Leaf and Laser Printer,” Adjunct Proceedings of the 32nd Annual ACM Symposium on User Interface Software and Technology, Oct. 2019, 99-101.
[cited by applicant]
Shim et al., “Physically transient electronic materials and devices,” Materials Science and Engineering: R: Reports, Jul. 2021, 145:100624, 41 pages.
[cited by applicant]
Song et al., “Towards Decomposable Interactive Systems: Design of a Backyard- Degradable Wireless Heating Interface,” Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems, Apr. 2022, 12 pages.
[cited by applicant]
Song et al., “Unmaking: Enabling and Celebrating the Creative Material of Failure, Destruction, Decay, and Deformation,” Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems, May 2021, 12 pages.
[cited by applicant]
Swaminathan et al., “OptiStructures: Fabrication of Room-Scale Interactive Structures with Embedded Fiber Bragg Grating Optical Sensors and Displays,” Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquito…
[cited by applicant]
Vasquez et al., “Introducing the Sustainable Prototyping Life Cycle for Digital Fabrication to Designers,” Proceedings of the 2020 ACM Designing Interactive Systems Conference, Jul. 2020, 1301-1312.
[cited by applicant]
Vasquez et al., “The Environmental Impact of Physical Prototyping: a Five-Year CHI Review,” Proceedings of the Self-Sustainable CHI Workshop, Apr. 2020, 8 pages.
[cited by applicant]
Vena et al., “Chipless RFID Tag Using Hybrid Coding Technique,” IEEE Transactions on Microwave Theory and Techniques, Dec. 2011, 59(12):3356-3364.
[cited by applicant]
Wang et al., “Printed Paper Actuator: A Low-cost Reversible Actuation and Sensing Method for Shape Changing Interfaces,” Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems, Apr. 2018, 12 pages.
[cited by applicant]
Want, “An Introduction to RFID Technology,” IEEE Pervasive Computing, Jan. 2006, 5(1):25-33.
[cited by applicant]
Won et al., “Natural Wax for Transient Electronics,” Advanced Functional Materials, Aug. 8, 2018, 28(32):1801819, 10 pages.
[cited by applicant]
Wu et al., “Edible and Nutritive Electronics: Materials, Fabrications, Components, and Applications,” Advanced Materials Technologies, Oct. 2020, 5(10):2000100, 28 pages.
[cited by applicant]
Wu et al., “Unfabricate: Designing Smart Textiles for Disassembly,” Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems, Apr. 2020, 14 pages.
[cited by applicant]
Xu et al., “Food-Based Edible and Nutritive Electronics,” Advanced Materials Technologies, Nov. 2017, 2(11):1700181, 7 pages.
[cited by applicant]
Yao et al., “PneUI: Pneumatically Actuated Soft Composite Materials for Shape Changing Interfaces,” Proceedings of the 26th Annual ACM Symposium on User Interface Software and Technology, Oct. 2013, 13-22.
[cited by applicant]
Yin et al., “Dissolvable Metals for Transient Electronics,” Advanced Functional Materials, Feb. 5, 2014, 24(5):645-658.
[cited by applicant]
Yoon et al., “A Three-Dimensional Printed Poly(vinyl alcohol) Substrate with Controlled On-Demand Degradation for Transient Electronics,” ACS Nano, Jun. 26, 2018, 12(6):6006-6012.
[cited by applicant]
Yoon et al., “A Three-Dimensional Printed Poly(vinyl alcohol) Substrate with Controlled On-Demand Degradation for Transient Electronics,” ACS Nano, Jun. 26, 2018, 12(6):6006-6012 (Supporting Information, 9 pages).
[cited by applicant]
Zeng et al., “Progress and Challenge for Magnesium Alloys as Biomaterials,” Advanced Engineering Materials, Jul. 14, 2008, 10(8):B3-B14.
[cited by applicant]
Zhang et al., “Electrically conductive carbon nanofiber/paraffin wax composites for electric thermal storage,” Energy Conversion and Management, Dec. 2012, 64:62-67.
[cited by applicant]