Optical apparatus and methods and computer program products useful for manufacturing same

1. A method for manufacturing optical apparatus, the method comprising:

pre-preparing MEMS chips, without any QWP coating, including manufacturing a stock of optical MEMS elements, and

subsequently, according to customers' needs, adding QWP coatings to the MEMS chips as pre-prepared, wherein said adding includes, for at least first and second orders O1 and O2 respectively, from among a stream of orders, each order requiring a specific number of devices having a given number G of optical elements and having specific requirements in terms of active optical coatings required:

selecting G1 diced optical mems elements E1, from the stock, each of which include N1 optical elements where N1 is the number of optical elements required by order O1;

depositing active optical coatings that achieve requirements of said order O1, atop each of the diced optical MEMS elements E1 selected from the stock for order O1, thereby to fill order O1;

selecting G2 diced optical mems elements E2, from the stock, each of which include N2 optical elements where N2 is the number of optical elements required by order O2; and

depositing active optical coatings that achieve requirements of said order O2, atop each of the diced optical mems elements E2 selected from the stock for order O2, thereby to fill order O2,

wherein at least one active optical coating comprises a QWP coating,

wherein a hard mask is used to add QWP coating to the MEMS chips as pre-prepared,

wherein the hard mask is aligned to at least one MEMS element under a microscope, and

wherein at least one MEMS element is pushed, under a microscope, under the hard mask including performing microscopic-level alignment of the MEMS element with the hard mask.

2. The method according to claim 1 , wherein said hard mask is formed of metal.

3. The method according to claim 1 , wherein said hard mask is formed of silicon.

4. The method according to claim 1 , wherein the stock comprises a range of MEMS chips having different numbers of layers thereby to yield MEMS chips with different optical characteristics.

5. The method according to claim 4 , wherein the optical characteristics which differ between various MEMS chips in the range, includes reflectivity.

6. The method according to claim 4 , wherein the optical characteristics which differ between various MEMS chips in the range, includes polarity.

7. The method according to claim 1 , wherein the hard mask is used at die level, on singulated dies diced from wafers.

8. The method according to claim 1 , wherein the hard mask is used on wafers.

9. The method according to claim 1 , wherein at least one MEMS element is mounted on an Si carrier wafer and the hard mask is then placed on the MEMS element.

10. The method according to claim 9 , wherein the hard mask has an oxide-covered side which is brought into engagement with the MEMS element.

11. The method according to claim 1 , wherein at least one side of the hard mask is attached to a Si carrier wafer.

12. The method according to claim 11 , wherein Kapton tape is used to attach both sides of the hard mask to the carrier wafer.

13. Optical apparatus comprising:

a stock of optical MEMS elements, without any QWP coating, to which, subsequently, has been added, according to customers' needs, QWP coatings, the stock including:

diced optical mems elements E 1 selected from the stock, each of which elements E1 includes N1 optical elements where N1 is the number of optical elements required by an order O1, and active optical coatings that achieve requirements of said order O1, are deposited atop each of the diced optical MEMS elements E1 to fill order O1; and

diced optical mems elements E2 selected from the stock, each of which elements E2 includes N2 optical elements where N2 is the number of optical elements required by an order O2; and active optical coatings that achieve requirements of said order O2, are deposited atop each of the diced optical MEMS elements E2 to fill order O2,

wherein at least one of said active optical coatings comprises a QWP coating

wherein the optical apparatus also includes a hard mask used to add QWP coating to the MEMS chips as pre-prepared,

wherein the hard mask is aligned to at least one MEMS element under a microscope, and

wherein at least one MEMS element is pushed, under a microscope, under the hard mask including performing microscopic-level alignment of the MEMS element with the hard mask.

14. A method for manufacturing optical apparatus, the method comprising:

pre-preparing MEMS chips, without any QWP coating, including manufacturing a stock of optical MEMS elements, and subsequently, according to customers' needs, adding QWP coatings to the MEMS chips as pre-prepared, wherein said adding includes, for at least first and second orders O1 and O2 respectively, from among a stream of orders, each order requiring a specific number of devices having a given number G of optical elements and having specific requirements in terms of active optical coatings required:

selecting G1 diced optical mems elements E1, from the stock, each of which include N1 optical elements where N1 is the number of optical elements required by order O1;

depositing active optical coatings that achieve requirements of said order O1, atop each of the diced optical MEMS elements E1 selected from the stock for order O1, thereby to fill order O1;

selecting G2 diced optical mems elements E2, from the stock, each of which include N2 optical elements where N2 is the number of optical elements required by order O2; and

depositing active optical coatings that achieve requirements of said order O2, atop each of the diced optical mems elements E2 selected from the stock for order O2, thereby to fill order O2,

wherein at least one active optical coating comprises a QWP coating,

wherein a hard mask is used to add QWP coating to the MEMS chips as pre-prepared, and

wherein at least one MEMS element is mounted on an Si carrier wafer and the hard mask is then placed on the MEMS element.

15. The method according to claim 14 , wherein the optical characteristics which differ between various MEMS chips in the range, includes polarity.

16. A method for manufacturing optical apparatus, the method comprising:

pre-preparing MEMS chips, without any QWP coating, including manufacturing a stock of optical MEMS elements, and

subsequently, according to customers' needs, adding QWP coatings to the MEMS chips as pre-prepared, wherein said adding includes, for at least first and second orders O1 and O2 respectively, from among a stream of orders, each order requiring a specific number of devices having a given number G of optical elements and having specific requirements in terms of active optical coatings required:

selecting G1 diced optical mems elements E1, from the stock, each of which include N1 optical elements where N1 is the number of optical elements required by order O1;

depositing active optical coatings that achieve requirements of said order O1, atop each of the diced optical MEMS elements El selected from the stock for order O1, thereby to fill order O1;

selecting G2 diced optical mems elements E2, from the stock, each of which include N2 optical elements where N2 is the number of optical elements required by order O2; and

depositing active optical coatings that achieve requirements of said order O2, atop each of the diced optical mems elements E2 selected from the stock for order O2, thereby to fill order O2,

wherein at least one active optical coating comprises a QWP coating,

wherein a hard mask is used to add QWP coating to the MEMS chips as pre-prepared, and

wherein at least one side of the hard mask is attached to a Si carrier wafer.

17. The method according to claim 16 , wherein the optical characteristics which differ between various MEMS chips in the range, includes polarity.